A composite electronic device comprises a ceramic waveguide, CWG, device having at least two input/output, I/O, ports; and a ceramic stripline, CS, device comprising at least one stripline transmission paths having at least two I/O ports. The CS device is affixed to the CWG device such that at least one of the I/O ports of the CWG device is electrically connected to a corresponding one I/O port of the CS device.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A suspended microstrip filtering device comprises a printed circuit board that includes a substrate having at least one resonator thereon, a ground plate, and an insulating separator interposed between the printed circuit board and the ground plate, the insulating separator having a plurality of air-filled openings.

The present invention provides a base station antenna, including power dividers, network calibration modules, and connectors. The base station antenna further includes at least two phase shifters. At least one phase shifter is integrated with a combiner, the connectors are connected to the network calibration modules, and the network calibration modules are connected to the phase shifters. The one phase shifter integrated with the combiner is connected to the power divider, and at least one output port of the at least one other phase shifter is connected to the phase shifter integrated with the combiner. The base station antenna has an integrated design of phase shifters and combiners, which allows cables in different bands to be shared, reduces a quantity of used cables, is easy to implement in an actual layout and production, facilitates the layout and heat dissipation on the whole, satisfies user requirements, and reduces costs.

A matching module includes an inductor pattern including a first inductor pattern and a second inductor pattern, each respectively provided in a spiral shape, and a connection pattern connecting the first inductor pattern and the second inductor pattern and provided in a central region of a dielectric sheet, and a capacitor pattern provided in an edge region of the dielectric sheet and configured to form mutual capacitance with the inductor pattern, wherein rotational directions of the first inductor pattern and the second inductor pattern that are provided in the spiral shape are the same.

An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.

Conventional coaxial wiring devices present a problem in that the management of the manufacturing process therefor is difficult. A coaxial wiring device according to the present invention includes a first member, a second member, and a conductor plate. The first member (10) and the second member (30) include, when a line that connects a first port and a second port is denoted by a reference line, a first groove (11) that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove (12) that connects one end (FN1) of the first groove (11) and the first port; a third groove (13) that connects the other end (FN2) of the first groove (11) and the first port and has a shape that is line symmetrical to the second groove (12) with respect to the reference line; a fourth groove (14) that connects one end (FN1) of the first groove (11) and the second port; and a fifth groove (15) that connects the other end (FN2) of the first groove (11) and the second port and has a shape that is line symmetrical to the fourth groove (14) with respect to the reference line.

Structures for a frequency divider, methods of fabricating a frequency divider, and method of using a frequency divider. A first interconnect line is configured to selectively conduct a first signal of a first frequency. A second interconnect line is coupled with the first interconnect line. The second interconnect line is configured to selectively conduct a second signal of a second frequency. The first frequency is less the second frequency.

An active waveguide transition includes a waveguide defining a waveguide volume and including a back short wall at a first end. A first probe is mounted on the waveguide in an operable position extending into the waveguide volume, and a first RF electrical signal connector is mounted on the active waveguide transition. A first circuit assembly is mechanically coupled to an exterior surface of the waveguide, the circuit assembly including a first multi-layer ceramic substrate with an RF amplifier system mounted thereon. The RF amplifier system is electrically coupled to the multi-layer ceramic substrate, the first probe, and the first RF electrical signal connector to define an active first signal path for RF communication signals between the probe and first RF signal connector.

Structures for a frequency divider, methods of fabricating a frequency divider, and method of using a frequency divider. A first interconnect line is configured to selectively conduct a first signal of a first frequency. A second interconnect line is coupled with the first interconnect line. The second interconnect line is configured to selectively conduct a second signal of a second frequency. The first frequency is less the second frequency.