A photonic integrated circuit (PIC) device includes a first PIC die including a first plurality of contact pads, each first contact pad includes a first electrical contact region including a first plurality of electrical contacts, a first optical contact region, and a first transition region disposed between the first electrical contact region and the first optical contact region, the first transition region includes a first plurality of dummy contacts.

An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.