An electronic device includes a substrate, a first light-emitting unit, a first light conversion unit, and a first buffer layer. The first light-emitting unit is disposed on the substrate. The first light conversion unit is disposed on the first light-emitting unit. The first buffer layer is disposed between the first light conversion unit and the first light-emitting unit. The thickness of the first light conversion unit is greater than the thickness of the first light-emitting unit.

An optoelectronic device and a method for producing an optoelectronic device are disclosed. In an embodiment a method includes arranging an optoelectronic semiconductor chip with its top side towards a surface of a carrier, forming a recess at the surface of the carrier such that the recess surrounds the optoelectronic semiconductor chip, arranging a mold compound in the recess and above the surface of the carrier such that the optoelectronic semiconductor chip is embedded into the mold compound, wherein a bottom side of the optoelectronic semiconductor chip remains at least partially not covered by the mold compound, removing the carrier and arranging a wavelength-converting material above the surface of the carrier before arranging the optoelectronic semiconductor chip, wherein the wavelength-converting material is perforated while forming the recess.

An optoelectronic device having a substrate and a plurality of sets of light-emitting diodes where each set includes a plurality of light-emitting diodes, a first lower electrode, a second upper electrode, an electronic component of an electronic circuit formed in a first portion of the substrate, on the side of the face of the substrate that does not bear the light-emitting diodes, and a first conductive means formed through the first portion and electrically connecting a first terminal of the electronic component to one amongst the first and second electrodes. The first conductive means of a given set is electrically-insulated from the first conductive means of the other sets.

An image display device according to an embodiment includes a substrate, a first wiring line formed on the substrate along a first direction, a first light-emitting element located on the first wiring line and including a first light-emitting surface, a light-transmitting electrode formed along a second direction intersecting the first direction and located on the first light-emitting surface, a first anisotropic conductive member located on the first wiring line, a first terminal electrically connected to the first wiring line via the first anisotropic conductive member, a second anisotropic conductive member located on the light-transmitting electrode, and a second terminal electrically connected to the light-transmitting electrode via the second anisotropic conductive member. The first light-emitting element includes a first bottom surface in contact with the first wiring line, and the first light-emitting surface is located on a side of the first light-emitting element opposite to the first bottom surface.

Embodiments include a device having a micro-LED that includes at least two, individually addressable light emitting diodes on a same substrate; a phosphor converter layer disposed on the micro-LED, the phosphor converter layer including phosphor particles having a D50 of greater than 1 μm and less than 10 μm.

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a semiconductor chip including a plurality of pixels, each pixel configured to emit electromagnetic primary radiation from a radiation exit surface and conversion layers located on at least a part of the radiation exit surfaces, wherein the conversion layers comprise a crosslinked matrix having a three-dimensional siloxane-based network and at least one phosphor embedded in the matrix, and wherein the conversion layers have a thickness of ≤30 μm.

A display apparatus includes: a circuit substrate; and a pixel array on the circuit substrate and including a plurality of pixels. The pixel array includes: light emitting diode (LED) cells constituting the plurality of pixels, each of the LED cells including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; wavelength converters on the LED cells; an upper semiconductor layer on the LED cells and having a partition structure; a passivation layer on side surfaces of the LED cells; a first electrode along a region of the LED cells to have a grid shape; second electrodes connected to the second conductivity-type semiconductor layers; and reflective layers between the first electrode and the second electrode along the passivation layer on the side surfaces of the LED cells and having surfaces inclined toward outside of the LED cells.

Light-emitting sub-pixels and pixels for micro-light-emitting diode-based displays are provided. Also provided are methods of fabricating individual sub-pixels, pixels, and arrays of the pixels. The sub-pixels include a double-layered film that includes a coupling layer disposed over a light-emitting diode and a light-emission layer disposed over the coupling layer.

A light emitting device and a manufacturing method thereof are provided. The light emitting device includes a light emitting unit, a fluorescent layer, a reflective layer, and a light-absorbing layer. The light emitting unit has a top surface, a bottom surface opposite to the top surface, and a side surface located between the top surface and the bottom surface. The light emitting unit includes an electrode disposed at the bottom surface. The fluorescent layer is disposed on the top surface of the light emitting unit. The reflective layer covers the side surface of the light emitting unit. The light-absorbing layer covers the reflective layer, so that the reflective layer is located between the side surface of the light emitting unit and the light-absorbing layer.

A light emitting device includes an LED having a (e.g., top) light output surface, a ceramic phosphor, and an adhesive layer positioned to attach the top of the LED to the ceramic phosphor. In one embodiment the adhesive layer is composed of multiple separate patches (regions) that define at least one channel therebetween, with the channel being open to an environment to permit oxygen permeation. The adhesive layer can be applied by a patternable dispensing system.