Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

The disclosed radio frequency (RF) bandpass filter may include an RF transmission medium that defines (1) a plurality of cavities aligned parallel to each other along a major axis, where (a) each cavity includes planar surfaces that define (i) a first dimension aligned with the major axis and (ii) second and third dimensions aligned perpendicular to the major axis and each other, where the first dimension is shorter than the second and third dimensions and (b) each adjacent pair of cavities is coupled by an inter-cavity slot, (2) an RF inlet that couples a received RF signal to a first cavity at a first end of the plurality of cavities, and (3) an RF outlet that couples a filtered RF signal from a second cavity at a second end of the plurality of cavities externally to the filter. Various other filters and manufacturing methods thereof are also disclosed.

A shell of an electronic device includes a base, two sidewalls, and a plurality of terminals. The base includes upper lateral and lower lateral surfaces opposite to each other. The two sidewalls are disposed at the upper lateral surface and are located separately at two opposite sides of the base. The two sidewalls are opposite to each other, with each sidewall having a surface that faces away from the base. The plurality of terminals is symmetrically arranged in order at the other opposite sides of the base and is embedded in the base. Each terminal includes an upper section and a lower section, with the upper section vertically extending upwards from the upper lateral surface, with the lower section horizontally extending outwards from the lower lateral surface, and with at least a portion of the lower section affixed flatly to the lower lateral surface.

A shell of an electronic device includes a base, two sidewalls, and a plurality of terminals. The base includes upper lateral and lower lateral surfaces opposite to each other. The two sidewalls are disposed at the upper lateral surface and are located separately at two opposite sides of the base. The two sidewalls are opposite to each other, with each sidewall having a surface that faces away from the base. The plurality of terminals is symmetrically arranged in order at the other opposite sides of the base and is embedded in the base. Each terminal includes an upper section and a lower section, with the upper section vertically extending upwards from the upper lateral surface, with the lower section horizontally extending outwards from the lower lateral surface, and with at least a portion of the lower section affixed flatly to the lower lateral surface.

The disclosure discloses a concave triple-mode cavity resonance structure and a filter with the resonance structure. The structure comprises a cavity and a cover plate, wherein the cavity is internally provided with a dielectric resonance block and a dielectric support frame; at least one end face of the cavity and/or the dielectric response block is concave; the dielectric resonance block and the dielectric support frame form a triple-mode dielectric resonance rod; one end or any end of the cube-like dielectric resonance block is connected with the dielectric support frame; the dielectric support frame is connected with an inner wall of the cavity; and the dielectric response block and the dielectric support frame form triple-mode resonance in three directions along the X, Y and Z axes of the cavity.

The present invention relates to a multi-mode filter comprising a carrier on which is mounted a dielectric resonator having a covering of an electrically conductive material in which there is provided an aperture and a coupling structure for coupling input signals to the dielectric resonator or for extracting filtered output signals from the dielectric resonator. The carrier is provided with an enclosing formation of electrically conductive material, which enclosing formation is electrically coupled to the electrically conductive covering of the dielectric resonator, such that the covering and the enclosing formation together form an electrically conductive enclosure for the dielectric resonator. The enclosure formed from the covering of the dielectric resonator and the enclosing formation increases the isolation of the filter and reduces leakage. The filter of the present invention is particularly suitable for use in cascaded resonator filter arrangements, and in duplex/diplex filters.

Resonant cavity filters include a conductive housing having a floor. A dielectric resonator is mounted to extend upwardly from the floor. The dielectric resonator has a cylindrical body with a longitudinal bore that defines an inner sidewall. The longitudinal bore has a variable transverse cross-sectional area. A threaded dielectric fastener is at least partially inserted within the longitudinal bore of the cylindrical body. The dielectric resonator may have a protrusion that extends inwardly from the inner sidewall.

Various substrate-integrated waveguide (SIW) filtering crossover systems are described. An example SIW filtering crossover system may include: a substrate; a top metal plate placed on top of the substrate; a bottom metal plate placed beneath the substrate; a plurality of metalized via-holes in the substrate connecting the top metal plate and the bottom metal plate; and a plurality of grounded-coplanar-waveguides (GCPWs) coupled to sidewalls of the crossover system, wherein each of the GCPWs connects the crossover system to a respective microstrip line for signal transmission between the respective microstrip line and the crossover system.

Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.

A radar device for limiting radio-frequency power leakage is provided. The radar device includes a first component, and a second component. The first component has a first surface and a first waveguide that defines a first cavity. The second component has a second surface and a second waveguide that defines a second cavity. A first groove is provided that acts as a choke, and the first groove is defined in the first surface. The first component and the second component are assembled so that an air gap is maintained between the first waveguide and the second waveguide. The first waveguide and the second waveguide are configured to facilitate transmission of radio-frequency power. The first groove is configured to reduce leakage of radio-frequency power through the air gap. Additional chokes may also be included.