A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.

The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced.

The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced.

A method of packaging light emitting diodes (LEDs) includes molding a lead frame containing a plurality of lead frame fingers that are parallel to each other such that the lead frame fingers are separated from each other by a molded insulating structure to form a molded lead frame, mounting light emitting diodes to at least a portion of the molded lead frame, and dicing the molded lead frame to form a plurality of lead-containing mounting structures. Each of the lead-containing mounting structure includes a respective plurality of leads that are remaining portions of the lead frame, and each of the plurality of leads contains at least one castellation.

A method of packaging light emitting diodes (LEDs) includes molding a lead frame containing a plurality of lead frame fingers that are parallel to each other such that the lead frame fingers are separated from each other by a molded insulating structure to form a molded lead frame, mounting light emitting diodes to at least a portion of the molded lead frame, and dicing the molded lead frame to form a plurality of lead-containing mounting structures. Each of the lead-containing mounting structure includes a respective plurality of leads that are remaining portions of the lead frame, and each of the plurality of leads contains at least one castellation.

A light-emitting unit is provided. The light-emitting unit includes a light-emitting element, a light conversion layer, and a color filter layer. The light conversion layer is disposed on the light-emitting element. The color filter layer covers the sidewalls of the light conversion layer. In addition, the light-emitting unit further includes a protection layer located between the color filter layer and the light conversion layer.

A light-emitting unit is provided. The light-emitting unit includes a light-emitting element, a light conversion layer, and a color filter layer. The light conversion layer is disposed on the light-emitting element. The color filter layer covers the sidewalls of the light conversion layer. In addition, the light-emitting unit further includes a protection layer located between the color filter layer and the light conversion layer.

The disclosed examples relate to various implementations of a micro-light emitting diode upon which is built a controllable variable optic to provide a chip-scale light emitting device. An example of the controllable variable optic described herein is a controllable electrowetting structure having a leak-proof sealed cell with a first fluid having a first index of refraction and a second fluid having a second index of refraction. The controllable electrowetting structure may be integrally formed on or in a substrate or semiconductor material associated with the micro-light emitting diode in alignment with one or more of the light emitting diodes of the micro-LED device to provide a controllable lighting distribution.

A light-emitting device includes a support; a light-emitting element on or above the support; a first wavelength conversion member on or above the light-emitting element, the first wavelength conversion member having an area larger than that of the light-emitting element in a top view; a first light-transmissive member covering a lower surface of an extension region of the first wavelength conversion member an a lateral surface of the light-emitting element; a first light-reflective member on lateral sides of the first wavelength conversion member and the first light-transmissive member; and a second wavelength conversion member disposed on or above the first wavelength conversion member. A thickness of the second wavelength conversion member above a peripheral portion of the first wavelength conversion member is smaller than a thickness of the second wavelength conversion member above a central portion of the first wavelength conversion member.

A light-emitting device includes a support; a light-emitting element on or above the support; a first wavelength conversion member on or above the light-emitting element, the first wavelength conversion member having an area larger than that of the light-emitting element in a top view; a first light-transmissive member covering a lower surface of an extension region of the first wavelength conversion member an a lateral surface of the light-emitting element; a first light-reflective member on lateral sides of the first wavelength conversion member and the first light-transmissive member; and a second wavelength conversion member disposed on or above the first wavelength conversion member. A thickness of the second wavelength conversion member above a peripheral portion of the first wavelength conversion member is smaller than a thickness of the second wavelength conversion member above a central portion of the first wavelength conversion member.