A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.

A display device according to an example embodiment comprises: a light source package comprising light sources disposed on the mounting surface of a printed circuit board and a display panel and configured to irradiate light toward the display panel. The light source package comprises: a light conversion member configured to convert the wavelength of the light emitted from the light sources; a transparent member configured to transmit the light emitted from the light sources, and to support the light conversion member; a first package substantially surrounding the light sources and the transparent member; and a second package covering the outside of the first package, wherein the thermal conductivity of the second package is greater than the thermal conductivity of the first package.

An electrical circuit board assembly (ECBA) preferably having at least one LED component and having a substrate that includes a plurality of raised pads formed such that open channels are formed therebetween, and such that the upper surfaces of the pads are preferably substantially coplanar. Such intra-pad channels facilitate heat transfer and cooling of the substrate and the ECBA. Further, such raised pads provide for alternate methods of electrically conductive track manufacturing so as to avoid the necessity of chemical etching which requires the use of hazardous toxic chemicals. Such alternate methods of electrically conductive track construction include adhesive conductive sheet application, conductive ink screen printing, and conductive ink painting.

A display device and a method of fabricating the same are disclosed, the display device includes a first metal layer on a substrate; light emitting elements emitting light of a first color, each of the light emitting elements having a first end contacting the first metal layer; an insulating layer disposed on the first metal layer and including holes exposing a second end of each of the light emitting elements facing the first metal layer; and a light conversion layer disposed in at least one of the holes and overlapping the light emitting elements. The light conversion layer converts the light of the first color emitted from the light emitting elements into light of a second color.

An elongated modular heat sink array having through power and/or data flowing from end to end powering and/or communicating with externally mounted coupled electronic devices.

Provided are an electronic component mounting package and an electronic device capable of making heat distribution of a curved electronic component mounting portion uniform. The electronic component mounting package (1) includes: a substrate (2) including a first main surface and a second main surface, and one of a recessed portion (2d) and a convex portion (2e) that is arc-shaped in a vertical cross-sectional view and that is provided in the first main surface; and a curved electronic component mounting portion (11), which is provided in the one of the recessed portion (2d) and the convex portion (2e) and on which the bent curved electronic component (10) is mounted. The substrate (2) has a notch (4) in the second main surface such that the notch (4) overlaps with the curved electronic component mounting portion (11) when the substrate (2) is viewed in a plane perspective from the first main surface side.

A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers.

A light-emitting diode package structure includes a heat dissipation substrate, a redistribution layer, and multiple light-emitting diodes. The heat dissipation substrate includes multiple copper blocks and a heat-conducting material layer. The copper blocks penetrate the heat-conducting material layer. The redistribution layer is disposed on the heat dissipation substrate and electrically connected to the copper blocks. The light-emitting diodes are disposed. on the redistribution layer and are electrically connected to the redistribution layer. A side of the light-emitting diodes away from the redistribution layer is not in contact with any component.

A heat sink includes first and second elongated heat sink bodies. The first and second elongated heat sink bodies are each formed from a respective electrically and thermally conductive material and also each extend from an LED coupling end of the heat sink to a lead end of the heat sink. An electrical insulator material connects the first and second elongated heat sink bodies together so as to bodies are electrically isolated from each other. Each elongated heat sink body also includes a respective LED coupling surface at the LED coupling end of the heat sink and a respective lead connecting surface located on the respective body at a location spaced apart from the LED coupling end of the heat sink.

A semiconductor device includes: a bottom plate having an upper surface and a lower surface, wherein the upper surface comprises an outer peripheral part and an inside part that is enclosed by the outer peripheral part and that protrudes more upward than the outer peripheral part; a frame joined to the upper surface of the bottom plate and comprising a first through-hole that penetrates the frame; a plate jointed to the outside or inside surface of the frame, the plate comprising a second through-hole that penetrates the plate in a same direction as that of the first through-hole, a thickness of the plate being greater than a thickness of the frame; a lead terminal inserted into the first through-hole and the second through-hole; a fixing member provided in the second through-hole and fixing the lead terminal; and a semiconductor element fixed to the inside part.