A light-emitting device includes a plurality of light-emitting elements, a plurality of light-transmissive members, a covering member, and a plurality of pairs of electrodes. The light-emitting elements are arranged in a plurality of columns and a plurality of rows. The covering member integrally covers lateral surfaces of the light-emitting elements. The pairs of electrodes are arranged at a lower surface of the light-emitting device. The pairs of electrodes include first and second pairs of electrodes aligned along a column direction so that the electrodes of the same polarity among the first and second pairs of electrodes are aligned along the column direction, and a third pair of electrodes arranged adjacent to the first pair of electrodes in a row direction so that one of the third pair of electrodes and one of the first pair of electrodes facing each other in the row direction have the same polarity.

A light-emitting device includes a plurality of light-emitting elements, a plurality of light-transmissive members, a covering member, and a plurality of pairs of electrodes. The light-emitting elements are arranged in a plurality of columns and a plurality of rows. The covering member integrally covers lateral surfaces of the light-emitting elements. The pairs of electrodes are arranged at a lower surface of the light-emitting device. The pairs of electrodes include first and second pairs of electrodes aligned along a column direction so that the electrodes of the same polarity among the first and second pairs of electrodes are aligned along the column direction, and a third pair of electrodes arranged adjacent to the first pair of electrodes in a row direction so that one of the third pair of electrodes and one of the first pair of electrodes facing each other in the row direction have the same polarity.

A light emitting device includes: a base member having a first surface including a first region; a first electric terminal including a first pin hole, the first pin hole penetrating the base member along a thickness direction of the base member; a second electric terminal including a second pin hole, the second pin hole penetrating the base member along the thickness direction; a first frame provided on the base member and surrounding the first region; a plurality of light emitting elements provided on the base member in the first region; a light-transmissive first member provided inward of the first frame, and covering the plurality of light emitting elements; and a protective element positioned between the base member and the first frame in the thickness direction. When viewed in a direction from the first pin hole toward the second pin hole, the protective element is positioned between the plurality of light emitting elements and the first pin hole and between the plurality of light emitting elements and the second pin hole.

A light-emitting device includes a semiconductor stack, a first electrode, a second electrode, and a supporting layer. The semiconductor stack includes a first semiconductor layer including a first top surface and a bottom surface, an active layer located on the first semiconductor layer, and a second semiconductor layer located on the active layer and including a second top surface. The first electrode is located on the first top surface. The second electrode is located on the second top surface. The supporting layer includes a first thickness, and directly covers at least 80% of the bottom surface. In a top view, the semiconductor stack includes a maximum length, and a ratio of the maximum length to the first thickness is smaller than 1. The supporting layer has a first thermal expansion coefficient smaller than 80 ppm/° C., and the supporting layer has a Young's modulus between 2˜10 GPa.

A light-emitting device includes a semiconductor stack, a first electrode, a second electrode, and a supporting layer. The semiconductor stack includes a first semiconductor layer including a first top surface and a bottom surface, an active layer located on the first semiconductor layer, and a second semiconductor layer located on the active layer and including a second top surface. The first electrode is located on the first top surface. The second electrode is located on the second top surface. The supporting layer includes a first thickness, and directly covers at least 80% of the bottom surface. In a top view, the semiconductor stack includes a maximum length, and a ratio of the maximum length to the first thickness is smaller than 1. The supporting layer has a first thermal expansion coefficient smaller than 80 ppm/° C., and the supporting layer has a Young's modulus between 2˜10 GPa.

A display device includes a display panel and a repair panel overlapping a region of the display panel. The display panel includes: a substrate; a plurality of transistors on the substrate; and a first electrode connected to the transistors. The repair panel includes: a repair substrate; a plurality of connection electrodes extending through the repair substrate and on opposite surfaces of the repair substrate; a first repair electrode connected to the connection electrodes; a first repair emission layer on the first repair electrode; and a repair common electrode on the first repair emission layer. In a region where the display panel and the repair panel overlap each other, the first electrode and the first repair electrode are electrically connected to each other through the connection electrode.

A display device includes a display panel and a repair panel overlapping a region of the display panel. The display panel includes: a substrate; a plurality of transistors on the substrate; and a first electrode connected to the transistors. The repair panel includes: a repair substrate; a plurality of connection electrodes extending through the repair substrate and on opposite surfaces of the repair substrate; a first repair electrode connected to the connection electrodes; a first repair emission layer on the first repair electrode; and a repair common electrode on the first repair emission layer. In a region where the display panel and the repair panel overlap each other, the first electrode and the first repair electrode are electrically connected to each other through the connection electrode.

A lighting device disclosed in an embodiment of the invention includes a substrate; light sources disposed on the substrate; and a resin layer disposed on the substrate and the light sources. a first reflective layer disposed on the resin layer, wherein the resin layer includes an exit surface facing the light sources, and the exit surface of the resin layer includes convex portions facing each of the light sources and recess portions respectively disposed between the plurality of convex portions, concave surfaces disposed in each of the plurality of recess portions may have a curvature, and a radius of curvature of the concave surfaces may increase in one direction.

A light emitting module includes a light guide plate including a first face, a second face opposing the first face, and a through part penetrating between the first face and the second face, a light emitting device disposed in the through part on a second face side, a light transmissive member disposed on the light emitting device in the through hole on a first face side and between the light emitting device and a lateral wall of the through part, and a first light reflecting member disposed between an upper face of the light emitting device and the light transmissive member while being in contact with the upper face of the light emitting device.

A tiling display apparatus including a substrate, multiple display units, an adhesive layer and multiple driver chips is provided. The display units are disposed on the substrate and each has a circuit substrate, multiple light emitting devices and at least one bonding pad. The circuit substrate has a first surface and a second surface opposite to each other. The light emitting devices are disposed on the first surface. The at least one bonding pad is disposed on the second surface, and is electrically coupled to the light emitting devices. The adhesive layer connects the substrate and the display units. The substrate and the adhesive layer have a plurality of openings arranged corresponding to the openings. Multiple bonding pads of the display units are positioned in the openings. The driver chips are electrically bonded to the bonding pads of the display units through the openings.