A 3-dimensional array of NOR memory strings being organized by planes of NOR memory strings, in which (i) the storage transistors in the NOR memory strings situated in a first group of planes are configured to be programmed, erased, program-inhibited or read in parallel, and (ii) the storage transistors in NOR memory strings situated within a second group of planes are configured for storing resource management data relating to data stored in the storage transistors of the NOR memory strings situated within the first group of planes, wherein the storage transistors in NOR memory strings in the second group of planes are configured into sets.

A 3-dimensional array of NOR memory strings being organized by planes of NOR memory strings, in which (i) the storage transistors in the NOR memory strings situated in a first group of planes are configured to be programmed, erased, program-inhibited or read in parallel, and (ii) the storage transistors in NOR memory strings situated within a second group of planes are configured for storing resource management data relating to data stored in the storage transistors of the NOR memory strings situated within the first group of planes, wherein the storage transistors in NOR memory strings in the second group of planes are configured into sets.

A selector device may include a first electrode, a tunneling layer, and a ferroelectric layer. The tunneling layer may be between the first electrode and the ferroelectric layer, and a thickness and dielectric constant of the tunneling layer relative to a thickness and dielectric constant of the ferroelectric layer may cause a depolarizing electric field induced in the first tunneling layer to be greater than or approximately equal to an electric field induced in an opposite direction by ferroelectric dipoles in the ferroelectric layer when a voltage is applied across the selector device. The device may also include a second electrode, and the ferroelectric layer may be between the tunneling layer and the second electrode. A seconding layer may also be added between the ferroelectric layer and the second electrode for bipolar selectors.

A selector device may include a first electrode, a tunneling layer, and a ferroelectric layer. The tunneling layer may be between the first electrode and the ferroelectric layer, and a thickness and dielectric constant of the tunneling layer relative to a thickness and dielectric constant of the ferroelectric layer may cause a depolarizing electric field induced in the first tunneling layer to be greater than or approximately equal to an electric field induced in an opposite direction by ferroelectric dipoles in the ferroelectric layer when a voltage is applied across the selector device. The device may also include a second electrode, and the ferroelectric layer may be between the tunneling layer and the second electrode. A seconding layer may also be added between the ferroelectric layer and the second electrode for bipolar selectors.

A semiconductor device is provided that includes a semiconductor substrate having a first main surface and a second main surface facing each other; a dielectric layer laminated on the first main surface of the semiconductor substrate; a first electrode layer laminated on the dielectric layer; and a protective layer covering at least an outer peripheral end of the dielectric layer and an outer peripheral end of the first electrode layer. Moreover, the protective layer is provided to expose an outer peripheral end on the first main surface of the semiconductor substrate. The semiconductor substrate includes a high-resistance region positioned at least directly under an outer peripheral end of the protective layer.

An apparatus includes a unipolar power transistor and an RC snubber. The RC snubber has a capacitor between a poly silicon structure and a semiconductor substrate. The capacitor has a p-n junction. The RC snubber has a resistor between a source of the unipolar power transistor and a first layer forming the capacitor. The unipolar transistor and the RC snubber are coupled in parallel. The RC snubber and the unipolar power transistor are formed monolithically on the semiconductor substrate.

An apparatus includes a unipolar power transistor and an RC snubber. The RC snubber has a capacitor between a poly silicon structure and a semiconductor substrate. The capacitor has a p-n junction. The RC snubber has a resistor between a source of the unipolar power transistor and a first layer forming the capacitor. The unipolar transistor and the RC snubber are coupled in parallel. The RC snubber and the unipolar power transistor are formed monolithically on the semiconductor substrate.

A selector device may include a first electrode, a tunneling layer, and a ferroelectric layer. The tunneling layer may be between the first electrode and the ferroelectric layer, and a thickness and dielectric constant of the tunneling layer relative to a thickness and dielectric constant of the ferroelectric layer may cause a depolarizing electric field induced in the first tunneling layer to be greater than or approximately equal to an electric field induced in an opposite direction by ferroelectric dipoles in the ferroelectric layer when a voltage is applied across the selector device. The device may also include a second electrode, and the ferroelectric layer may be between the tunneling layer and the second electrode. A second ing layer may also be added between the ferroelectric layer and the second electrode for bipolar selectors.

The present application discloses a semiconductor device with a programmable unit and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a bottom conductive layer positioned in the substrate, an insulation layer positioned on the substrate, a first conductive layer positioned on the insulation layer and above the bottom conductive layer, a second conductive layer positioned on the insulation layer and above the bottom conductive layer and spaced apart from the first conductive layer, a conductive plug electrically coupled to the bottom conductive layer, and a top conductive layer electrically coupled to the first conductive layer and the second conductive layer. The first conductive layer has a first work function and the second conductive layer has a second work function different from the first work function. The bottom conductive layer, the insulation layer, the first conductive layer, and the second conductive layer together configure a programmable unit.

The present application discloses a semiconductor device with a programmable unit and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a bottom conductive layer positioned in the substrate, an insulation layer positioned on the substrate, a first conductive layer positioned on the insulation layer and above the bottom conductive layer, a second conductive layer positioned on the insulation layer and above the bottom conductive layer and spaced apart from the first conductive layer, a conductive plug electrically coupled to the bottom conductive layer, and a top conductive layer electrically coupled to the first conductive layer and the second conductive layer. The first conductive layer has a first work function and the second conductive layer has a second work function different from the first work function. The bottom conductive layer, the insulation layer, the first conductive layer, and the second conductive layer together configure a programmable unit.