A light source device includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two opposite surfaces of the substrate, a plurality of first conductive posts and second conductive posts embedded in the substrate and having the same number, a light emitter, a surrounding frame surrounding the light emitter, and a light permeable member disposed on the surrounding frame and covering the light emitter. The first conductive posts connect a first upper electrode pad of the upper electrode layer and a first lower electrode pad of the lower electrode layer. The second conductive posts connect a second upper electrode pad of the upper electrode layer and a second lower electrode pad of the lower electrode layer. The light emitter is mounted on the first upper electrode pad and is electrically connected to the second upper electrode pad.

Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heatsink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heatsink element. The heatsink element is formed by a heatsink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heatsink die towards the body and rest on the body.

Several embodiments of the present technology are described with reference to a semiconductor apparatus. In some embodiments of the present technology, a semiconductor apparatus includes a stack of semiconductor dies attached to a thermal transfer structure. The thermal transfer structure conducts heat away from the stack of semiconductor dies. Additionally, the assembly can include molded walls to support the thermal transfer structure.

Embodiments may relate to a microelectronic package comprising an integrated heat spreader (IHS) coupled with a package substrate. A sealant may be positioned between, and physically coupled to, the IHS and the package substrate. The sealant may at least partially extend from a footprint of the IHS. Other embodiments may be described or claimed.

Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A plurality of solder thermal interface material (STIM) thermal interconnects may be coupled with the die and an integrated heat spreader (IHS) may be coupled with the plurality of STIM thermal interconnects. A thermal underfill material may be positioned between the IHS and the die such that the thermal underfill material at least partially surrounds the plurality of STIM thermal interconnects. Other embodiments may be described or claimed.

A semiconductor package device includes a substrate, an electronic component, a ring frame, an encapsulant, a thermal conducting material and a lid. The electronic component is disposed on the substrate. The ring frame is disposed on the substrate and surrounds the electronic component. The encapsulant encapsulates the electronic component and a first portion of the ring frame. The encapsulant exposes a second portion of the ring frame. The encapsulant and the second portion of the ring frame define a space. The thermal conducting material is disposed in the space. The lid is disposed on the thermal conducting material and connects with the second portion of the ring frame.

The disclosure concerns a housing for a light source mounted on a substrate, the housing comprising: a molded body having an opening permitting the passage of a light beam generated by the light source; one or more surfaces for receiving a diffuser; and first and second conducting pins traversing the molded body.

A semiconductor package device includes a substrate, an electronic component, a ring frame, an encapsulant, a thermal conducting material and a lid. The electronic component is disposed on the substrate. The ring frame is disposed on the substrate and surrounds the electronic component. The encapsulant encapsulates the electronic component and a first portion of the ring frame. The encapsulant exposes a second portion of the ring frame. The encapsulant and the second portion of the ring frame define a space. The thermal conducting material is disposed in the space. The lid is disposed on the thermal conducting material and connects with the second portion of the ring frame.

Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heatsink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heatsink element. The heatsink element is formed by a heatsink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heatsink die towards the body and rest on the body.

A light source device includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two opposite surfaces of the substrate, a plurality of first conductive posts and second conductive posts embedded in the substrate and having the same number, a light emitter, a surrounding frame surrounding the light emitter, and a light permeable member disposed on the surrounding frame and covering the light emitter. The first conductive posts connect a first upper electrode pad of the upper electrode layer and a first lower electrode pad of the lower electrode layer. The second conductive posts connect a second upper electrode pad of the upper electrode layer and a second lower electrode pad of the lower electrode layer. The light emitter is mounted on the first upper electrode pad and is electrically connected to the second upper electrode pad.