A system to transfer an unpackaged die directly from a die holding substrate to a transfer location on a secondary substrate. The system includes a die separation device disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate. An energy source is disposed adjacent to the secondary substrate to apply energy to the transfer location and affix the unpackaged die directly to the secondary substrate. A sensor detects a position and orientation of the secondary substrate with respect to the unpackaged die on the die holding substrate. A processor is in communication with the die separation device, the energy source, and the sensor. The processor is configured to cause actuation of the die separation device and the energy source according, at least in part, to transfer instructions and data received from the sensor.

A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

An apparatus includes a substrate and an LED attached to the substrate via conductive pads on a first side of the LED. The LED includes a first reflective element disposed adjacent the first side of the LED so as to reflect light in a direction away from the substrate, and a second reflective element disposed adjacent a second side of the LED that opposes the first side of the LED. The second reflective element disposed so as to reflect light primarily in a direction toward the substrate.

An apparatus that directly transfers a semiconductor device die from a first substrate to a second substrate. The semiconductor device die is disposed on the first side of the first substrate. The apparatus includes a first frame to hold the first substrate, and a second frame to hold the second substrate adjacent to the first side of the first substrate. A needle is disposed adjacent to the first frame and extends in a direction toward the second side of the first substrate. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the first substrate to press the semiconductor device die into contact with the second substrate such that the semiconductor device die is released from the first substrate and is attached to the second substrate.

An apparatus includes a first frame to hold a wafer tape, and a second frame to hold a substrate adjacent to the first side of the wafer tape. A needle is disposed adjacent to the second side of the wafer tape and extends in a direction toward the wafer tape. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with a second semiconductor device die. An energy-emitting device is disposed adjacent to the substrate to induce a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

An apparatus includes a first frame to hold a wafer tape having a first side and a second side. A plurality of semiconductor device dies are disposed on the first side of the wafer tape. A second frame includes a first clamping member and a second clamping member to clamp therebetween a product substrate having a circuit trace thereon. The second frame is configured to hold the product substrate such that the circuit trace is disposed facing the dies on the wafer tape. A needle is disposed adjacent to the second side of the wafer tape. A length of the needle extends in a direction toward the wafer tape. A needle actuator is connected to the needle to move the needle to a die transfer position. A laser points toward a portion of the product substrate corresponding to the transfer position to affix the die.

An apparatus includes a substrate and a circuit trace having a predetermined pattern disposed on the substrate. A plurality of LEDs are connected to the substrate via the circuit trace. The predetermined pattern is arranged as an array of lines along a surface of the substrate, and the plurality of LEDs are distributed along the lines of the array.