A display device includes pixels, each of the pixels including light emitting elements disposed in pixels, a color conversion layer disposed on the light emitting elements of the pixels, an optical layer disposed on the color conversion layer, and an organic layer disposed on the optical layer. At least one of the optical layer and the organic layer includes recess patterns disposed between the pixels.

A display device includes pixels, each of the pixels including light emitting elements disposed in pixels, a color conversion layer disposed on the light emitting elements of the pixels, an optical layer disposed on the color conversion layer, and an organic layer disposed on the optical layer. At least one of the optical layer and the organic layer includes recess patterns disposed between the pixels.

The present invention relates to a light source device having minimized exposure of an LED package formed on the light source device, and a camera inspection device using same such that erroneous detections during camera inspection can be minimized A camera inspection device according to the present invention comprises: a portable terminal cradle on which a portable terminal equipped with a camera is cradled; a light source device installed to be spaced apart from the upper portion of the portable terminal cradle by a predetermined distance and configured to emit light towards the camera; and a controller for controlling the turning on/off of the light source device and imaging operations of the camera so as to perform a light bleeding inspection of the camera mounted on the portable terminal. A light source device according to the present invention comprises: an LED package having multiple LED elements mounted on the upper surface of a printed circuit board; and an LED package cover having multiple coupling holes into which the multiple LED elements mounted on the LED package are inserted, respectively, the LED package cover covering a part of the upper surface of the printed circuit board, which is exposed between the multiple LED elements. The LED package cover having a lusterless surface is used to insert the LED elements mounted on the LED package into the coupling holes and to cover same, thereby preventing light bleeding inspection erroneous detections caused by exposure of elements, wires, or soldering parts on side surfaces of the LED elements. The LED package cover has the same height as that of the LED elements of the LED package, thereby preventing the LED elements from being damaged by exposure to the outside.

The present invention relates to a light source device having minimized exposure of an LED package formed on the light source device, and a camera inspection device using same such that erroneous detections during camera inspection can be minimized A camera inspection device according to the present invention comprises: a portable terminal cradle on which a portable terminal equipped with a camera is cradled; a light source device installed to be spaced apart from the upper portion of the portable terminal cradle by a predetermined distance and configured to emit light towards the camera; and a controller for controlling the turning on/off of the light source device and imaging operations of the camera so as to perform a light bleeding inspection of the camera mounted on the portable terminal. A light source device according to the present invention comprises: an LED package having multiple LED elements mounted on the upper surface of a printed circuit board; and an LED package cover having multiple coupling holes into which the multiple LED elements mounted on the LED package are inserted, respectively, the LED package cover covering a part of the upper surface of the printed circuit board, which is exposed between the multiple LED elements. The LED package cover having a lusterless surface is used to insert the LED elements mounted on the LED package into the coupling holes and to cover same, thereby preventing light bleeding inspection erroneous detections caused by exposure of elements, wires, or soldering parts on side surfaces of the LED elements. The LED package cover has the same height as that of the LED elements of the LED package, thereby preventing the LED elements from being damaged by exposure to the outside.

A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.

A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.

A method of manufacturing a light emitting module is provided. A plurality of light-emitting diodes are aligned on an elongated base board. By a dispenser, an uncured paste of sealing material is continuously applied on a plurality of light-emitting diodes aligned on the elongated base board. The applied paste of sealing material is cured.

A method of manufacturing a light emitting module is provided. A plurality of light-emitting diodes are aligned on an elongated base board. By a dispenser, an uncured paste of sealing material is continuously applied on a plurality of light-emitting diodes aligned on the elongated base board. The applied paste of sealing material is cured.

A light-emitting module includes a light guide plate including a first surface, and a second surface opposite to the first surface; a light-emitting device disposed at a second surface side of the light guide plate; a first light-reflective member provided at a periphery of the light-emitting device at the second surface side; and a second light-reflective member provided outward of the first light-reflective member at the second surface. A diffuse reflectance of the first light-reflective member for light emitted by the light-emitting device is greater than a diffuse reflectance of the second light-reflective member for the light emitted by the light-emitting device.

A light-emitting module includes a light guide plate including a first surface, and a second surface opposite to the first surface; a light-emitting device disposed at a second surface side of the light guide plate; a first light-reflective member provided at a periphery of the light-emitting device at the second surface side; and a second light-reflective member provided outward of the first light-reflective member at the second surface. A diffuse reflectance of the first light-reflective member for light emitted by the light-emitting device is greater than a diffuse reflectance of the second light-reflective member for the light emitted by the light-emitting device.