Patent classifications
H01L33/644
DISPLAY PANEL
Provided is a display panel including a first substrate, a light-emitting unit on the first substrate, and a light-converting unit. The light-converting unit converts a first light having a first peak wavelength emitted by the light-emitting unit into a second light having a second peak wavelength. The first peak wavelength is smaller than the second peak wavelength. The light-converting unit includes light conversion particles and first heat dissipation particles. The thermal conductivity of the first heat dissipation particles is greater than 50 W.Math.m.sup.−1.Math.K.sup.−1. Provided is another display panel provided including a first substrate, a light-emitting unit on the first substrate, a pixel define layer on the first substrate, and a separation layer. The pixel define layer includes an opening to accommodate the light-emitting unit. An adhesive layer is on the first substrate. At least one of the pixel define layer and the adhesive layer includes the heat dissipation particles.
SEMICONDUCTOR DEVICE PACKAGE
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.
Light emitting element and light emitting device
A light emitting element includes: a semiconductor layered structure; a first electrically insulating film covering surfaces of the semiconductor layered structure and defining a first opening in each of a first region and a second region of a first semiconductor layer, and defining a second opening in a portion above a second semiconductor layer; a first electrode electrically connected to the first semiconductor layer through each first opening; a second electrode electrically connected to the second semiconductor layer through the second opening; a first terminal located on the first electrode and electrically connected to the first electrode; a second terminal located on the second electrode and electrically connected to the second electrode; and a metal member located on a portion of the first electrically insulating film located over the second semiconductor layer and electrically insulated from the first terminal and the second terminal.
Light source module
A light source module including a ceramic substrate, copper traces, light emitting units, and heat conductive columns is provided. The first heat conductive column and the second heat conductive column correspond to the first light emitting unit and the second light emitting unit respectively. The negative electrode of the first light emitting unit is connected to the first copper trace, the positive electrode of the second light emitting unit is connected to the second copper trace, and the positive electrode of the first light emitting unit and the negative electrode of the second light emitting unit are connected to the third copper trace. An end of the first heat conductive column is connected to the positive electrode of the first light emitting unit, and an end of the second heat conductive column is connected to the negative electrode of the second light emitting unit.
Electronic device
An electronic device is provided. The electronic device includes: a support structure, a heat-dissipation layer, a first adhesive and an electronic panel. The heat-dissipation layer is disposed on the support structure and includes at least one first hole. The first adhesive is disposed in the at least one first hole. The electronic panel is disposed on the heat-dissipation layer.
Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufacture
Methods of manufacture are described. A method includes forming a first cavity in a substrate and placing a backplane in the first cavity. At least one layer of dielectric material is formed over the substrate and the backplane. A second cavity is formed in the at least one layer of the dielectric material to expose at least a portion of a surface of the backplane. A heat conductive material is placed in the second cavity and in contact with the at least the portion of the surface of the backplane.
LIGHT SOURCE MODULE
A light source module including a ceramic substrate, copper traces, light emitting units, and heat conductive columns is provided. The first heat conductive column and the second heat conductive column correspond to the first light emitting unit and the second light emitting unit respectively. The negative electrode of the first light emitting unit is connected to the first copper trace, the positive electrode of the second light emitting unit is connected to the second copper trace, and the positive electrode of the first light emitting unit and the negative electrode of the second light emitting unit are connected to the third copper trace. An end of the first heat conductive column is connected to the positive electrode of the first light emitting unit, and an end of the second heat conductive column is connected to the negative electrode of the second light emitting unit.
BLUE PHOTON COUPLING IMPROVEMENT IN LAYER-STRUCTURED CERAMIC CONVERTER
A ceramic wavelength converter assembly may include two first layers having an undoped host material or a doped host material, two second layers having a barrier material and being disposed between the two first layers, and a third layer having an undoped host material or a doped host material and being disposed between the two second layers. The two first layers may include the undoped host material and the third layer may include the doped host material, or the two first layers may include the doped host material and the third layer may include the undoped host material. At least one of the two first layers may have a patterned structure.
FLEXIBLE RADIATIVE DECONTAMINATION APPARATUS AND METHOD OF USE
A decontamination apparatus for disinfecting a surface can include a flexible textile, an array of LEDs, and a flexible cover layer. The flexible textile can have a first side facing a first direction and a second side facing a second direction opposite the first direction. The array of LEDs can be configured to output radiation in at least two separate wavelength ranges corresponding to an ultraviolet radiation range and an infrared radiation range. The flexible cover layer can cover the array of LEDs and be transparent to at least the ultraviolet radiation range. The flexible cover layer can comprise a plurality of projections configured to maintain a consistent distance between the array of LEDs and a surface to be disinfected. The flexible textile, the array of LEDs, and the flexible cover layer can be coupled together to form a flexible blanket that conforms to a contour of the surface.
DISPLAY DEVICE
A display device a plurality of display modules, each of the plurality of display modules including: a substrate having a mounting surface and a rear surface opposite the mounting surface; a plurality of inorganic light emitting diodes provided on the mounting surface of the substrate; and a frame supporting the plurality of display modules arranged in a matrix, the frame including: a first frame layer contacting the plurality of display modules and including a material having material properties similar to material properties of the substrate; a second frame layer provided behind the first frame layer, and including a metal material; and a third frame layer provided between the first frame layer and the second frame layer and bonding the first frame layer and the second frame layer.