H01L31/1888

PEROVSKITE SILICON TANDEM SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME
20210098201 · 2021-04-01 ·

Disclosed is a tandem solar cell according to an aspect including: a silicon lower cell; a perovskite upper cell disposed on the silicon lower cell; and a bonding layer for bonding the silicon lower cell and the perovskite upper cell between the silicon lower cell and the perovskite upper cell, wherein the front surface portion of the silicon lower cell being in contact with the bonding layer includes a texture structure, the bonding layer includes a first transparent electrode layer formed on the sidewall of the texture structure, a buried layer filling concave portions of the texture structure on the first transparent electrode layer, and a second transparent electrode layer on top surfaces of the buried layer, the first transparent electrode layer and the texture structure.

METHOD OF FABRICATING SEE-THROUGH THIN FILM SOLAR CELL
20210135041 · 2021-05-06 ·

Provided is a method of fabricating a see-through thin film solar cell, the method including preparing a substrate including a molybdenum (Mo) layer on one surface, forming see-through patterns by selectively removing at least parts of the Mo layer, sequentially depositing a chalcogenide absorber layer, a buffer layer, and a transparent electrode layer on the substrate and the Mo layer including the see-through patterns, and forming a see-through array according to a shape of the see-through patterns by removing the chalcogenide absorber layer, the buffer layer, and the transparent electrode layer deposited on the see-through patterns, by irradiating a laser beam from under the substrate toward the transparent electrode layer.

MANUFACTURING METHOD OF FLEXIBLE THIN FILM SOLAR CELL MODULE AND THE FLEXIBLE THIN FILM SOLAR CELL MODULE USING THE SAME

Provided is a method of manufacturing a high efficiency flexible thin film solar cell module including a see-thru pattern. The method of manufacturing a flexible thin film solar cell module includes: sequentially forming a light-absorbing layer, a first buffer layer, and a first transparent electrode layer on the release layer; forming a second buffer layer on the exposed bottom surface of the light-absorbing layer; forming a P2 scribing pattern by removing at least one portion of each of the first buffer layer, the light-absorbing layer, and the second buffer layer; forming a second transparent electrode layer on the second buffer layer and the first transparent electrode layer exposed by the P2 scribing pattern; and forming a P4 see-thru pattern by selectively removing at least one portion of the first buffer layer, the light-absorbing layer, the second buffer layer, and the second transparent electrode layer.

Stacked photoelectric conversion device and method for producing same

A method for manufacturing a stacked photoelectric conversion device includes forming an intermediate transparent conductive layer on a light-receiving surface of a crystalline silicon-based photoelectric conversion unit including a crystalline silicon substrate, and forming a thin-film photoelectric conversion unit on the intermediate transparent conductive layer. The stacked photoelectric conversion device includes the crystalline silicon-based photoelectric conversion unit, the intermediate transparent conductive layer, and the thin-film photoelectric conversion unit. The light-receiving surface of the crystalline silicon-based photoelectric conversion unit has a textured surface including a plurality of projections and recesses. The textured surface has an average height of 0.5 m or more. The intermediate transparent conductive layer fills the recesses of the textured surface and covers the tops of the projections of the textured surface. At least a part of the thin-film photoelectric conversion unit is deposited by a wet method.

METHOD FOR MANUFACTURING SOLAR CELL, AND HOLDER USED FOR SAME

A method for manufacturing a solar cell includes: forming a first semiconductor layer of a first conductivity type on and over one of two major surfaces facing each other on a crystal substrate; forming a lift-off layer on and over the first semiconductor layer; selectively removing the lift-off layer and first semiconductor layer; forming a second semiconductor layer of a second conductivity type on and over the major surface having the lift-off layer and the first semiconductor layer; and removing the second semiconductor layer covering the lift-off layer by removing the lift-off layer using an etching solution; and washing the crystal substrate by using a rinsing liquid. A contact angle of the etching solution or the rinsing liquid relative to the lift-off layer is smaller than a contact angle of the etching solution or the rinsing liquid relative to the second semiconductor layer, and the contact angle of the etching solution or the rinsing liquid relative to the second semiconductor layer is 65 or more to 110 or less.

BSI Chip with Backside Alignment Mark

A method includes forming image sensors in a semiconductor substrate. A first alignment mark is formed close to a front side of the semiconductor substrate. The method further includes performing a backside polishing process to thin the semiconductor substrate, forming a second alignment mark on the backside of the semiconductor substrate, and forming a feature on the backside of the semiconductor substrate. The feature is formed using the second alignment mark for alignment.

OXIDE SINTERED BODY AND TRANSPARENT CONDUCTIVE OXIDE FILM
20210002755 · 2021-01-07 · ·

An oxide sintered body containing indium, hafnium, tantalum, and oxygen as constituent elements, in which when indium, hafnium, and tantalum are designated as In, Hf, and Ta, respectively, the atomic ratio of Hf/(In+Hf+Ta) is equal to 0.002 to 0.030, and the atomic ratio of Ta/(In+Hf+Ta) is equal to 0.0002 to 0.013.

TRANSPARENT CONDUCTIVE STRUCTURE AND FORMATION THEREOF
20210005788 · 2021-01-07 ·

Briefly, an embodiment comprises fabricating and/or uses of one or more zinc oxide crystals to form a transparent conductive structure.

Method of manufacturing a thin film photovoltaic product

A method of forming a photovoltaic product with a plurality of photovoltaic cells is disclosed. The method comprises depositing a stack with first and second electrode layers (12, 16) and a photovoltaic layer (14) arranged in between. The method comprises partitioning the stack. The partitioning includes forming a trench (20) extending through the second electrode layer and the photovoltaic layer to expose the first electrode layer. The stack is first irradiated with a laser beam with a first spotsize and with a first wavelength for which the photovoltaic layer has a relatively high absorption coefficient as compared to that of the second electrode layer. The stack is then irradiated with a second laser beam with a second spotsize, greater than the first spotsize, and with a second wavelength for which the photovoltaic layer has a relatively low absorption coefficient as compared to that of the second electrode layer.

Method of manufacture of a coated glazing

A method of manufacture of a coated glazing includes the following steps in sequence a) providing a transparent glass substrate, b) etching a surface of the substrate with an acidic gas, and c) directly or indirectly coating said surface with at least one layer based on a transparent conductive coating (TCC) and/or at least one layer based on a material with a refractive index of at least 1.75.