A light emitting device is provided. The light emitting device may include a body, first and second lead frames coupled to the body, a first light emitting chip on the first lead frame, a second light emitting chip on the second lead frame, and a reflective frame on the body and the first and second lead frames. The reflective frame may include a first opening provided therein with the first light emitting chip and a second opening provided therein with the second light emitting chip.

A semiconductor light-emitting element includes: a semiconductor stack including an n-type, layer and a p-type layer and having at least one n exposure portion being a recess where the n-type layer is exposed; a p wiring electrode layer on the p-type layer; an insulating layer (i) continuously covering inner lateral surfaces of at least one n exposure portion and part of a top surface of the p wiring electrode layer and (ii) having an opening portion that exposes the n-type layer; an n wiring electrode layer disposed above the p-type layer and the p wiring electrode layer and in contact with the n-type layer in the opening portion; and at least one first n connecting member connected to the n wiring electrode layer in at least one first n terminal region. The n wiring electrode layer and the p-type layer are disposed below at least one first n terminal region.

A light emitting diode (LED) device and packaging for same is disclosed. In some aspects, the LED is manufactured using a vertical configuration including a plurality of layers. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids design problems, including manufacturing complexities, costs and heat dissipation problems found in conventional LED devices. Some embodiments include a plurality of optically permissive layers, including an optically permissive cover substrate or wafer stacked over a semiconductor LED and positioned using one or more alignment markers.

A display apparatus includes a display panel, a panel guide supporting a lower edge of the display panel, and a backlight unit supplying light to the display panel. The backlight unit includes at least one first substrate, a plurality of light emitting elements, and a plurality of light guide structures disposed on the at least first one substrate and arranged relative to one or more of the plurality of light emitting elements.

A method of manufacturing a light emitting element mounting base member includes: arranging a plurality of core members each including an electrical conductor core and a light-reflecting insulating member provided on a surface of the electrical conductor core; integrally holding the core members with a light blocking resin; and partially removing the insulating members such that at least one surface of the electrical conductor cores is exposed from the light blocking resin.

Provided are a light emitting device and a method of fabricating the same. The light emitting device includes: a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer and including a first surface and a second surface; first and second contact electrodes each ohmic-contacting the first and second conductivity type semiconductor layers; and first and second electrodes disposed on the first surface of the light emitting structure, in which the first and second electrodes each include sintered metal particles and the first and second electrodes each include inclined sides of which the tangential gradients with respect to sides of vertical cross sections thereof are changing.

A light emitting device package is provided. The light emitting device package may include a frame, a first lead frame spaced apart from the frame, a second lead frame spaced apart from the frame, a body coupled to the frame and the first and second lead frames and having a first cavity, and a plurality of light emitting devices on the frame exposed through the first cavity. The body may include a reflective part provided inside the first cavity to surround at least one of the light emitting devices, thereby improving light extraction efficiency.

The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated from the optical element substrate by a horizontal insulating layer, on the optical element substrate. The substrate for an optical device according to a first aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of an insulating material to form a conductive layer on at least a portion of the upper surface thereof, are connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; and a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate. The substrate for an optical device according to a second aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of a metal material to be connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate; and a fitting-type vertical insulating layer which is interposed between the optical element substrate and the electrode substrate so as to be connected to the fitting means.

A light-emitting diode (LED) light source includes a plurality of electricity-conducting holding elements, and each electricity-conducting holding element is made of a thin metal sheet. The bendable LED light source increases installation of sufficient number of LED dies by lengthening the length of the LED light source. The LED light source is bent to form a spring-like helical structure and then is placed inside a lamp cover. The helical LED light source is fastened on a T-shaped element by a plurality of fastening elements and the T-shaped element is fixed on an insulated holder. Accordingly, a bulb-type LED lamp is implemented.

A method is presented for forming a structure for dissipating heat. The method includes forming a first conductive material, forming a dielectric layer over the first conductive material, and forming a second conductive material over the dielectric layer such that the first and second conductive materials are coplanar along a longitudinal axis defined by a mounting surface of the first and second conductive materials. The method further includes attaching an electronic component to the mounting surface of the first and second conductive materials such that a first electrode of the electronic component electrically contacts the first conductive material and a second electrode of the electronic component electrically contacts the second conductive material.