An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

A flexible assembly with a stainless steel mesh packaging structure includes a flexible back plate, a first hot melt adhesive, a solar cell string, a stainless steel mesh, a second hot melt adhesive, and a flexible front plate. The flexible back plate and the flexible front plate are respectively arranged on the outer surface of the first hot melt adhesive and the outer surface of the second hot melt adhesive, and the solar cell string and the stainless steel mesh are arranged between the first hot melt adhesive and the second hot melt adhesive. The stainless steel mesh is arranged at partial or all positions around the outer edge of the solar cell string and is continuously distributed or separately distributed. The stainless steel mesh is arranged around the solar cell string to further strengthen the strength of the flexible assembly and improve the tearing resistance of the flexible assembly.

In one example, a sensor comprises a photovoltaic device. The photovoltaic device comprises a core having a shape that is at least partially spherical, an absorber disposed over the core, and a transparent conductor disposed over the absorber. Other examples and related methods are also disclosed herein.

An electronic component comprising: an electronic substrate that includes an electronic element and a first connection terminal a package member that is disposed on the electronic substrate; and a circuit member that includes a second connection terminal, wherein the circuit member is disposed between the package member and the electronic substrate, and extends from the position between the package member and the electronic substrate outward beyond the edge of the electronic substrate; the electronic component includes a connecting member that is disposed between the circuit member and the electronic substrate, and electrically connects the second connection terminal and the first connection terminal, an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; the connecting member, the circuit member, and the adhesive member are located between the package member and the electronic substrate.

An optoelectronic device includes a flexible substrate, a cerium oxide (CeO.sub.2) layer arranged on the flexible substrate, a single crystal β-III-oxide layer arranged on the CeO.sub.2 layer, and a metallic contact layer arranged on the single crystal β-III-oxide layer.

This application provides a solar cell, a method for preparing the solar cell, smart glasses, and an electronic device. The solar cell includes a first conductive layer, a second conductive layer, a first conductive lattice, a second conductive layer, and a functional layer. The functional layer is disposed between the first conductive layer and the second conductive layer, the functional layer is configured to absorb light and generate a photocurrent, and both the first conductive layer and the second conductive layer are configured to receive the photocurrent. The first conductive lattice is in contact with a surface that is of the first conductive layer. The second conductive lattice is in contact with the second conductive layer, and the first conductive lattice and the second conductive lattice are configured to output the photocurrent to the target device. This application can mitigate impact of a sheet resistance on cell efficiency.

A photoelectric converter including a crystalline silicon substrate having a light receiving surface including a smooth section and a rough surface section having surface roughness greater than the surface roughness of the smooth section and a light transmissive inorganic film so provided as to overlap with the smooth section and the rough surface section, and the film thickness t1 of a portion of the inorganic film that is the portion where the inorganic film overlaps with the rough surface section is smaller than the film thickness t2 of a portion of the inorganic film that is the portion where the inorganic film overlaps with the smooth section. The arithmetic average roughness of the rough surface section is preferably greater than or equal to 0.1 μm.

A photoelectric converter including a crystalline silicon substrate having a light receiving surface including a smooth section and a rough surface section having surface roughness greater than the surface roughness of the smooth section and a light transmissive inorganic film so provided as to overlap with the smooth section and the rough surface section, and the film thickness t1 of a portion of the inorganic film that is the portion where the inorganic film overlaps with the rough surface section is smaller than the film thickness t2 of a portion of the inorganic film that is the portion where the inorganic film overlaps with the smooth section. The arithmetic average roughness of the rough surface section is preferably greater than or equal to 0.1 μm.

An electronic component comprising: an electronic substrate that includes an electronic element and a first connection terminal a package member that is disposed on the electronic substrate; and a circuit member that includes a second connection terminal, wherein the circuit member is disposed between the package member and the electronic substrate, and extends from the position between the package member and the electronic substrate outward beyond the edge of the electronic substrate; the electronic component includes a connecting member that is disposed between the circuit member and the electronic substrate, and electrically connects the second connection terminal and the first connection terminal, an adhesive member that is disposed between the circuit member and the package member, and joins the circuit member to the package member; the connecting member, the circuit member, and the adhesive member are located between the package member and the electronic substrate.

A solar cell for a solar cell array with one or more grid on a surface thereof, wherein electrical connections are made to the grids in a plurality of locations positioned around the solar cell; and the electrical connections extend to one or more conductors located under the solar cell. The conductors located under the solar cell are buried within a substrate, and each of the conductors comprises a low resistance conducting path that distributes current from the solar cell. The conductors are loops, U-shaped, or have only up or down pathways. The solar cell comprises a full cell that has four cropped corners and the locations are in the cropped corners.