A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.

A wavelength conversion element including a substrate, a wavelength conversion layer, a reflective layer, and a heat conduction and diffusion substrate is provided. The reflective layer is disposed between the substrate and the wavelength conversion layer, and the wavelength conversion layer is disposed between the heat conduction and diffusion substrate and the reflective layer. The wavelength conversion element is configured to receive an excitation light beam. The heat conduction and diffusion substrate is configured to allow the excitation light beam to pass through. The wavelength conversion layer is configured to receive and convert the excitation light beam into a converted light beam. The reflective layer is configured to reflect the converted light beam, and the heat conduction and diffusion substrate is configured to allow the converted light beam to pass through.

An electronic element mounting substrate includes a first substrate that has a first main surface, has a rectangular shape, and has a mounting portion for an electronic element on the first main surface, and a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, has a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, in which the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and that has a recessed portion on the fourth main surface.

A display device is provided. The display device comprises a first substrate including a display area, and a non-display area surrounding the display area, light emitting elements in the display area on the first substrate, pads in the non-display area, and a circuit board including circuit board pads connected to the pads, and including a first cover layer facing the first substrate, and defining first opening holes formed to correspond to the circuit board pads, a metal layer on the first cover layer and having the circuit board pads therebelow, and a second cover layer on the metal layer, and defining second opening holes exposing a portion of the metal layer.

There is provided a light-emitting device (1) including: a light-emitting element (20); a light-transmissive heat dissipation member (11) having a plate shape; a wavelength conversion member (12) that takes in, from a side of a light scattering layer (12a), light that is emitted from the light-emitting element (20) and passes through the light-transmissive heat dissipation member (11), and converts a wavelength in a fluorescent layer (12b); a lateral heat dissipation member that has a plate shape, includes a high-heat conduction member (13) in contact with a side surface of the wavelength conversion member (12) via a light reflection member (14), and is in contact with an upper surface of the light-transmissive heat dissipation member (11); and a package (21) that houses the light-emitting element (20) and supports a wavelength conversion unit (100) including the light-transmissive heat dissipation member (11), the wavelength conversion member (12), and the lateral heat dissipation member.

Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.

A light conversion package for a semiconductor light source includes a light conversion block, a substrate, and an interconnector. The light conversion block is positioned to receive incident light from the semiconductor light source and acts to convert the incident light to light having a different spectral distribution. The interconnector attaches the light conversion block to the substrate and limits a thermal resistance between the light conversion block and the substrate so that the substrate can efficiently sink heat from the light conversion block. The interconnector and the substrate together may still provide high reflectivity.

The invention provides an elongated luminescent body (100) comprising an elongated support (170) and a coating layer (180), wherein the elongated luminescent body (100) further comprises a body axis (BA), and a length parameter P of a body dimension perpendicular to the body axis (BA), wherein the length parameter P is selected from height (H), width (W) and diameter (D), wherein: —the elongated support (170) comprises a support material (171), a support material index of refraction n1, wherein the support material index of refraction n1 is at least 1.4, a support surface (172), and a support length (L1); —the coating layer (180) is configured on at least part of the support surface (172) over at least part of the support length (L1), wherein the coating layer (180) comprises a coating layer material (181), a coating layer index of refraction n2, wherein coating layer index of refraction n2 is at least 1.4, and a coating layer thickness (d1), wherein the coating layer material (181) has a composition different from the support material (171), wherein the coating layer material (181) comprises a luminescent material (120) configured to absorb one or more of UV radiation and visible light, and to convert into luminescent material light (8) having one or more wavelengths in one or more of the visible and the infrared; and —the support material (171) is transmissive for the luminescent material light (8), and (i) −0.2≤n1−n2≤0.2 and (ii) d1/P≤0.25 apply.

The invention relates to an assembly of light sources including an integrated circuit with a connection pad, a light-emitting part with micro-LEDs and an active surface, a fan-out encapsulation surrounding at least a part of the integrated circuit, a first multilayer metal layer, a second metal layer that includes contact parts being in direct contact with a rear face of the integrated circuit, a heat sink, a matrix fixation layer arranged between the second metal layer and the heat sink and a printed circuit board. The first metal layer is arranged so as to cover at least a part of the front face of the integrated circuit, providing an electrical connection between the pad of the integrated circuit and a pad of the assembly.

A jointing material includes: at least one type of element at 0.1 wt % to 30 wt %, the element being capable of forming a compound with each of tin and carbon; and tin at 70 wt % to 99.9 wt % as a main component.