A crystalline silicon-based solar cell includes, in the following order, a crystalline silicon substrate having a first principal surface, a non-single-crystalline silicon-based thin-film, and a transparent electroconductive layer. The non-single-crystalline silicon-based thin-film and the transparent electroconductive layer are disposed on the first principal surface. The non-single-crystalline silicon-based thin-film comprises, in the following order from the first principal surface, an intrinsic silicon-based thin-film and a conductive silicon-based thin-film. The first principal surface has a plurality of pyramidal projections, each having a top portion, a middle portion, and a bottom portion. A thickness of the non-single-crystalline silicon-based thin-film disposed on the top portions is smaller than a thickness of the non-single-crystalline silicon-based thin-film disposed on the middle portions.

A method for fabricating a device with integrated photovoltaic cells includes supporting a semiconductor substrate on a first handle substrate and doping the semiconductor substrate to form doped alternating regions with opposite conductivity. A doped layer is formed over a first side the semiconductor substrate. A conductive material is patterned over the doped layer to form conductive islands such that the conductive islands are aligned with the alternating regions to define a plurality of photovoltaic cells connected in series on a monolithic structure.

The present disclosure discloses an OGS capacitive touch screen and a manufacturing thereof. The OGS capacitive touch screen includes: a glass substrate; a first transparent electrically-conductive layer formed on the glass substrate and including a plurality of first touch electrodes arranged in a first direction; an overcoat layer formed on the first transparent electrically-conductive layer; a plurality of vias formed in the overcoat layer, the vias corresponding to lead wire positions reserved for the plurality of first touch electrodes; and a second transparent electrically-conductive layer formed on the overcoat layer and including a plurality of second touch electrodes arranged in a second direction.

A method for manufacturing a stacked photoelectric conversion device includes forming an intermediate transparent conductive layer on a light-receiving surface of a crystalline silicon-based photoelectric conversion unit including a crystalline silicon substrate, and forming a thin-film photoelectric conversion unit on the intermediate transparent conductive layer. The stacked photoelectric conversion device includes the crystalline silicon-based photoelectric conversion unit, the intermediate transparent conductive layer, and the thin-film photoelectric conversion unit. The light-receiving surface of the crystalline silicon-based photoelectric conversion unit has a textured surface including a plurality of projections and recesses. The textured surface has an average height of 0.5 m or more. The intermediate transparent conductive layer fills the recesses of the textured surface and covers the tops of the projections of the textured surface. At least a part of the thin-film photoelectric conversion unit is deposited by a wet method.

A photovoltaic device and method include forming a plurality of pillar structures in a substrate, forming a first electrode layer on the pillar structures and forming a continuous photovoltaic stack including an N-type layer, a P-type layer and an intrinsic layer on the first electrode. A second electrode layer is deposited over the photovoltaic stack such that gaps or fissures occur in the second electrode layer between the pillar structures. The second electrode layer is wet etched to open up the gaps or fissures and reduce the second electrode layer to form a three-dimensional electrode of substantially uniform thickness over the photovoltaic stack.

Provided are an oxide sintered body that can produce a transparent conductive oxide film having low resistance and exhibiting lower light absorption characteristics in a wide wavelength range, and a transparent conductive oxide film.

An oxide sintered body containing indium, hafnium, tantalum, and oxygen as constituent elements, in which when indium, hafnium, and tantalum are designated as In, Hf, and Ta, respectively, the atomic ratio Hf/(In+Hf+Ta) is 0.2 at % to 3.0 at %, and the atomic ratio Ta/(In+Hf+Ta) is 0.02 at % to 1.3 at %, is used.

The present disclosure provides a method for treating a surface portion of a TCO material in a semiconductor device that comprises a structure arranged to facilitate current flow in one direction. To perform the method the surface portion of the TCO is exposed to an electrolyte and a current is induced in the device. The current allows reducing the TCO material in a manner such that the adhesion of a metallic material to the exposed surface portion is improved over the adhesion of the metallic material to a non-exposed surface portion.

In a backside-junction type solar cell, polycrystalline silicon grains including at least one of amorphous silicon microcrystalline silicon, and polycrystalline silicon exist discretely over a passivation layer and a second conductivity type layer.

A photoelectric conversion element includes: a back electrode layer formed on a substrate; a photoelectric conversion layer facing a light receiving surface side of the back electrode layer and containing a chalcogen semiconductor; and a current collector electrically connected to the light receiving surface side of the photoelectric conversion layer, in which a first region including an interface between the back electrode layer and the photoelectric conversion layer and a second region not including an interface between the back electrode layer and the photoelectric conversion layer are provided on the substrate, and a joined portion between the current collector and a wiring member is formed in the second region.

A solar cell for an electronic device including a substrate made of a transparent material to be exposed to incident light, a first electrode made of transparent electrically conductive material, formed on one face of the substrate and including an inner face opposite an outer face oriented towards the substrate, the inner face including a first portion having a roughness greater than the roughness of a second portion, an absorbent layer extending by an outer face over the first portion of the inner face of the first electrode, a second electrode made of an electrically conductive material and extending over an inner face of the absorbent layer opposite the outer face of the latter, the absorbent layer and the second electrode being perforated to delimit blind cavities, the bottom of each being formed by the second portion of the inner face of the first electrode.