A LED module includes a support including a heat dissipation pad; a circuit board on the support and including contact pads and an electrical connection terminal electrically connected to the contact pads; an LED device including a wiring board having lower and upper surfaces, a lower wiring on the lower surface and facing the heat dissipation pad, an upper wiring on the upper surface and electrically insulated from the lower wiring, contact structures at one side of the upper wiring, an LED chip mounted on another side of the upper wiring, a wavelength conversion film on the LED chip, and a reflective structure covering the upper surface such that a portion of the contact structures and the wavelength conversion film is exposed; a bonding wire electrically connecting the contact pads and the contact structures; and a conductive bump between the heat dissipation pad and the lower wiring.

There is provided a production management apparatus including: a memory section configured to memorize component data in which ranks of LED components stored in the stocker are associated with identification information of the LED components; a rank input section configured to accept a rank of the LED component in the LED components of the multiple types as a designated rank, the LED component being used in producing the board product; and a component group generating section configured to generate a component group into which the LED components of the multiple ranks including the designated rank are combined so as to satisfy a required specification of the board product, based on the ranks of the LED components which are included in the component data.

A light emitting device including a housing including walls defining a cavity having one side thereof opened, a light emitter to emit light having a peak wavelength in a blue wavelength band and including first and second light emitting chips, a reflective region in the housing to reflect light, and a wavelength conversion layer disposed on the light emitter and including a first wavelength converter and a second wavelength converter to emit light having different peak wavelengths from each other, in which the first wavelength converter has a first excitation peak wavelength and the second wavelength converter has a second excitation peak wavelength, and the second wavelength converter includes a fluoride-based red phosphor represented by A.sub.2MF.sub.6:Mn.sup.4+, where A is one of Li, Na, K, Ba, Rb, Cs, Mg, Ca, Se, and Zn, and M is one of Ti, Si, Zr, Sn, and Ge.

Provided is a display device including a substrate, a first electrode disposed on the substrate, a second electrode disposed on the substrate and spaced apart from the first electrode, a plurality of first sub-insulating layers extending in a first direction, disposed on the substrate and on the first and second electrodes, and arranged in a second direction crossing the first direction, and a plurality of light emitting elements disposed between the first sub-insulating layers and electrically connected to the first electrode and the second electrode.

A light-emitting device includes a mounting substrate having a first surface and a second surface opposite to the first surface, the mounting substrate having a first end portion at an end of the mounting substrate; light-emitting elements mounted on the first surface of the mounting substrate other than the first end portion; first terminals provided on the first surface at the first end portion of the mounting substrate and connected to the light-emitting elements; and second terminals provided on the second surface at the first end portion of the mounting substrate and connected to the light-emitting elements.

A light-emitting device includes an ultraviolet light LED sealed in a package. The LED is bonded to a substrate with an alloy bonding material. The LED is covered with an enclosed gas containing oxygen gas and further covered with a lid member that is hermetically bonded to the substrate. The lid member defines a space filled with the enclosed gas and constitutes the package. The lid member transmits the ultraviolet light emitted from the LED.

A light emitting diode module includes a first conductive device, a second conductive device, an insulating structure and a plating layer. The first conductive device includes a first metal layer and a first protecting layer covering the first metal layer. The second conductive device includes a second metal layer and a second protecting layer covering the second metal layer. The insulating structure covers around the first and the second conductive devices. The plating layer is disposed on the first and the second protecting layers in a first and a second openings of the insulating structure. The insulating structure covers portions of upper surfaces of the first and the second conductive devices. The plating layer covers remaining portions of the upper surfaces of the first and the second conductive devices. Lower surfaces of the first and the second conductive devices are located in the second opening.

A light-emitting device includes a plurality of light-emitting elements, a plurality of light-transmissive members, a covering member, and a plurality of pairs of electrodes. The light-emitting elements are arranged in a plurality of columns and a plurality of rows. The covering member integrally covers lateral surfaces of the light-emitting elements. The pairs of electrodes are arranged at a lower surface of the light-emitting device. The pairs of electrodes include first and second pairs of electrodes aligned along a column direction so that the electrodes of the same polarity among the first and second pairs of electrodes are aligned along the column direction, and a third pair of electrodes arranged adjacent to the first pair of electrodes in a row direction so that one of the third pair of electrodes and one of the first pair of electrodes facing each other in the row direction have the same polarity.

A display device includes: a display substrate having a display area and a pad area at one side of the display area; an optical layer on the display area of a first surface of the display substrate; a circuit board on the pad area of the display substrate; and a first sealing material on the pad area of the display substrate to cover the circuit board. The circuit board has: a first portion attached to the first surface of the display substrate, a second portion bent downwardly from the first surface and attached to another surface of the display substrate, and a third portion bent between the first portion and the second portion. The first sealing material covers at least some of the first portion and the third portion.

A light emitting module includes a light guide plate including a first face, a second face opposing the first face, and a through part penetrating between the first face and the second face, a light emitting device disposed in the through part on a second face side, a light transmissive member disposed on the light emitting device in the through hole on a first face side and between the light emitting device and a lateral wall of the through part, and a first light reflecting member disposed between an upper face of the light emitting device and the light transmissive member while being in contact with the upper face of the light emitting device.