A method of manufacturing an acoustic wave element includes simultaneously forming a plurality of electrodes on a piezoelectric substrate, the plurality of electrodes including first and second IDT electrodes and a connection electrode, forming an insulation over the plurality of electrodes and the piezoelectric substrate, the insulation having a first thickness in a direction perpendicular to the surface of the piezoelectric substrate over the second IDT electrode, processing a first portion of the insulation over the first IDT electrode and a second portion of the insulation over the connection electrode to reduce a thickness of the first and second portions of the insulation to a second thickness, and processing a third portion of the insulation over the surface of the second IDT electrode to reduce the first thickness of the third portion to a third thickness, the third thickness being greater than the second thickness.

Conventional coaxial wiring devices present a problem in that the management of the manufacturing process therefor is difficult. A coaxial wiring device according to the present invention includes a first member, a second member, and a conductor plate. The first member (10) and the second member (30) include, when a line that connects a first port and a second port is denoted by a reference line, a first groove (11) that has a central point on the reference line and extends in a direction that intersects with the reference line; a second groove (12) that connects one end (FN1) of the first groove (11) and the first port; a third groove (13) that connects the other end (FN2) of the first groove (11) and the first port and has a shape that is line symmetrical to the second groove (12) with respect to the reference line; a fourth groove (14) that connects one end (FN1) of the first groove (11) and the second port; and a fifth groove (15) that connects the other end (FN2) of the first groove (11) and the second port and has a shape that is line symmetrical to the fourth groove (14) with respect to the reference line.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Embodiments of the present invention disclose a microstrip multiplexer, including a feeder, multiple microstrip filters, and a signal processing network. The multiple microstrip filters are separately connected to the signal processing network, and the signal processing network is connected to the feeder. Output signals of the microstrip filters of the multiple microstrip filters are combined by using the signal processing network and then output by using the feeder and/or a signal input from the feeder is split by using the signal processing network and then output to the microstrip filters. In the embodiments of the present invention, a wideband multiplexer that combines multiple wide subband signals for using can be implemented, and each subband has good frequency band response.

An antenna includes a frequency dependent divider circuit configured to receive an input signal and generate an output signal, the output signal having a power level based on a frequency of the input signal and a radiating element that is responsive to the first output signal.

A multi-band antenna system includes an array of wide-band radiating elements and a multi-band electrical tilt circuit. The multi-band electrical tilt circuit includes a plurality of combiners, a first RF band variable phase shifter and a second RF band variable phase shifter implemented in a common medium. The common medium may comprise a PCB, a stripline circuit, or the like. Each combiner includes a combined port, a first RF band port, and a second RF band port. The combined ports are coupled to the radiating elements. The first RF band phase shifter has a first plurality of variably phase shifted ports connected to the first RF band ports of the combiners via transmission line, and the second RF band phase shifter has a second plurality of variably phase-shifted ports connected to the second RF band ports of the combiners via transmission line. The phase shifters are independently configurable.

A cable structure includes isolation layers, a first signal wire, a second signal wire, a first ground wire, a second ground wire, a first conductor, and a second conductor. These signal and ground wires are parallel along a first direction and between the isolation layers. These signal wires are adjacent, and the ground wires are respectively at outer sides of these signal wires. The first conductor is on at least one of the isolation layers along a second direction orthogonal to the first direction and is electrically connected to the first and second ground wires. The second conductor is on an outer surface of at least one of the second isolation layers along the first direction and is electrically connected to the first conductor. The second conductor is symmetrical based on a central line between the first and second signal wires.

A multi-band antenna system includes an array of wide-band radiating elements and a multi-band electrical tilt circuit. The multi-band electrical tilt circuit includes a plurality of combiners, a first RF band variable phase shifter and a second RF band variable phase shifter implemented in a common medium. The common medium may comprise a PCB, a stripline circuit, or the like. Each combiner includes a combined port, a first RF band port, and a second RF band port. The combined ports are coupled to the radiating elements. The first RF band phase shifter has a first plurality of variably phase shifted ports connected to the first RF band ports of the combiners via transmission line, and the second RF band phase shifter has a second plurality of variably phase-shifted ports connected to the second RF band ports of the combiners via transmission line. The phase shifters are independently configurable.

The present invention provides filter assemblies, tuning elements and a method of tuning a filter. A filter assembly includes a housing having a top cover, a bottom cover and at least one sidewall, the top cover, the bottom cover and the at least one sidewall defining an internal cavity, the housing configured to receive first through third radio frequency (RF) transmission lines; a top metal sheet mounted within the internal cavity that has a plurality of openings that form a first hole pattern; and a bottom metal sheet mounted within the internal cavity that has a plurality of openings that form a second hole pattern. The top and bottom metal sheets are vertically spaced-apart from each other in a vertically stacked relationship within the internal cavity. The top metal sheet and the bottom metal sheet each include at least one resonator.

Embodiments of this disclosure provide a combiner, which includes an external conductor and an internal conductor, the external conductor and the internal conductor form at least two band-stop filters, and the at least two band-stop filters form at least two passbands; the at least two passbands include a first target combined passband and a second target combined passband, and a frequency of the first target combined passband is lower than a frequency of the second target combined passband; and a signal channel is included between a signal input end and a signal output end of a band-stop filter to which the second target combined passband belongs, the signal channel is formed by the internal conductor, and the internal conductor forming the signal channel includes a capacitor. Implementing the present invention can shorten a length of a main transmission line of the signal channel, and reduce a volume of the combiner.