The present disclosure relates to a display panel and a method for manufacturing the same. The display panel includes an infrared receiver. The infrared receiver is disposed on a substrate and is located on one side of the substrate which is close to a light emitting surface, wherein the infrared receiver is configured to receive infrared light incident through the light emitting surface.

A light-emitting device including a substrate at least partially doped with a first type of conductivity and including a face; light-emitting diodes each including at least one three-dimensional semiconducting element which is undoped or doped with the first type of conductivity and resting on the said face; and semiconducting regions forming photodiodes, at least partially doped with a second type of conductivity opposite to the first type of conductivity and extending in the substrate from the said face between at least some of the three-dimensional semiconducting elements, a portion of the substrate of first type of conductivity extending up to the said face at the level of each three-dimensional semiconducting element.

Various embodiments of a power source and method of forming such power source are disclosed. The power source can include a substrate and a cavity disposed in a first major surface of the substrate. The power source can also include radioactive material disposed within the cavity, where the radioactive material emits radiation particles; and particle converting material disposed within the cavity, where the particle converting material converts one or more radiation particles emitted by the radioactive material into light. The power source further includes a sealing layer disposed such that the particle converting material and the radioactive material are hermetically sealed within the cavity, and a photovoltaic device disposed adjacent the substrate. The photovoltaic device can convert at least a portion of the light emitted by the particle converting material that is incident upon an input surface of the photovoltaic device into electrical energy.

Described herein are systems and methods that that mitigate avalanche photodiode (APD) blinding and allow for improved accuracy in the detection of a multi-return light signal. A blinding spot may occur due to saturation of a primary APD. The systems and methods include the incorporation of a redundant APD and the utilization of time diversity and space diversity. Detection by the APDs is activated by a bias signal. The redundant APD receives a time delayed bias signal compared to the primary APD. Additionally, the redundant APD is positioned off the main focal plane in order to attenuate an output of the redundant APD. With attenuation, the redundant APD may not saturate and may have a successful detection during the blinding spot of the primary APD. Embodiments may include multiple primary APDs and multiple secondary APDs.

The present invention relates to an optocoupler including a light source having a body and electrical leads, a light detector having a diode stack a metal end cap and electrical leads, and an optical cavity including optically transparent material at least partially covering the body of the light source and the diode stack of the light detector. Also included is a reflective layer including optically reflective material surrounding the optical cavity. The electrical leads of the light source, the metal end cap and the electrical leads of the light detector protrude from the optical cavity and the reflective layer.

Provided is a photodetection apparatus which includes a mounting board, and an optical sensor device that includes a first surface on the mounting board side and a second surface on a side opposite to the mounting board, and is mounted on the mounting board. The optical sensor device includes an optical sensor that includes a light receiving surface on the second surface side, a signal processing circuit that is electrically connected to the optical sensor, and a lead frame that is provided on the second surface side with respect to the signal processing circuit, and shields a surface of the signal processing circuit on the second surface side. The mounting board has a conductive pattern that faces the signal processing circuit and shields a surface of the signal processing circuit on the first surface side.

A photosensitive device is provided. The photosensitive device includes a sensing stack, an anti-reflective layer, an optical filter, a first electrode, and a second electrode. The sensing stack includes a first semiconductor layer, an intrinsic semiconductor layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the intrinsic semiconductor layer. The anti-reflective layer is disposed on a side of the sensing stack. The optical filter is disposed on the anti-reflective layer and blocks input light with an incident angle greater than 50 degrees. The first electrode and the second electrode are disposed on the sensing stack.

Various embodiments of a power source and method of forming such power source are disclosed. The power source can include a substrate and a cavity disposed in a first major surface of the substrate. The power source can also include radioactive material disposed within the cavity, where the radioactive material emits radiation particles; and particle converting material disposed within the cavity, where the particle converting material converts one or more radiation particles emitted by the radioactive material into light. The power source further includes a sealing layer disposed such that the particle converting material and the radioactive material are hermetically sealed within the cavity, and a photovoltaic device disposed adjacent the substrate. The photovoltaic device can convert at least a portion of the light emitted by the particle converting material that is incident upon an input surface of the photovoltaic device into electrical energy.

The present disclosure provides an optical module comprising: a photoelectric conversion unit, a first demodulation circuit, and a second demodulation circuit; the first demodulation circuit and the second demodulation circuit are respectively connected to the photoelectric conversion unit; the photoelectric conversion unit is configured to convert the received optical signal into an electrical signal; the first demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a high-frequency electrical signal; the second demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a low-frequency electrical signal.

An optical sensor includes: a light emitting element 40; a lower substrate 20 on which the light emitting element 40 is provided; an upper substrate 10 provided so that the light emitting element 40 is positioned between the upper substrate 10 and the lower substrate 20; and an optical block 30 provided on the upper substrate 10. The upper substrate 10 includes a division-type photodiode SD. The optical block 30 is configured to reflect light emitted from the light emitting element 40 toward a measurement target R, and light reflected by the measurement target R is incident onto the division-type photodiode SD.