Provided are a display apparatus and a method of manufacturing the same. The display apparatus includes a support substrate, a driving layer provided on the support substrate and including a driving element configured to apply power to a pixel electrode, and a light-emitting layer provided on the driving layer.

A display device and a manufacturing method of a display device are provided. The display device includes a substrate including a pixel defined thereon; a light emitting diode disposed in the pixel; an insulating layer covering the light emitting diode; a light collecting structure on at least a part of the insulating layer; and a reflective layer disposed at a side surface of the light collecting structure. The side surface of the light collecting structure may have a reverse tapered shape.

A light emitting module includes a light guide plate including a first face, a second face opposing the first face, and a through part penetrating between the first face and the second face, a light emitting device disposed in the through part on a second face side, a light transmissive member disposed on the light emitting device in the through hole on a first face side and between the light emitting device and a lateral wall of the through part, and a first light reflecting member disposed between an upper face of the light emitting device and the light transmissive member while being in contact with the upper face of the light emitting device.

A method for manufacturing a light-emitting device includes providing a transparent member having a protrusion formed at an upper surface of the transparent member. A first resin portion is placed on the protrusion in which the first resin portion has a solid form and is made from a first resin material of which the viscosity decreases when heated. A light-emitting element is placed on the first resin portion, the light-emitting element is caused to be self-aligned with respect to the protrusion by reducing a viscosity of the first resin portion by heating to a first temperature. The first resin portion is solidified by cooling.

A method to produce a light-emitting device package includes mounting junctions on pads of a metalized substrate, where the junctions are at least partially electrically insulated from each other, and forming wavelength converters, where each wavelength converter is located over a different junction and separated by a gap from neighboring wavelength converters.

A method for manufacturing a planar light source includes preparing a wiring substrate including a first region that includes a light source placement section; disposing a light-reflective member in the first region of the wiring substrate; preparing a light guide plate including a first major surface, a second major surface opposite to the first major surface, and a first hole extending from the first major surface to the second major surface; disposing a light source on the light-reflective member at the light source placement section; disposing the light guide plate on the wiring substrate to cause the wiring substrate and the second major surface of the light guide plate to face each other to cause the light source to be positioned in the first hole; and disposing a first light-transmitting member in the first hole.

A method for inkjet printing includes setting a target volume and a target concentration of ink discharged to a pixel, measuring a volume and a concentration of a liquid drop for each of nozzles, selecting first nozzle groups for achieving the target volume, from a volume pool of the liquid drop for each of the nozzles, selecting second nozzle groups for achieving the target concentration, from the first nozzle groups, selecting recipes by combining brightness trend lines, from the second nozzle groups, performing a printing simulation for each of the recipes to select a final recipe, and performing inkjet printing by using the final recipe.

A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.

An electronic device includes a substrate, a first light-emitting unit, a first light conversion unit, and a first buffer layer. The first light-emitting unit is disposed on the substrate. The first light conversion unit is disposed on the first light-emitting unit. The first buffer layer is disposed between the first light conversion unit and the first light-emitting unit. The thickness of the first light conversion unit is greater than the thickness of the first light-emitting unit.

An optoelectronic device and a method for producing an optoelectronic device are disclosed. In an embodiment a method includes arranging an optoelectronic semiconductor chip with its top side towards a surface of a carrier, forming a recess at the surface of the carrier such that the recess surrounds the optoelectronic semiconductor chip, arranging a mold compound in the recess and above the surface of the carrier such that the optoelectronic semiconductor chip is embedded into the mold compound, wherein a bottom side of the optoelectronic semiconductor chip remains at least partially not covered by the mold compound, removing the carrier and arranging a wavelength-converting material above the surface of the carrier before arranging the optoelectronic semiconductor chip, wherein the wavelength-converting material is perforated while forming the recess.