Disclosed are a leadframe, a bracket and an LED device. The leadframe includes a first photo-etched metal part, having a first electrode and a chip placement layer thereon, which has a greater length for short and long edges than those of the first electrode; and a second photo-etched metal part, composed of a second electrode and a connection layer thereon, which has a greater length for short and long edges than those of the second electrode; wherein a first long edge of the chip placement layer is flush with a first long edge of the first electrode, and a first long edge of the connection layer is flush with a first long edge of the second electrode; and wherein the chip placement layer and the connection layer are provided with L-shaped pins at corners of their first long edges to cover sidewalls of the corresponding corners.

An electronic component mounting package includes: an insulating base body including a principal face and a recess which opens in the principal face; and a metallic pattern including a plurality of metallic layers lying across a side face of the recess and the principal face. The metallic pattern includes, as an inner layer, at least one metallic layer selected from a tungsten layer, a nickel layer, and a gold layer, and an aluminum layer as an outermost layer. The metallic pattern includes an exposed portion corresponding to a part of the metallic layer constituting the inner layer which part is exposed at the principal face.

A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

An optoelectronic module (100) is defined, comprising at least one semiconductor chip (10) provided for emitting electromagnetic radiation and at least one holding device (20) which is adapted to fix in place a device (50) for encoding at least one optical or electronic parameter of the optoelectronic module (100). Furthermore, a process for the production of the optoelectronic module (100) is defined.

A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base.

A lead frame used to produce a chip package includes a first lead frame section and a second lead frame section connected to one another by a bar, wherein the bar includes a first longitudinal section, a second longitudinal section and a third longitudinal section, the first longitudinal section adjoins the first lead frame section and the third longitudinal section adjoins the second lead frame section, the first longitudinal section and the third longitudinal section are oriented parallel to one another, the first longitudinal section and the second longitudinal section form an angle not equal to 180° and not equal to 90°, and the lead frame is planar.

A light emitting device includes: a first support member having an opening; a second support member disposed in the opening of the first support member; an adhesive member disposed between the first and second support members; a first lead electrode disposed on the second support member; a second lead electrode disposed on at least one of the first and second support members; a light emitting chip disposed on the first lead electrode, the light emitting chip being electrically connected to the second lead electrode; and a conductive layer disposed under the second support member, wherein the first support member includes a resin material, the second support member includes a ceramic material, and the first lead electrode is disposed between the light emitting chip and the second support member.

One embodiment relates to a lens comprising: a lower end portion having an incident surface to which light is incident; and an upper end portion having an emitting surface allowing the light having passed through the incident surface to pass therethrough, wherein the ratio of an incidence angle and an emission angle on a first plane and/or the ratio of an incidence angle and an emission angle on a second plane is smaller than the ratio of an incidence angle and an emission angle on a third plane, the incidence angle is an angle of the light incident to the incident surface with respect to a center axis, the emission angle is an angle of the light emitted from the emitting surface with respect to the center axis, each of the first to third planes is a plane passing the center axis and is parallel to a first direction, the first plane is perpendicular to the second plane, the third plane is positioned between the first plane and the second plane, the center axis passes the center of the lens and is parallel to the first direction, and the first direction is a direction facing the lower end portion from the upper end portion.

Provided is a package device, relating to the technical field of lamp beads. The package device comprises an SMD holder, wherein the SMD holder is a hollow housing with one end opened; and the material of sidewalls of the SMD holder is transparent plastic. In the package device provided by the present invention, a transparent material is provided as the material of the sidewalls of the SMD holder, and light generated after a chip is powered on can be partially transmitted out through the sidewalls of the SMD holder, avoiding blocking of the light generated after the chip is powered on by the sidewalls of the SMD holder, thereby increasing transmittance of light from the chip.

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip; and an electrical connection point that contacts the optoelectronic semiconductor chip, wherein the electrical connection point covers the optoelectronic semiconductor chip on the bottom thereof at least in some areas, the electrical connection point includes a contact layer facing toward the optoelectronic semiconductor chip, the electrical connection point includes at least one barrier layer arranged on a side of the contact layer facing away from the optoelectronic semiconductor chip, the electrical connection point includes a protective layer arranged on the side of the at least one barrier layer facing away from the contact layer, the layers of the electrical connection point are arranged one on top of another along a stack direction, and the stack direction runs perpendicular to a main extension plane of the optoelectronic semiconductor chip.