Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

A signal termination is used within an electronic circuit to terminate signals thereof. The electronic circuit comprises at least two or more layers spaced apart along a vertical axis of the electronic circuit. Furthermore, the electronic circuit comprises a conductor on each layer and a via structure extending along the vertical axis between at least two of the two or more layers and contacting the conductors of two layers, thereby defining a signal path between the layers. Moreover, a termination comprising an absorber sheet is installed on the electronic circuit by covering the via structure with the absorber sheet to absorb a signal traveling along the signal path, thereby terminating the signal at high frequencies.

A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

A communication apparatus includes a transmission path arranged on a substrate, a signal source connected to an input portion of the transmission path, a metal member configured to function as a ground portion for the transmission path and having a space between the metal member and the transmission path, and a termination circuit configured to terminate the transmission path, wherein the termination circuit is arranged on a surface of the substrate on which the metal member is arranged.