An optical sensor structure is provided. The optical sensor structure includes a substrate, a light sensing unit, a peripheral wall, and a reflective layer. The substrate includes a plurality of metal pads. The light sensing unit is disposed on the substrate and electrically connected to the plurality of metal pads. The peripheral wall is disposed on the substrate, and the peripheral wall and the substrate define an accommodating space. The metal pads and the light sensing unit are positioned in the accommodating space. The reflective layer is disposed in the accommodating space and surrounds the light sensing unit.

According to an aspect, a detection device includes: a substrate; a plurality of photodiodes provided to the substrate and arranged in a first direction; a plurality of lenses provided so as to overlap the photodiodes; and a light-blocking layer provided between the photodiodes and the lenses and having a plurality of openings. More than one of the openings is provided in each of regions overlapping the respective photodiodes, and an arrangement direction of the openings in each of the regions overlapping the respective photodiodes is at an angle to the first direction.

An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.

An electronic device can include a housing defining an aperture, and an electromagnetic radiation emitter and an electromagnetic radiation detector disposed in the housing. An optical component can be disposed in the aperture and can include a first region of a first material having a first index of refraction, the first region aligned with the electromagnetic radiation emitter, a second region of the first material, the second region aligned with the electromagnetic radiation detector, and a bulk region surrounding a periphery of the first region and a periphery of the second region, the bulk region including a second material having a second index of refraction that is lower than the first index of refraction.

An optical semiconductor device includes a semiconductor light receiving element, a capacitor, and a carrier. The carrier has a mounting surface on which the semiconductor light receiving element and the capacitor are mounted. The optical semiconductor device includes a first conductive pattern including a first mounting area and a first bonding pad, a second conductive pattern including a second mounting area and a third mounting area, and a third conductive pattern including a second bonding pad. The first mounting area is connected to a first electrode of the semiconductor light receiving element. The second mounting area is connected to a second electrode of the semiconductor light receiving element. The third mounting area is connected to one electrode of the capacitor. The conductive patterns are separated from each other. The other electrode of the capacitor is electrically connected to the third conductive pattern via a wire.

An electronic device includes a solar cell, a first light modulating layer, a transmittance-adjustable lens and a control circuit. At least a portion of the first light modulating layer is disposed on the solar cell. The control circuit is electrically connected to the solar cell and the transmittance-adjustable lens.

The present disclosure provides an optical sensor, an optical distance sensing module and a fabricating method thereof. According to the embodiments of the present disclosure, the optical sensor includes an optical sensing layer, a light transmitting layer and a light blocking layer. The optical sensing layer includes an array of optical sensing elements, the light transmitting layer is coated on the optical sensing layer, and the light blocking layer includes one or more light incident holes and is coated on the light transmitting layer. The optical sensing layer, the light transmitting layer and the light blocking layer are packaged as a wafer die. Light passes through the light incident holes and transmits through the light transmitting layer to irradiate on the array of optical sensing elements. The optical sensor effectively reduces the thickness, size and weight of the optical sensor, thereby expanding the application range of the optical sensor.

The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.

An optoelectronic sensor module and a method for producing an optoelectronic sensor module are disclosed. In an embodiment an optoelectronic sensor module includes a first semiconductor transmitter chip configured to emit radiation of a first wavelength, a second semiconductor transmitter chip configured to emit radiation of a second wavelength different from the first wavelength, a semiconductor detector chip configured to detect the radiation of the first and second wavelengths, and a first potting body being opaque to the radiation of the first and the second wavelength, wherein the first potting body directly covers side surfaces of the chips and mechanically connects the chips located in a common plane to one another, wherein a distance between the chips is less than or equal to twice an average diagonal length of the chips, and wherein the sensor module is adapted to rest against a body part to be examined.

A semiconductor device is provided. The semiconductor device includes a substrate and a light-collimating layer. The substrate has a plurality of pixels. The light-collimating layer is disposed on the substrate, and the light-collimating layer includes a transparent material layer, a first light-shielding layer, a second light-shielding layer and a plurality of transparent pillars. The transparent material layer covers the pixels. The first light-shielding layer is disposed on the substrate and the first light-shielding layer has a plurality of holes corresponding to the pixels. The second light-shielding layer is disposed on the first light-shielding layer. The transparent pillars are disposed in the second light-shielding layer.