Energy storage devices, battery cells, and batteries of the present technology may include a first current collector, and may include a second current collector. At least one of the first current collector and the second current collector may be a metal current collector. The battery cells may include a seal between an external region of the first current collector and an external region of the second current collector. The seal may be coupled with a first portion of a first surface of the first current collector, and may be coupled with a first portion of a first surface of the second current collector. The battery cells may also include a coupling material positioned between the seal and the first portion of the first surface of the first current collector. The coupling material may also be positioned between the seal and the first portion of the first surface of the second current collector.

A refined microcrystalline electrode manufacturing method is provided. The refined microcrystalline electrode manufacturing method includes the following step. First, an active material electrode layer is subjected to a conventional thermal annealing (CTA) process in an oxygen-containing environment at a first temperature interval to form an active material crystallization precursor; the active material crystallization precursor is subjected to a rapid thermal annealing (RTA) process in the oxygen-containing environment at a second temperature interval to form an active material coating layer with uniformly distributed fine microcrystal grains, wherein the temperature range of the second temperature interval is greater than the temperature range of the first temperature interval. In addition, a thin film battery and a thin film battery manufacturing method are also provided.

A flexible printed circuit board with a lithium ion battery printed thereon is achieved. The flexible printed circuit board comprises a top and a bottom electrically insulating base film, a top electrically conductive metal layer over the top electrically insulating base film, and a bottom electrically conductive metal layer under the bottom electrically insulating base film. A printable lithium ion battery sits in a cavity completely through the top and bottom base films wherein a top of the battery contacts the top electrically conductive metal layer and wherein a bottom of the battery contacts the bottom electrically conductive metal layer. An adhesive film around the battery seals it to the top and bottom electrically insulating base film and seals the top electrically conductive metal layer to the bottom electrically conductive metal layer.

The present invention is directed to a smart metal, glass, paper-based, wood-based, or plastic packaging comprising at least one electric power source, characterized in that a structural component of the packaging forms a component of the at least one electric power source, said structural component being a component or material layer offering a contribution to enable the packaging to contain a product or to be transported. In addition, the present invention is directed to a method for manufacturing a smart packaging is provided comprising the steps of manufacturing a packaging and constituting at least one electric power source on or in the packaging, wherein a structural component of the packaging is taken for constituting a component of the at least one electric power source, said structural component being a component or material layer offering a contribution to enable the packaging to contain a product or to

An energy storage device sits within a trench with electrically insulated sides within a substrate. Within the trench there is an anode, an electrolyte disposed on the anode, and a cathode structure disposed on the electrolyte. Variations of an electrically conductive contact are disposed on and in electrical contact with the cathode structure. At least part of the conductive contact is disposed within the trench and the conductive contact partially seals the anode, electrolyte, and cathode structure within the trench. Conductive and/or non-conductive adhesives are used to complete the seal thereby enabling full working electrochemical devices where singulation of the devices from the substrate enables high control of device dimensionality and footprint.

The present disclosure relates to systems and methods for packaging a solid-state battery. Consistent with some embodiments, a package for a solid-state battery includes a substrate, a cap disposed over the substrate and forming an enclosure with the substrate, and a solid-state battery disposed inside the enclosure. The solid-state battery includes a first electrode that is disposed over the substrate, an electrolyte that is disposed over the first electrode, and a second electrode that is disposed over the electrolyte. The package further includes a compressible component disposed inside the enclosure and between the cap and the second electrode of the solid-state battery. The compressible component applies a pressure to at least one of the electrodes of the solid-state battery in a direction substantially perpendicular to the electrode(s) of the solid-state battery.

A method for printing a flexible printed battery is disclosed. For example, the method includes printing, via a three-dimensional (3D) printer, a first substrate of the flexible thin-film printed battery, printing a first current collector on the first substrate, printing a first layer on the first current collector, printing, via the 3D printer, a second substrate, printing a second current collector on the second substrate, printing a second layer on the second current collector, and coupling the first substrate and the second substrate around a paper separator membrane moistened with an electrolyte that is in contact with the first layer and the second layer.

Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.

An all-solid battery includes: a multilayer chip having a substantially rectangular parallelepiped shape and including solid electrolyte layers and electrodes alternately stacked, the electrodes being alternately exposed to two edge faces facing each other of the multilayer chip, wherein cover layers are provided between two faces, which face in a stacking direction of the solid electrolyte layers and the electrodes, of four faces other than the two edge faces of the multilayer chip and a cell reaction region where two adjacent electrodes exposed to different edge faces face each other across the solid electrolyte layer, and an active material layer containing an electrode active material is provided between the cover layers and the cell reaction region, no cell reaction occurring between the active material layer and an outermost electrode in the cell reaction region, the solid electrolyte layer being located between the active material layer and the cell reaction region.

An all solid battery includes: a multilayer chip in which each of solid electrolyte layers and each of electrodes are alternately stacked, a main component of the solid electrolyte layers being phosphoric acid salt-based solid electrolyte, the plurality of electrodes being alternately exposed to a first end face and a second end face of the multilayer chip, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and wherein L/W is 0.2 or more and 1.1 or less, when a length of the multilayer chip in a first direction in which the first end face faces with the second end face is L, and a width of the multilayer chip in a second direction that is vertical to the first direction and a stacking direction of the multilayer chip is W.