A light-emitting device package includes a supporting substrate, a light-emitting device on the supporting substrate, an adhesive layer on at least a portion of a side surface or lower surface of the light-emitting device, the adhesive layer connecting the light-emitting device to the supporting substrate, and an air layer in a space defined by the supporting substrate, the light-emitting device, and the adhesive layer.

An LED apparatus is provided. The LED apparatus includes a plurality of substrate layers, each substrate layer corresponding to one of a plurality of sub-pixels of a pixel; a heat sink plate provided on a first side of each substrate layer, the heat sink plate including a patterned area provided between adjacent substrate layers of the plurality of substrates layers; a fluorescence provided on the heat sink plate overlapping at least a portion of one of the plurality of substrate layers; and a plurality of light emitting diodes, each light emitting diode formed on a second side opposite to the first side of each substrate layer.

A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the direction of thickness of the ceramic substrate so as to form a light exit aperture in a surface of the ceramic substrate, (iii) a second concave section formed within the first concave section in the further direction of thickness of the ceramic substrate so that one or more light-emitting devices are provided therein, (iv) a wiring pattern for supplying electricity, which is provided in the first concave section, and (v) a metalized layer having light-reflectivity, which is (a) provided between the light-emitting device and the surface of the second concave section of the substrate, and (b) electrically insulated from the wiring pattern. On the account of this, the light-emitting apparatus package in which heat is excellently discharged and light is efficiently utilized and a light-emitting apparatus in which the light-emitting apparatus package is used can be obtained.

An electromagnetic radiation emitting assembly includes a carrier, an electromagnetic radiation emitting component arranged above the carrier, and a potting material at least partly surrounding the electromagnetic radiation emitting component and into which are embedded phosphor that converts the electromagnetic radiation and heat-conducting particles that conduct heat arising during operation of the electromagnetic radiation emitting assembly, wherein a phosphor concentration in the potting material near the electromagnetic radiation emitting component is greater than a particle concentration of the heat-conducting particles in the potting material near the electromagnetic radiation emitting component, and a particle concentration of the heat-conducting particles in the potting material near the electromagnetic radiation emitting component is greater than in the potting material remote from the electromagnetic radiation emitting component.

A thermal conductive structure and an electronic device are provided. The thermal conductive structure includes a thermal conductive metal layer, a first carbon nanotube layer, a first thermal conductive adhesive layer, and a ceramic protective layer. The first carbon nanotube layer is disposed on a first surface of the thermal conductive metal layer and includes a plurality of first carbon nanotubes. The first thermal conductive adhesive layer is disposed at the first carbon nanotube layer, wherein the material of the first thermal conductive adhesive layer fills in the gaps of the first carbon nanotubes. The ceramic protective layer is disposed at one side of the first carbon nanotube layer away from the thermal conductive metal layer. The thermal conductive structure can quickly conduct the heat generated by the heat source to the outside, and improve the heat dissipation performance of the electronic device.

This present disclosure provides a manufacturing process of light emitting device and a light emitting device. The manufacturing process of light emitting device includes: step S1, making a quantum dot film; step S2, providing a LED unit, the LED unit including at least one LED chip; step S3, disposing a first transparent adhesive layer on an exposed surface of each LED chip; step S4, disposing the quantum dot film on the surface of the first transparent adhesive layer far away from the LED chip.

The present disclosure provides a display panel, a method for manufacturing a display panel and a display device. The display panel includes a substrate, and a light emitting element array and a quantum dot color filter array arranged on the substrate, the quantum dot color filter array is arranged on a light exiting side of the light emitting element array, and quantum dot color filters in the quantum dot color filter array correspond to light emitting elements in the light emitting element array one to one, and the display panel further includes a blocking structure arranged between the light emitting element array and the quantum dot color filter array so as to block heat dissipated by the light emitting elements from being conducted to the quantum dot color filters.

A display module includes a substrate, a ground layer disposed in the substrate, a plurality of self-emissive devices provided on a front surface of the substrate, a first driver integrated circuit (IC) provided on a rear surface of the substrate, and a first heat dissipation structure connected to the ground layer, and including a first ground pad exposed to the rear surface of the substrate. The first heat dissipation structure is configured to dissipate heat to the rear surface of the substrate.

A stable, hermetically sealed, partially optically transparent package for use to protect optoelectronic components is provided. The package has good cooling for the installed circuit elements and is as stable in relation to temperature and UV. The package has a cap with a frame made of a nitride ceramic and a glass element. The frame has an opening and the glass element hermetically closes the opening. The glass is fused onto the nitride ceramic and is fixed in contact with the nitride ceramic of the frame.

Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.