A high efficiency configuration for a solar cell module comprises solar cells arranged in an overlapping shingled manner and conductively bonded to each other in their overlapping regions to form super cells, which may be arranged to efficiently use the area of the solar module.

Provided is a wire setting apparatus of a tabbing apparatus. A wire setting apparatus of a tabbing apparatus according to the present invention includes: a conveyer; a wire placement platform installed adjacent to the conveyer such that a portion of a wire placed on the conveyor lies on the wire placement platform; and a placement gripper device configured to grip the wire and to place the wire on the wire placement platform.

Local metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. For example, a solar cell includes a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding a semiconductor region.

The present disclosure provides a support device for conveying at least one solar cell element in a transport direction, wherein the support device comprises a support element configured for supporting the at least one solar cell element and an electric arrangement configured for providing an electrostatic force for holding the at least one solar cell element on the support element.

An apparatus for the manufacture of at least two arrangements of solar cell pieces is provided. The apparatus includes at least one positioning device configured for positioning two or more solar cell pieces on a support device for forming the at least two arrangements, wherein the apparatus is configured to allocate the two or more solar cell pieces to a respective arrangement of the at least two arrangements based on one or more properties of the two or more solar cell pieces.

An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

In an example, a method includes providing a photovoltaic string comprising a plurality of from 2 to 45 strips, each of the plurality of strips being configured in a series arrangement with each other, each of the plurality of strips being coupled to another one of the plurality of strips using an electrically conductive adhesive (ECA) material, detecting at least one defective strip in the photovoltaic string, applying thermal energy to the ECA material to release the ECA material from a pair of photovoltaic strips to remove the defective photovoltaic strip, removing any residual ECA material from one or more good photovoltaic strip, aligning the photovoltaic string without the damaged photovoltaic strip, and a replacement photovoltaic strip that replaces the defective photovoltaic strip, and curing a reapplied ECA material on the replacement photovoltaic strip to provide the photovoltaic string with the replacement photovoltaic strip.

The present disclosure provides a photovoltaic stringer and a method for manufacturing a photovoltaic ribbon. The photovoltaic stringer includes a first clamping component to pull a ribbon from a ribbon reel, a second clamping component to coordinate with the first clamping component to stretch the ribbon, a cutting component to cut the ribbon, and, at least one first electrode and at least one second electrode to supply power to the ribbon. The method for manufacturing a photovoltaic ribbon comprises acquiring a ribbon reel and pulling a ribbon, stretching the ribbon and cutting the ribbon to obtain a cut ribbon, and performing an annealing process on the cut ribbon.

Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.

A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.