A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au—Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.

A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.

A LED strip having LED chips and a strip to which the LED chips are fixed and which also functions as a support structure of conductors coupled with the LED chips, and a tube manufactured from an elastic and at least partly light-transmitting material and surrounding the strip with the LED chips. At the outer surface of the tube there is a fixing element which is in essential parts of the same material as the tube. The LED strip includes a thermal conduction part which is of a material different from the tube and which, in the cross-section of the LED strip, is directed outwards from the inner surface of the tube for conducting waste heat generated in the LED chips out from the tube.

This utility model provides a type of heat-sink surface-mounted LED luminescent tube, comprising a first electrode pin used as a heat sink, and an LED chip, wherein the first electrode pin is composed of a first horizontal section electrode, a second horizontal section electrode and a protrusion heat sink, which are connected sequentially; the LED chip is mounted on the first horizontal section of the first electrode pin, a first electrode of the LED chip is connected with the first horizontal section, and a second electrode of the LED chip is connected with the third horizontal section through a conducting wire. When the actual patch is welded to this new utility model, the heat sink formed by the protrusion will penetrate a reserved copper hole in the circuit board to be connected with external metal elements, which radiates heat.

A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in a lateral direction; lead terminals that extend through the first through-holes, and each of which is electrically connected to the light-emitting elements; a cover bonded to the frame body; plate bodies bonded to an outer lateral surface or inner lateral surface of the frame body, each of the plate bodies having one or more second through-holes, wherein each of the lead terminals extends through a respective through-hole; and fixing members, each of which is disposed in a second through-hole and fixes a respective one of the one or more lead terminals.

An optoelectronic semiconductor component includes a carrier having a carrier top side and an opposing carrier underside, wherein the carrier top sides each have a larger area than the associated carrier undersides, the carrier parts fixedly connect to one another via at least one potting body and the potting body together with the carrier parts represents a bearing component of the semiconductor component so that all carrier undersides end flush with the potting body, the light-emitting semiconductor chips electrically connect in series, the metal layer on the carrier top side is structured into conductor tracks and into electrical connection surfaces, and the electrical connection surfaces on the carrier top side are electrically insulated from the associated carrier underside so that the carrier underside of the carrier part the semiconductor chips are arranged on is potential-free and is completely covered with the metal layer.

A display device includes a display panel configured to dispose a plurality of pixels; a cover glass configured to be disposed on a surface of the display panel; a heat dissipation sheet configured to be disposed on another surface of the display panel and has electrical conductivity; a light shielding layer configured to be disposed at edges of a surface of the cover glass and have electric conductivity; and a discharge member configured to discharge static electricity generated in the cover glass to the heat dissipation sheet by electrically connecting the heat dissipation sheet with the light shielding layer.

A lighting device, a method of manufacturing a lighting device and a support are described. A support includes a layered structure of alternating conductors and insulating layers. The layered structure includes a mounting section and a body section adjacent the mounting section. The mounting section includes at least one mounting face that has an arrangement direction and at least three alternating contact sections along the arrangement direction. Each contact section is electrically coupled to one of the conductors and separated from a neighboring one of the contact sections by one of the insulating layers. The body section has a width that protrudes sidewards from the at least one mounting face and a length that extends substantially parallel to the arrangement direction.

A composite substrate includes a submount substrate of an alternating pattern of electrically insulative portions, pieces, layers or segments and electrically conductive portions, pieces, layers or segments, and a shaft, back or plate for supporting the alternating pattern of electrically insulative portions and electrically conductive portions. An active device having a P-N junction can be mounted on the submount substrate. The electrically insulative portions, pieces, layers or segments can be formed from diamond while the electrically conductive portions, pieces, layers or segments can be formed from a metal or metal alloy.

The invention provides an interconnected string of three LED modules, having internal and external connections such that each LED in the string is fully individually addressable. LED biases and interconnects are oriented and configured such that individual addressability is achieved without the need for direct external signal connections to each LED in the string. Consequently embodiments are provided comprising pluralities of strings, arranged so as to form an array of LED modules, wherein wiring tracks running beneath, or along the intermediary spaces between, rows of LEDs are not required. Hence are provided LED devices comprising an array of individually addressable LED modules, having reduced spacing between rows and columns, and having optimal thermal path perpendicularly across the substrate layer. Provided devices have improved heat dissipation and greater achievable LED array density. Also provided are embodiments comprising one or more lens arrangements, suitable, for example, for adaptive beam-shaping applications.