A photovoltaic module and its manufacturing method. The module includes a first support wafer made of sintered silicon and a second layer of single-crystal silicon.

Various laser processing schemes are disclosed for producing various types of hetero-junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, metal ablation, annealing to improve passivation, and selective emitter doping via laser heating of aluminum. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero-junction solar cells. Laser ablation techniques are disclosed that leave the underlying silicon substantially undamaged. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, or other cleavage techniques such as ion implantation and heating, that are either planar or textured/three-dimensional. These techniques are highly suited to thin crystalline semiconductor, including thin crystalline silicon films.

A method for producing a rear-side contact system for a silicon thin-film solar cell having pn junction formed from a silicon absorber layer and an emitter layer includes applying an organic insulation layer to the emitter layer; producing contact holes in the insulation layer as far as the absorber layer and the emitter layer; subsequently insulating the contact holes; subsequently applying a low-melting metal layer to form n and p contacts in the contact holes; separating the metal layer into n-contacting and p-contacting regions by laser-cutting; before applying the organic insulation layer to the emitter layer, applying a TCO layer; producing holes for contacts for the silicon absorber layer in the organic insulation; and subsequently selectively doping the produced holes for the contacts as far as the silicon absorber layer.

Disclosed are embodiments of a thin-film photovoltaic technology including a single-junction crystalline silicon solar cell with a photonic-plasmonic back-reflector structure for lightweight, flexible energy conversion applications. The back-reflector enables high absorption for long-wavelength and near-infrared photons via diffraction and light-concentration, implemented by periodic texturing of the bottom-contact layer by nanoimprint lithography. The thin-film crystalline silicon solar cell is implemented in a heterojunction design with amorphous silicon, where plasma enhanced chemical vapor deposition (PECVD) is used for all device layers, including a low-temperature crystalline silicon deposition step. Excimer laser crystallization is used to integrate crystalline and amorphous silicon within a monolithic process, where a thin layer of amorphous silicon is converted to a crystalline silicon seed layer prior to deposition of a crystalline silicon absorber layer via PECVD. The crystalline nature of the absorber layer and the back-reflector enable efficiencies higher than what is achievable in other thin-film silicon devices.

Example embodiments relate to a composition for forming a solar cell electrode, and a solar cell electrode prepared using the composition. The composition for forming a solar cell electrode includes a silver (Ag) powder, a glass frit, and an organic vehicle, wherein the glass frit includes silver (Ag); tellurium (Te); and at least one selected from the group of lithium (Li), sodium (Na), and potassium (K), a molar ratio of the silver (Ag):the tellurium (Te) included in the glass frit is in a range of about 1:0.1 to about 1:50, and a molar ratio of the silver (Ag):lithium (Li), sodium (Na) or potassium (K) is in a range of about 1:0.01 to about 1:10. The solar cell electrode prepared using the composition has excellent fill factor and conversion efficiency due to minimized contact resistance (Rc) and series resistance (Rs).

A method for manufacturing a semiconductor element comprising a single photon avalanche diode having a multiplication zone (AR) a guard ring structure with a second type of electrical conductivity comprises providing a semiconductor wafer with a first region (R) comprising a semiconductor material with the first type of conductivity. The method further comprises generating by a first doping process a first well (W1) of the guard ring structure having a first vertical depth, the first well (W1) laterally surrounding the multiplication zone (AR) and having a lateral distance (A) from the multiplication zone (AR). The method further comprises generating by a second doping process a second well (W2) of the guard ring structure having a second vertical depth, the second well (W2) laterally surrounding and adjoining a part of the first region for laterally defining the multiplication zone (AR).

A semiconductor device capable of enhanced sub-bandgap photon absorption and detection is described. This semiconductor device includes a p-n junction structure formed of a semiconductor material, wherein the p-n junction structure is configured such that at least one side of the p-n junction (p-side or n-side) is spatially confined in at least one dimension of the device (e.g., the direction perpendicular to the p-n junction interface). Moreover, at least one side of the p-n junction (p-side or n-side) is heavily doped. The semiconductor device also includes electrical contacts formed on a semiconductor substrate to apply an electrical bias to the p-n junction to activate the optical response at target optical wavelength corresponds to an energy substantially equal to or less than the energy band-gap of the first semiconductor material. In particular embodiments, the semiconductor material is silicon.

A method of manufacturing a semiconductor structure includes: forming a light-absorption layer in a substrate; forming a first doped region of a first conductivity type and a second doped region of a second conductivity type in the light-absorption layer adjacent to the first doped region; depositing a first patterned mask layer over the light-absorption layer, wherein the first patterned mask layer includes an opening exposing the second doped region and covers the first doped region; forming a first silicide layer in the opening on the second doped region; depositing a barrier layer over the first doped region; and annealing the barrier layer to form a second silicide layer on the first doped region.

A solar cell includes a silicon substrate, an emitter area formed on a front surface of the silicon substrate, a tunneling oxide layer formed on a back surface of the silicon substrate, a back surface field area formed on the tunneling oxide layer and formed of a polycrystalline silicon layer, a back passivation film formed on the back surface field area and having an opening, and a back electrode connected to the back surface field area via the opening.

The present invention relates to the field of solar cells, and in particular to a main-gate-free and high-efficiency back-contact solar cell module, a main-gate-free and high-efficiency back-contact solar cell assembly, and a preparation process thereof. The solar cell module, comprising cells and an electrical connection layer, a backlight side of the cells having P-electrodes connected to a P-type doping layer and N-electrodes connected to a N-type doping layer, is characterized in that the electrical connection layer comprises a number of parallel leads each electrically connected to the P-electrodes or the N-electrodes. The present invention has the beneficial effect that a main-gate-free and high-efficiency back-contact solar cell module, a main-gate-free and high-efficiency back-contact solar cell assembly, and a preparation process thereof are provided, which can effectively the short-circuiting of the P-electrodes and the N-electrodes and has the advantages of low cost, high hidden-cracking resistance, high efficiency and high stability.