Disclosed is a display device. The display device includes a display panel; a frame positioned in a rearward direction of the display panel; a substrate which is positioned on the frame, and has a light source providing light; an inner frame which is coupled to the frame, and supports the display panel; an optical layer which is positioned between the display panel and the inner frame, and in contact with the inner frame; and a side reflector which is positioned between the optical layer and the frame, and coupled to the inner frame, wherein the side reflector includes: a base surface positioned adjacent to the substrate; an inclination surface which is positioned adjacent to a lower surface of the optical layer, and reflects the light provided from the light source to the optical layer; and a side surface which connects the base surface and the inclination surface, and reflects the light provided by the light source.

A light-emitting module includes: a lightguide plate having a main surface and including a plurality of unit regions including at least one first unit region and a plurality of second unit regions, the lightguide plate including a plurality of first recesses in the main surface; a plurality of light sources provided at the main surface, each of the light sources being located in the first recess so as to correspond to one of the unit regions; and a light-transmitting member provided in the first recess of each of the unit regions. In the second unit regions, an optical axis of the light sources is coincident with a center of the first recess. In the first unit region, the optical axis of the light source is offset from the center of the first recess, and an upper surface of the light-transmitting member has a first receding part.

A light-emitting module includes: a lightguide plate having a main surface and including a plurality of unit regions including at least one first unit region and a plurality of second unit regions, the lightguide plate including a plurality of first recesses in the main surface; a plurality of light sources provided at the main surface, each of the light sources being located in the first recess so as to correspond to one of the unit regions; and a light-transmitting member provided in the first recess of each of the unit regions. In the second unit regions, an optical axis of the light sources is coincident with a center of the first recess. In the first unit region, the optical axis of the light source is offset from the center of the first recess, and an upper surface of the light-transmitting member has a first receding part.

A wavelength conversion device includes an LED chip. A PCB solder mask defines an opening at least partially encompassing the LED chip. A lens is optically coupled with the LED chip and includes phosphor particles, emulsifier particles, and lens shaping particles each immersed within the lens. In various instances, the wavelength conversion device may be operably coupled with a vehicle to form various light effects.

A light emitting module includes: a substrate; a first light source mounted on the substrate, the first light source comprising a first light emitting element configured to emit first light, a light reflecting member surrounding lateral faces of the first light emitting element, and a first wavelength conversion member configured to convert a wavelength of a portion of the first light and to emit second light, such that the first light source is configured to output light that includes the first light and the second light, the first wavelength conversion member covering the first light emitting element and extending out from the lateral faces of the first light emitting element when viewed from above; and a first lens on which the light output from the first light source is incident.

A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.

A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.

The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.

The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting dies, a transparent material layer, a sealing material, and a second substrate. The plurality of light-emitting dies are disposed on the first substrate. The transparent material layer is disposed on the first substrate. The sealing material is disposed on the first substrate and surrounds the transparent material layer. The second substrate is adhered to the first substrate through the transparent material layer and the sealing material.

A display device includes a circuit board including a first circuit portion, a second circuit portion, and a third circuit portion, a first display panel on the first circuit portion, and configured to emit a first light, a second display panel on the second circuit portion, and configured to emit a second light, a third display panel on the third circuit portion, and configured to emit a third light, and an optical combiner configured to combine the first light, the second light, and the third light to output a light.