A wideband termination circuit layout is provided for high power applications. The circuit layout may include a dielectric layer having a first surface and a second surface. The circuit layout may also include an input port disposed over the first surface. The circuit layout may further include at least two resistive film patches disposed over the first surface of the dielectric layer and a tuning line between the at least two resistive films disposed over the first surface of the dielectric layer. The at least two resistive film patches are connected in series with the at least one tuning line.

A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

Disclosed are various embodiments for a pre-matched power resistance system including a pre-matching network for use with a passive electrical device, such as a Lange coupler or a Wilkinson power splitter, where the system provides a predetermined input impedance across a predetermined target bandwidth. The pre-matched power resistance system network further includes an on-chip thin film resistor disposed on a substrate comprising a plurality of coplanar sub-resistors electrically isolated from one another and a manifold portion comprising a plurality of manifold traces in a tiered arrangement terminating in an electrical connection to a respective one of the coplanar sub-resistors.

Lossy members, which are disposed to overlap with a part of branch conductors in a signal conductor, respectively, and cause a loss of the power of signals flowing in the branch conductors, and via holes connecting each of the output terminals of the signal conductor and the ground conductor are included. The branch conductor includes a delay circuit having an electrical length of 90 degrees.

A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

An energy absorbing circuit includes a power divider that is configured to divide an incoming RF signal into a plurality of RF component signals; a plurality of transmission lines that are connected with the power divider, each of the transmission lines configured to transmit a respective RF component signal of the plurality of RF component signals; and a plurality of matching elements, each matching element being terminated to a respective one of the transmission lines.

A high frequency termination for converting a high frequency electrical signal of a circuit into heat. The high frequency termination includes a substrate. The high frequency termination also includes a spiral resistor formed on the substrate and having a first end and a second end. The high frequency termination also includes a conductive pad electrically coupled to the first end of the spiral resistor. The high frequency termination also includes a contact electrically coupled to the conductive pad and configured to connect to the circuit.

A wideband termination circuit layout is provided for high power applications. The circuit layout may include a dielectric layer having a first surface and a second surface. The circuit layout may also include an input port disposed over the first surface. The circuit layout may further include at least two resistive film patches disposed over the first surface of the dielectric layer and a tuning line between the at least two resistive films disposed over the first surface of the dielectric layer. The at least two resistive film patches are connected in series with the at least one tuning line.

A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

A wideband termination circuit layout is provided for high power applications. The circuit layout may include a dielectric layer having a first surface and a second surface. The circuit layout may also include an input port disposed over the first surface. The circuit layout may further include at least two resistive film patches disposed over the first surface of the dielectric layer and a tuning line between the at least two resistive films disposed over the first surface of the dielectric layer. The at least two resistive film patches are connected in series with the at least one tuning line.