An elongated light circuit includes an elongated circuit trace and a plurality of micro-sized, unpackaged LEDs disposed sequentially on the circuit trace. A height of the LEDs ranges from about 12.5 microns to about 200 microns. The elongated circuit trace and the LEDs are coated with a protective coating.

A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direction toward the second frame, and a base end having a cross-sectional dimension being based, at least in part, on a cross-sectional dimension of the semiconductor die. A needle actuator is operably connected to the needle and is configured to actuate the needle such that, during the transfer operation, when the first substrate is secured in the first frame and the second substrate is secured in the second frame, the needle presses the semiconductor die into contact with the second substrate so as to transfer the semiconductor die onto the second substrate.

A display apparatus includes a substrate and a plurality of LEDs. Each LED is attached to the substrate via conductive pads on a side of the LED. A diffuser having light diffusing characteristics is aligned with the plurality LEDs against a surface of the substrate. The diffuser is aligned so as to nest around at least one LED of the plurality of LEDs.

An apparatus, for attaching a semiconductor device die to a circuit substrate, includes an elongated rod to press a holding substrate carrying the semiconductor device die into a position at which the semiconductor device die attaches to the circuit substrate; and a support including a base portion having a hole via which the elongated rod passes when actuated to press the holding substrate.

A system for performing a direct transfer of a plurality of semiconductor die from a first substrate to a second substrate based on map data of the location of the semiconductor die. A first conveyance mechanism conveys the first substrate. A second conveyance mechanism conveys the second substrate. A transfer mechanism is disposed adjacent to the first conveyance mechanism to effectuate the direct transfer. A controller causes one or more processors to perform operations including: determining positions of the plurality of semiconductor die based at least in part on map data, conveying at least one of the first substrate or the second substrate such that the first substrate, the second substrate, and the transfer mechanism are in a direct transfer position, and activating the transfer mechanism to perform the direct transfer of the plurality of semiconductor die.

A display apparatus includes a substrate and a plurality of LEDs. Each LED is attached to the substrate via conductive pads on a side of the LED. A diffuser having light diffusing characteristics is aligned with the plurality LEDs against a surface of the substrate. The diffuser is aligned so as to nest around at least one LED of the plurality of LEDs.

A circuit component for a display includes a substrate and a circuit trace having a predetermined pattern disposed on a surface of the substrate. A plurality of semiconductor die are connected to the substrate via the circuit trace. The plurality of semiconductor die are distributed across the surface of the substrate. One or more substrate orientation datum points are disposed on the substrate. The substrate orientation datum points are readable via a sensor of an apparatus that performs a transfer of the plurality of semiconductor die from a supply of die. The substrate orientation datum points provide information regarding positions on the circuit trace. The positions correspond to transfer locations for the plurality of semiconductor die, respectively.

An apparatus for performing a direct transfer of a die. The apparatus includes a first frame to hold the first substrate and a second frame to hold the second substrate. The apparatus further includes a transfer mechanism disposed adjacent to the first frame. The transfer mechanism includes a needle configured to press against the first substrate at a location collinear with the die. A controller, including one or more processors communicatively coupled with the first frame, the second frame, and the transfer mechanism, has executable instructions, which when executed, cause the one or more processors to perform operations including: determining a transfer position of the die on the first substrate via one or more sensors, and aligning the transfer position of the die with the needle of the transfer mechanism via movement of at least two of the first frame, the second frame, and the transfer mechanism.

An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to secure the wafer tape and a support frame configured to secure a support substrate. The support substrate includes a plurality of holes and secures the product substrate. The apparatus further includes an actuator to transfer the semiconductor die to a transfer location on the product substrate.

A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direction toward the second frame, and a base end having a cross-sectional dimension being based, at least in part, on a cross-sectional dimension of the semiconductor die. A needle actuator is operably connected to the needle and is configured to actuate the needle such that, during the transfer operation, when the first substrate is secured in the first frame and the second substrate is secured in the second frame, the needle presses the semiconductor die into contact with the second substrate so as to transfer the semiconductor die onto the second substrate.