A light-emitting device includes a plurality of light-emitting elements, a plurality of light-transmissive members, a covering member, and a plurality of pairs of electrodes. The light-emitting elements are arranged in a plurality of columns and a plurality of rows. The covering member integrally covers lateral surfaces of the light-emitting elements. The pairs of electrodes are arranged at a lower surface of the light-emitting device. The pairs of electrodes include first and second pairs of electrodes aligned along a column direction so that the electrodes of the same polarity among the first and second pairs of electrodes are aligned along the column direction, and a third pair of electrodes arranged adjacent to the first pair of electrodes in a row direction so that one of the third pair of electrodes and one of the first pair of electrodes facing each other in the row direction have the same polarity.

A light emitting device includes: a base member having a first surface including a first region; a first electric terminal including a first pin hole, the first pin hole penetrating the base member along a thickness direction of the base member; a second electric terminal including a second pin hole, the second pin hole penetrating the base member along the thickness direction; a first frame provided on the base member and surrounding the first region; a plurality of light emitting elements provided on the base member in the first region; a light-transmissive first member provided inward of the first frame, and covering the plurality of light emitting elements; and a protective element positioned between the base member and the first frame in the thickness direction. When viewed in a direction from the first pin hole toward the second pin hole, the protective element is positioned between the plurality of light emitting elements and the first pin hole and between the plurality of light emitting elements and the second pin hole.

A display device includes a substrate, a first electrode disposed on the substrate, a second electrode disposed on the substrate and spaced apart from the first electrode, a plurality of first protruding electrodes disposed on the first electrode, a plurality of second protruding electrodes disposed on the second electrode, and a plurality of light emitting elements electrically connected to the plurality of first protruding electrodes and the plurality of second protruding electrodes.

A light-emitting device includes a semiconductor stack, a first electrode, a second electrode, and a supporting layer. The semiconductor stack includes a first semiconductor layer including a first top surface and a bottom surface, an active layer located on the first semiconductor layer, and a second semiconductor layer located on the active layer and including a second top surface. The first electrode is located on the first top surface. The second electrode is located on the second top surface. The supporting layer includes a first thickness, and directly covers at least 80% of the bottom surface. In a top view, the semiconductor stack includes a maximum length, and a ratio of the maximum length to the first thickness is smaller than 1. The supporting layer has a first thermal expansion coefficient smaller than 80 ppm/° C., and the supporting layer has a Young's modulus between 2˜10 GPa.

A light emitting diode pixel for a display including a first subpixel comprising a first LED sub-unit, a second subpixel comprising a second LED sub-unit, and a third subpixel comprising a third LED sub-unit, in which each of the first, second, and third LED sub-units includes a first type of semiconductor layer and a second type of semiconductor layer, and the first, second, and third LED sub-units are separated from each other in a first direction, disposed at different planes from each other, and do not overlap each other in the first direction.

A display device includes electrodes spaced apart from each other in an emission area, a first bank disposed in a non-emission area, the first bank including an opening overlapping the emission area, light emitting elements disposed between the electrodes in the opening of the first bank, a second bank disposed on the first bank, the second bank including an opening overlapping the emission area, and a color conversion layer disposed in the opening of the second bank. The electrodes at least partially overlap the second bank.

A method to produce a light-emitting device package includes mounting junctions on pads of a metalized substrate, where the junctions are at least partially electrically insulated from each other, and forming wavelength converters, where each wavelength converter is located over a different junction and separated by a gap from neighboring wavelength converters.

The present invention relates to a backlight unit for use in a display device. The backlight unit includes a circuit board, at least one light-emitting diode chip mounted on the circuit board, a plurality of reflection members arranged on the upper part of the light-emitting diode chip, and a light diffusing member. The light diffusing member has an incident surface on which light enters and an emitting surface from which light is emitted. The light diffusing member is arranged on the upper part of the circuit board. The plurality of reflection members are stacked on each other and reflect a part of light emitted from the upper surface of the light-emitting diode chip.

A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

An optoelectronic component and a method for manufacturing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a diffractive optical element comprising at least one conversion material and a light source configured to emit primary radiation, wherein the conversion material is encapsulated in the diffractive optical element, and wherein the conversion material is arranged in a beam path of the primary radiation and is configured to convert the primary radiation at least partially into secondary radiation.