The present invention relates to a method and apparatus for manufacturing a plurality of electronic circuits, each electronic circuit comprising a respective flexible first portion, comprising a respective group of contact pads (contacts), and a respective flexible integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad, the method comprising:

providing (e.g. manufacturing) a flexible first structure comprising the plurality of first portions;

providing (e.g. manufacturing) a second structure comprising the plurality of flexible ICs and a common support arranged to support the plurality of flexible ICs;

dispensing an adhesive onto the first structure and/or onto the flexible ICs;

transferring said flexible ICs from the common support onto the flexible first structure such that each group of terminals is mounted on (brought into electrical contact with) a respective group of contact pads to form an electronic circuit,

providing a heated surface and an opposing surface together having a gap therebetween,

transferring the flexible first structure, comprising the electronic circuits, between the heated surface and the opposing surface such that the adhesive is cured by application of heat and pressure from the heated surface and the opposing surface thereby adhering the IC onto the respective first portion.

The present invention relates to a method and apparatus for manufacturing a plurality of electronic circuits, each electronic circuit comprising a respective flexible first portion, comprising a respective group of contact pads (contacts), and a respective flexible integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad, the method comprising:

providing (e.g. manufacturing) a flexible first structure comprising the plurality of first portions;

providing (e.g. manufacturing) a second structure comprising the plurality of flexible ICs and a common support arranged to support the plurality of flexible ICs;

dispensing an adhesive onto the first structure and/or onto the flexible ICs;

transferring said flexible ICs from the common support onto the flexible first structure such that each group of terminals is mounted on (brought into electrical contact with) a respective group of contact pads to form an electronic circuit,

providing a heated surface and an opposing surface together having a gap therebetween,

transferring the flexible first structure, comprising the electronic circuits, between the heated surface and the opposing surface such that the adhesive is cured by application of heat and pressure from the heated surface and the opposing surface thereby adhering the IC onto the respective first portion.

A wafer laminate has an adhesive layer (3) sandwiched between a transparent substrate (1) and a water (2), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (3) includes a first cured resin layer (3a) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (3b) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.

Embodiments are provided herein for a packaged semiconductor device and method of fabricating, the device including: a semiconductor die; a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure; a plurality of external connections attached to the plurality of contact pads; and a support structure including an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of the package body is attached to the inner surface of the attachment portion.

Embodiments are provided herein for a packaged semiconductor device and method of fabricating, the device including: a semiconductor die; a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure; a plurality of external connections attached to the plurality of contact pads; and a support structure including an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of the package body is attached to the inner surface of the attachment portion.

Embodiments are provided herein for a packaged semiconductor device and method of fabricating, the device including: a semiconductor die; a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure; a plurality of external connections attached to the plurality of contact pads; and a support structure including an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of the package body is attached to the inner surface of the attachment portion.

Embodiments are provided herein for a packaged semiconductor device and method of fabricating, the device including: a semiconductor die; a redistribution layer (RDL) structure on an active side of the semiconductor die, the RDL structure including a plurality of contact pads on an outer surface of the RDL structure; a plurality of external connections attached to the plurality of contact pads; and a support structure including an attachment portion and two or more standing members extending from an inner surface of the attachment portion, wherein a back side of the package body is attached to the inner surface of the attachment portion.

A method for forming a packaged semiconductor device includes attaching a first major surface of a semiconductor die to a plurality of protrusions extending from a package substrate. A top surface of each protrusion has a die attach material, and the plurality of protrusions define an open region between the first major surface of the semiconductor die and the package substrate. Interconnects are formed between a second major surface of the semiconductor die and the package substrate in which the second major surface opposite the first major surface. An encapsulant material is formed over the semiconductor die and the interconnects.

A method for forming a packaged semiconductor device includes attaching a first major surface of a semiconductor die to a plurality of protrusions extending from a package substrate. A top surface of each protrusion has a die attach material, and the plurality of protrusions define an open region between the first major surface of the semiconductor die and the package substrate. Interconnects are formed between a second major surface of the semiconductor die and the package substrate in which the second major surface opposite the first major surface. An encapsulant material is formed over the semiconductor die and the interconnects.

Fluoro-containing silicone-based storage stable temporary bonding adhesive compositions are disclosed. The adhesive compositions can be used in varied applications including, but not limited to, 3D chip integration, packaging applications, semiconductor devices, radio-frequency identification tags, chip cards, high-density memory devices, and microelectronic devices. The adhesive compositions generally comprise: a) a fluoro-containing silicone having the general formula (I); M[D.sub.oD.sup.f.sub.pD.sup.x.sub.q].sub.nM wherein M is a vinyl or hydrogen functionalized unit; D.sup.f unit comprises a fluoro-substituted group; D.sup.x unit comprises a vinyl or SiH functionalized group; 1>o0, 1>p>0, and 1>q0 wherein o+p+q=1 and p is equal to or less than 20% mole percent of the sum of o+p+q; and n is an integer from 1 to 1000; b) an alkenyl functional polydimethylsiloxane fluid; c) an alkenyl functional MQ siloxane resin; d) an SiH functional siloxane crosslinker; and e) a hydrosilylation catalyst.