Patent classifications
H
H01
H01L
31/00
H01L31/18
H01L31/1828
H01L31/1836
H01L31/1836
Back contact LED through spalling
09865769
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2018-01-09
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A method of forming, and corresponding structure, of an LED device where an LED and the contacts for the device are formed on a surface of the substrate, and the substrate is spalled just below the surface of the substrate.