Patent classifications
H01P1/2135
Tunable radio frequency circuit, control method and electronic device including the same
An embodiment of the disclosure provides a tunable radio frequency (RF) circuit, a control method, and an electronic device including the same. An electronic device according to an embodiment of the disclosure may include an antenna, a transceiver, a tunable radio frequency (RF), and at least one processor operatively coupled with the transceiver and the tunable RF circuit. The tunable RF circuit may further include a switch, a low noise amplifier (LNA), a power amplifier (PA), a fixed filter configured to pass signals in a first frequency band, and attenuate signals in a second frequency band at least one tunable filter configured to pass signals in at least a portion of the second frequency band, where the portion of the second frequency band is tunable, and at least one detector configured to detect a signal strength passing through the at least one tunable filter.
COMPACT SUBSTRATE-INTEGRATED WAVEGUIDE FILTERING CROSSOVER DEVICES AND SYSTEMS
Various substrate-integrated waveguide (SIW) filtering crossover systems are described. An example SIW filtering crossover system may include: a substrate; a top metal plate placed on top of the substrate; a bottom metal plate placed beneath the substrate; a plurality of metalized via-holes in the substrate connecting the top metal plate and the bottom metal plate; and a plurality of grounded-coplanar-waveguides (GCPWs) coupled to sidewalls of the crossover system, wherein each of the GCPWs connects the crossover system to a respective microstrip line for signal transmission between the respective microstrip line and the crossover system.
Duplexers and related devices for 5G/6G and subsequent protocols and for mm-wave and terahertz applications
A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced Transparency (EIT) window within a frequency absorption region of the bandpass filter to allow a signal to pass at a pre-tuned frequency band.
DUPLEXERS AND RELATED DEVICES FOR 5G/6G AND SUBSEQUENT PROTOCOLS AND FOR MM-WAVE AND TERAHERTZ APPLICATIONS
A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced Transparency (EIT) window within a frequency absorption region of the bandpass filter to allow a signal to pass at a pre-tuned frequency band.
TERAHERTZ MIXER, METHOD OF MANUFACTURING TERAHERTZ MIXER, AND ELECTRONIC DEVICE INCLUDING TERAHERTZ MIXER
The present disclosure provides a terahertz mixer, a method of manufacturing the terahertz mixer, and an electronic device including the mixer. The terahertz mixer includes: a cavity for forming a radio frequency input waveguide and a local oscillator input waveguide, and for accommodating a microstrip line; the microstrip line formed on at least a part of an inner surface of the cavity by using a semiconductor growth process, wherein the microstrip line extends into a portion of the cavity where the radio frequency input waveguide is located so as to form a microstrip antenna for receiving a radio frequency input signal, and into a portion of the cavity where the local oscillator input waveguide is located so as to form a microstrip antenna for receiving a local oscillator input signal.
MULTI-POLE RF FILTERS
Multi-pole filters are provided herein. A multi-pole filter includes a substrate having a first resonator layer on a first side of the substrate and a second resonator layer that is electrically coupled to the first resonator layer and is on a second side of the substrate that is opposite the first side of the substrate.
FILTER WITH AN ENCLOSURE HAVING A MICROMACHINED INTERIOR USING SEMICONDUCTOR FABRICATION
An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. Other metal traces on the other surface of the substrate also provide reference ground. Bottom and top enclosures that enclose the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the bottom and top enclosures engage reference ground metal traces on respective surfaces of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.
METHOD FOR ESTABLISHING ULTRA WIDE BAND CLASS I CHEBYSHEV MULTI-SECTION WILKINSON POWER DIVIDER HAVING EQUAL RIPPLE ISOLATION CHARACTERISTIC
The disclosure discloses a method for establishing an ultra wide band (UWB) class I Chebyshev multi-section Wilkinson power divider having equal ripple isolation characteristic, including: step 1, determining a Chebyshev equal ripple order required in the designed circuit and calculating a class I Chebyshev polynomial in the same order, and meanwhile determining the equal ripple heights of S.sub.11 and S.sub.32; step 2, carrying out even-mode analysis on the power divider, calculating an ABCD matrix expression under the even-mode condition according to the Chebyshev equal ripple order and the number of the required coupled line units, calculating equivalent conditions, and then obtaining a Z.sub.ev impedance value of each section of coupled line; step 3, carrying out odd-mode analysis on the power divider so that each zero position and each peak ripple position of S.sub.32 and S.sub.11 are the same.
Lumped circuit balance converter applied to double-sided parallel lines
The present invention discloses a lumped circuit balance converter applied to double-sided parallel lines, comprising a radio frequency transceiver, a balance converter, a filter and a matching network. The filter is connected with the matching network through the balance transmission line. The balance converter comprises a second circuit block, a first circuit block, a third circuit block, a first port, a second port and a third port. A positive polarity of a signal is positioned at the top of the second port and the bottom of the third port. Balance signals are respectively fed to the converter at the top of the second port and the bottom of the third port, and the signals are combined in the first port. The present invention has simple structure and better effect when used, can be easily changed to different required performance, and has good applicability and strong practicability.
Radio frequency filter module
A radio frequency filter module includes: an antenna package including patch antennas and having first and second frequency passbands different from each other; an integrated circuit (IC) package including an IC; and a connecting member disposed between the antenna package and the IC package, and having a laminated structure configured to electrically connect the patch antennas and the IC to each other. The connecting member includes: a first radio frequency filter pattern having the first and second frequency passbands, and including a first port electrically connected to the IC and a second port electrically connected to at least one of the patch antennas; and a second radio frequency filter pattern having the first and second frequency passbands, and including a third port electrically connected to the IC and a fourth port electrically connected to at least another one of the patch antennas.