Patent classifications
H01P1/211
DIELECTRIC FILTER, ARRAY ANTENNA DEVICE
To obtain a downsized dielectric filter suitable for a laminating structure, a dielectric filter is configured with use of a dielectric waveguide formed of a conductor pattern and vias in a laminating direction within a multilayer dielectric substrate, two strip lines formed in a planar direction of the multilayer dielectric substrate, and two strip line-waveguide converters each configured to perform transmission line conversion between the dielectric waveguide and each strip line. In this manner, it is possible to provide a dielectric filter for which an area to be occupied in the planar direction of the multilayer dielectric substrate is suppressed.
WAVEGUIDE FILTER
The present disclosure relates to a filter for filtering wavelengths of an electromagnetic signal to provide a filtered signal. The filter includes: at least one commensurate-line structure (CLS); and, at least one stub-modified commensurate-line structure (SMCLS) arranged to provide a corresponding at least one transmission zero in the filtered signal.
ADDITIVELY MANUFACTURED RADIO FREQUENCY FILTER
A radio frequency filter apparatus is disclosed, including an elongate hollow body portion having an inner side and an outer side. The apparatus further includes an iris structure on the inner side of the body portion and a stiffening structure on the outer side of the body portion. The stiffening structure is aligned with the iris structure.
WAVEGUIDE BAND-PASS FILTER
A bandpass filter has a plurality of resonant cavities. The plurality of resonant cavities are arranged into a sequence of adjacent resonant cavities. Each resonant cavity is configured to define the same fundamental resonant frequency. The filter includes a plurality of coupling irises, with one of the coupling irises positioned between each pair of adjacent resonant cavities. Each resonant cavity includes a plurality of cavity sections. Each resonant cavity includes a capacitive iris positioned coupling the cavity sections to one another. The frequency of secondary resonance modes varies amongst the resonant cavities in the plurality of resonant cavities.
PHASED ARRAY ANTENNA
A phased array is disclosed, including: a base layer including a substrate with a plurality of protruding posts, for stopping wave propagation along the base layer, and a printed circuit board (PCB) arranged on the base layer, and including at least one phased array radio frequency (RF) integrated circuit (IC) on a first side of the PCB facing the base layer and the protruding posts. The PCB further includes feeds for transferring of RF signals from the phased array RF IC(s) to an opposite second side of the PCB. A radiating layer, including a plurality of radiating elements for transmitting and/or receiving RF signals from the phased array antenna is also provided, together with a feeding layer for transfer of RF signals, arranged between the feeds of the PCB on the second side and the radiating elements of the radiating layer.
Transmission line device
A transmission line device includes: a plurality of electrically conductive members stacked with interspaces therebetween, the plurality of electrically conductive members including three or more electrically conductive members; and a plurality of artificial magnetic conductors each located between two adjacent electrically conductive members among the plurality of electrically conductive members. Among the plurality of electrically conductive members, at least one electrically conductive member located between two endmost electrically conductive members is shaped as a plate having at least one slit. At least a portion of the plurality of artificial magnetic conductors is located around the at least one slit to suppress leakage of an electromagnetic wave propagating along the at least one slit.
Transmission line device
A transmission line device includes: a plurality of electrically conductive members stacked with interspaces therebetween, the plurality of electrically conductive members including three or more electrically conductive members; and a plurality of artificial magnetic conductors each located between two adjacent electrically conductive members among the plurality of electrically conductive members. Among the plurality of electrically conductive members, at least one electrically conductive member located between two endmost electrically conductive members is shaped as a plate having at least one slit. At least a portion of the plurality of artificial magnetic conductors is located around the at least one slit to suppress leakage of an electromagnetic wave propagating along the at least one slit.
TRANSITION ARRANGEMENT, A TRANSITION STRUCTURE, AND AN INTEGRATED PACKAGED STRUCTURE
A transition arrangement including a first transmission line being a planar transmission line including a coupling section and being disposed on a dielectric substrate layer. The substrate layer has a periodic or quasi-periodic structure arranged in the substrate layer such as to be disposed along at least part of the first transmission line and to partly surround the coupling section. The transition arrangement includes a conducting layer on which the substrate layer is arranged and which is adapted to act as a ground plane, and the periodic or quasi-periodic structure is so arranged and at such a distance from the first transmission line and/or the coupling section that EM energy, RF power, can be coupled contactlessly between the first transmission line and the periodic or quasi-periodic structure, the transition between the first transmission line and the periodic or quasi-periodic structure being planar and contactless without any galvanic contact.
Microwave or millimeter wave RF part realized by die-forming
A method and apparatus for producing an RF part of an antenna system is disclosed, as well as thereby producible RF parts. The RF part has at least one surface provided with a plurality of protruding elements. In particular, the RF part may be a gap waveguide. The protruding elements are monolithically formed and fixed on a conducting layer, and all protruding elements are connected electrically to each other at their bases via the conductive layer. The RF part is produced by providing a die having a plurality of recessions forming the negative of the protruding elements of the RF part. The die may be a multilayer die, having several layers, at least some having through-holes to form the recessions. A formable piece of material is arranged on the die, and pressure is applied, thereby compressing the formable piece of material to conform with the recessions of the die.
Microwave or millimeter wave RF part realized by die-forming
A method and apparatus for producing an RF part of an antenna system is disclosed, as well as thereby producible RF parts. The RF part has at least one surface provided with a plurality of protruding elements. In particular, the RF part may be a gap waveguide. The protruding elements are monolithically formed and fixed on a conducting layer, and all protruding elements are connected electrically to each other at their bases via the conductive layer. The RF part is produced by providing a die having a plurality of recessions forming the negative of the protruding elements of the RF part. The die may be a multilayer die, having several layers, at least some having through-holes to form the recessions. A formable piece of material is arranged on the die, and pressure is applied, thereby compressing the formable piece of material to conform with the recessions of the die.