A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die through conductive connectors. The package substrate includes a plurality of conductive lines and has a stress concentration area under the semiconductor die. One of the conductive lines within the stress concentration area includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is curved.