The present disclosure provides systems and methods for depositing an alkaline metal layer on an absorber to generate a copper-poor region at a surface of the absorber. The copper-poor region provides an increased efficiency over non-treated absorbers having copper-rich surfaces. The alkaline metal layer may be deposited by any suitable deposition method, such as, for example, a wet deposition method. After the alkaline metal layer is deposited, the absorber is annealed, causing the alkaline metal layer to interact with the absorber to reduce the copper-profile of the absorber at the interface between the alkaline metal layer and the absorber.

A thin film, flexible optoelectronic device is described. In an aspect, a method for fabricating a single junction optoelectronic device includes forming a p-n structure on a substrate, the p-n structure including a semiconductor having a lattice constant that matches a lattice constant of substrate, the semiconductor including a dilute nitride, and the single-junction optoelectronic device including the p-n structure; and separating the single-junction optoelectronic device from the substrate. The dilute nitride includes one or more of GaInNAs, GaInNAsSb, alloys thereof, or derivatives thereof.

Example embodiments relate to methods for continuous photovoltaic cell stringing and photovoltaic cell assemblies. An example method includes providing a foil in a provision direction in a continuous manner. The method also includes cutting at least one slit into the foil along the provision direction. Additionally, the method includes creating at least one slit opening by folding open the foil at a location of the at least one slit. Further, the method includes providing at least one electrically conductive wire near a first surface of the foil along the provision direction aligned with the at least one slit opening in a continuous manner. Yet further, the method includes folding back the foil at the at least one slit opening after the electrically conductive wire provision such that the at least one electrically conductive wire changes its position.

The present invention provides a technique for performing film formation at low cost without causing a short-circuit between sputtered films formed on opposite surfaces of a film-formation target substrate. According to the present invention, in a substrate-holder conveyance mechanism 3, a substrate holder 11 is conveyed by a first conveyance portion so that the substrate holder 11 passes through a first film formation region; film formation is performed by sputtering on a first surface of a film-formation target substrate 50 held by the substrate holder 11; the substrate holder 11 is conveyed from the first conveyance portion to a second conveyance portion in such a manner as to make a turn with the up/down orientation of the substrate holder 11 maintained; the substrate holder 11 is conveyed by the second conveyance portion in a direction opposite to the direction of conveyance by the first conveyance portion so that the substrate holder 11 passes through a second film formation region; and film formation is performed by sputtering on a second surface of the film-formation target substrate 50. The substrate holder 11 has openings 14 and 15 through which first and second surfaces of the film-formation target substrate 50 are exposed, and includes a shield portion 16 for shielding an edge portion of the film-formation target substrate 50 from a film formation material supplied from a second sputtering source.

An electrically-conductive material includes a polymeric substrate and a conductive nanostructured or microstructured material adhered to at least one surface of the polymeric substrate. The polymeric substrate includes a polymeric block copolyester-carbonate derived from resorcinol or alkylresorcinol isophthalate-terepthalate. The polymeric block copolyestercarbonate has a glass transition temperature of at least 130 degrees Celsius ( C.) and a sheet resistance of less than 20 ohms () per square (sq). Methods for making an electrically-conductive material are also described. The electrically-conductive material may exhibit improved properties, including but not limited to one or more of inherent ultraviolet resistance, transparency, light transmission properties, chemical resistance and/or sheet resistance.

An ion beam treatment or implantation system includes an ion source emitting a plurality of parallel ion beams having a given spacing. A first lens magnet having a non-uniform magnetic field receives the plurality of ion beams from the ion source and focuses the plurality of ion beams toward a common point. The system may optionally include a second lens magnet having a non-uniform magnetic field receiving the ion beams focused by the first lens magnet and redirecting the ion beams such that they have a parallel arrangement having a closer spacing than said given spacing in a direction toward a target substrate.

A display includes a plurality of pixel chips, chixels, provided on a substrate. The chixels and the light emitters thereon may be shaped, sized and arranged to minimize chixel, pixel, and sub-pixel gaps and to provide a seamless look between adjacent display modules. The substrate may include light manipulators, such as filters, light converters and the like to manipulate the light emitted from light emitters of the chixels. The light manipulators may be arranged to minimize chixel gaps between adjacent chixels.

A method of making a photovoltaic cell includes providing a metal oxide substrate. The substrate is at least translucent to light. The substrate is directed through a deposition chamber. A semiconductor is deposited over a first major surface of the substrate. The semiconductor includes a polycrystalline p-type layer. The semiconductor is exposed to a chlorine-containing compound or a chlorine molecule. A second electrode layer is provided over the semiconductor.

A flexible display includes a plurality of pixel chips, chixels, provided on a flexible substrate. The chixels and the light emitters thereon may be shaped, sized and arranged to minimize chixel, pixel, and sub-pixel gaps and to provide a desired bend radius of the display. The flexible substrate may include light manipulators, such as filters, light converters and the like to manipulate the light emitted from light emitters of the chixels. The light manipulators may be arranged to minimize chixel gaps between adjacent chixels.

An encased adhesive tape includes: an adhesive tape composite that includes adhesive tapes and connecting components, the adhesive tapes each including a base film and being arranged adjacent to one another in a longitudinal direction of the base film, the connecting components being band-shaped and each being arranged between the adhesive tapes; and a housing that is connected to one end of the adhesive tape composite in the longitudinal direction, and houses the adhesive tape composite. Each of the adhesive tapes includes a non-adhesive region in which an adhesive layer is not disposed, in an end portion out of end portions of the base film in the longitudinal direction, the end portion being on the same side as the one end of the adhesive tape composite.