A splicing device includes a first splicing unit and a second splicing unit. The first splicing unit includes a first substrate, a first light-emitting unit, and a second light-emitting unit. The second splicing unit includes a second substrate, a third light-emitting unit, and a fourth light-emitting unit. P is a pitch between the first light-emitting unit and the second light-emitting unit, and a pitch between the third light-emitting unit and the fourth light-emitting unit. LA1 is a horizontal distance from a center of the second light-emitting unit to a first reference plane. LB3 is a horizontal distance from a boundary between a light-emitting surface of the second splicing unit and a second reference plane to the first reference plane. LB1x and LB1y are respectively a horizontal component and a vertical component of a distance from the boundary to a center of the third light-emitting unit. LA2 is a vertical distance from the light-emitting surface of the first splicing unit to a bottom surface of the first substrate. LB2 is a vertical distance from the bottom surface of the first substrate to the boundary. The splicing device satisfies:

[00001]$\frac{\sqrt{{\left(\mathrm{LA}1+\mathrm{LB}3+\mathrm{LB}1x\right)}^2+{\left(\mathrm{LA}2+\mathrm{LB}2+\mathrm{LB}1y\right)}^2}}{P}\le 1.5.$

A splicing device includes a first splicing unit and a second splicing unit. The first splicing unit includes a first substrate, a first light-emitting unit, and a second light-emitting unit. The second splicing unit includes a second substrate, a third light-emitting unit, and a fourth light-emitting unit. P is a pitch between the first light-emitting unit and the second light-emitting unit, and a pitch between the third light-emitting unit and the fourth light-emitting unit. LA1 is a horizontal distance from a center of the second light-emitting unit to a first reference plane. LB3 is a horizontal distance from a boundary between a light-emitting surface of the second splicing unit and a second reference plane to the first reference plane. LB1x and LB1y are respectively a horizontal component and a vertical component of a distance from the boundary to a center of the third light-emitting unit. LA2 is a vertical distance from the light-emitting surface of the first splicing unit to a bottom surface of the first substrate. LB2 is a vertical distance from the bottom surface of the first substrate to the boundary. The splicing device satisfies:

[00001]$\frac{\sqrt{{\left(\mathrm{LA}1+\mathrm{LB}3+\mathrm{LB}1x\right)}^2+{\left(\mathrm{LA}2+\mathrm{LB}2+\mathrm{LB}1y\right)}^2}}{P}\le 1.5.$

The present disclosure provides an electronic device including a driving circuit substrate, a plurality of chips, and a passivation layer. The driving circuit substrate includes a plurality of active elements. The chips are disposed on the driving circuit substrate and electrically connected to the driving circuit substrate. The passivation layer covers the plurality of chips and the driving circuit substrate. The passivation layer has a first part on one of the plurality of chips and a second part on a part of the driving circuit substrate, the second part is not overlapped with the plurality of chips, and a first thickness of the first part is less than a second thickness of the second part. The first space between adjacent two of the plurality of chips is different from a second space between another adjacent two of the plurality of chips.

A light emitting diode pixel for a display including a first subpixel comprising a first LED sub-unit, a second subpixel comprising a second LED sub-unit, and a third subpixel comprising a third LED sub-unit, in which each of the first, second, and third LED sub-units includes a first type of semiconductor layer and a second type of semiconductor layer, and the first, second, and third LED sub-units are separated from each other in a first direction, disposed at different planes from each other, and do not overlap each other in the first direction.

A light emitting diode pixel for a display including a first subpixel comprising a first LED sub-unit, a second subpixel comprising a second LED sub-unit, and a third subpixel comprising a third LED sub-unit, in which each of the first, second, and third LED sub-units includes a first type of semiconductor layer and a second type of semiconductor layer, and the first, second, and third LED sub-units are separated from each other in a first direction, disposed at different planes from each other, and do not overlap each other in the first direction.

A light-emitting device includes: a substrate; n light-emitting elements (n being a natural number of 2 or more) mounted on the substrate, each comprising a first bonding member electrically connected to a first semiconductor layer, and a second bonding member electrically connected to a second semiconductor layer; and n+1 interconnects provided on the substrate, the n+1 interconnects comprising a first interconnect comprising a first external connection portion, a second interconnect comprising a second external connection portion, and a third interconnect comprising a third external connection portion. In a top-view, the first light-emitting element is located between a first side of the substrate and a second light-emitting element, and the second light-emitting element is located between a first light-emitting element and a second side.

A light-emitting device includes: a substrate; n light-emitting elements (n being a natural number of 2 or more) mounted on the substrate, each comprising a first bonding member electrically connected to a first semiconductor layer, and a second bonding member electrically connected to a second semiconductor layer; and n+1 interconnects provided on the substrate, the n+1 interconnects comprising a first interconnect comprising a first external connection portion, a second interconnect comprising a second external connection portion, and a third interconnect comprising a third external connection portion. In a top-view, the first light-emitting element is located between a first side of the substrate and a second light-emitting element, and the second light-emitting element is located between a first light-emitting element and a second side.

A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.

A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.

LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.