A system, method and device for use as a reflector for a light emitting diode (LED) are disclosed. The system, method and device include a first layer designed to reflect transverse-electric (TE) radiation emitted by the LED, a second layer designed to block transverse-magnetic (TM) radiation emitted from the LED, and a plurality of ITO layers designed to operate as a transparent conducting oxide layer. The first layer may be a one-dimension (1D) distributed Bragg reflective (DBR) layer. The second layer may be a two-dimension (2D) photonic crystal (PhC), a three-dimension (3D) PhC, and/or a hyperbolic metamaterial (HMM). The 2D PhC may include horizontal cylinder bars, vertical cylinder bars, or both. The system, method and device may include a bottom metal reflector that may be Ag free and may act as a bonding layer.

A system, method and device for use as a reflector for a light emitting diode (LED) are disclosed. The system, method and device include a first layer designed to reflect transverse-electric (TE) radiation emitted by the LED, a second layer designed to block transverse-magnetic (TM) radiation emitted from the LED, and a plurality of ITO layers designed to operate as a transparent conducting oxide layer. The first layer may be a one-dimension (1D) distributed Bragg reflective (DBR) layer. The second layer may be a two-dimension (2D) photonic crystal (PhC), a three-dimension (3D) PhC, and/or a hyperbolic metamaterial (HMM). The 2D PhC may include horizontal cylinder bars, vertical cylinder bars, or both. The system, method and device may include a bottom metal reflector that may be Ag free and may act as a bonding layer.

A light emitting diode (LED) stack for a display including a first LED sub-unit configured to emit a first colored light, a second LED sub-unit disposed on the first LED sub-unit and configured to emit a second colored light, and a third LED sub-unit disposed on at least one of the first LED sub-unit and the second LED sub-unit and configured to emit a third colored light, in which the first LED sub-unit is configured to emit light through the second LED sub-unit and the third LED sub-unit, and the second LED sub-unit is configured to emit light through the third LED sub-unit.

The present specification provides a display device using a semiconductor light emitting element that self-assembles in a fluid, and a method for manufacturing same. The semiconductor light emitting element is a horizontal semiconductor light emitting element, and has a plurality of mesa structures on one surface thereof to enable unidirectional assembly in a fluid. Further, a transparent electrode layer can be formed on the one surface including the mesa structures to improve luminous efficiency.

Disclosed are a light emitting diode and a method for manufacturing a light emitting diode. The light emitting diode includes a first-type layer, a light emitting layer, a second-type layer and an electrode layer; the first-type layer includes a first-type gallium nitride; the light emitting layer is located on the first-type layer; the light emitting layer includes a quantum point; the second-type layer is located on the light emitting layer; the second-type layer includes a second-type gallium nitride; and the electrode layer is located on the second-type layer.

A micro light-emitting diode device structure including a substrate, a micro light-emitting diode, an isolation layer, and a top electrode is provided. A height of a contact periphery between the micro light-emitting diode and a concave surface of the isolation layer is greater than a height of a flat surface of the isolation layer and is smaller than a height of the micro light-emitting diode. A height of the isolation layer decreases from the height of the contact periphery to the height of the flat surface in a direction away from the micro light-emitting diode. In a cross-section, an included angle between the flat surface and a virtual straight line connecting the contact periphery and a turning periphery is greater than 120 degrees. The turning periphery is a boundary between the concave surface and the flat surface.

A micro light-emitting diode device structure including a substrate, a micro light-emitting diode, an isolation layer, and a top electrode is provided. A height of a contact periphery between the micro light-emitting diode and a concave surface of the isolation layer is greater than a height of a flat surface of the isolation layer and is smaller than a height of the micro light-emitting diode. A height of the isolation layer decreases from the height of the contact periphery to the height of the flat surface in a direction away from the micro light-emitting diode. In a cross-section, an included angle between the flat surface and a virtual straight line connecting the contact periphery and a turning periphery is greater than 120 degrees. The turning periphery is a boundary between the concave surface and the flat surface.

A semiconductor light emitting device includes a light emitting structure having a rod shape with first and second surfaces opposing each other and a side surface connected between the first and second surfaces, and including a first conductivity-type semiconductor providing the first surface, an active layer and a second conductivity-type semiconductor, a first electrode layer on a first region of the first surface of the light emitting structure and connected to the first conductivity-type semiconductor, the first region having a level that is vertically offset from a level of a second region adjacent thereto, and a second electrode layer connected to the second conductivity-type semiconductor.

A semiconductor light emitting device includes a light emitting structure having a rod shape with first and second surfaces opposing each other and a side surface connected between the first and second surfaces, and including a first conductivity-type semiconductor providing the first surface, an active layer and a second conductivity-type semiconductor, a first electrode layer on a first region of the first surface of the light emitting structure and connected to the first conductivity-type semiconductor, the first region having a level that is vertically offset from a level of a second region adjacent thereto, and a second electrode layer connected to the second conductivity-type semiconductor.

A method includes: bonding a surface of a first wafer on a side having a semiconductor layer to a surface of a second wafer on a side having a first electrode to electrically connect the semiconductor layer and the first electrode; etching a silicon substrate such that a first portion of the silicon substrate remains in a region overlapping with the first electrode in a plan view; etching the semiconductor layer using the first portion as a mask such that a portion of the semiconductor layer between the first portion and the first electrode remains as at least one light-emitting portion; forming a resin layer to cover a lateral surface of the first portion and a lateral surface of the light-emitting portion with the resin layer; removing the first portion to expose the light-emitting portion; and forming a light-transmissive electrically conductive film on or above the light-emitting portion.