H01P3/088

TRANSMISSION LINE DEVICE
20200194859 · 2020-06-18 ·

A transmission line device includes first and second transmission lines. The first transmission line includes a first electrode pad that is electrically connected to a first signal conductor pattern, and a second electrode pad and a third electrode pad that are portions of a first ground conductor pattern. The second transmission line includes a fourth electrode pad that is electrically connected to a second signal conductor pattern, and a fifth electrode pad and a sixth electrode pad that are portions of a second ground conductor pattern. The first electrode pad is between the second electrode pad and the third electrode pad, and the fourth electrode pad is between the fifth electrode pad and the sixth electrode pad. The second electrode pad and the third electrode pad are larger than the first electrode pad, and the fifth electrode pad and the sixth electrode pad are larger than the fourth electrode pad.

Transmission line and electronic device

In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.

Signal transmission line including a signal conductor and reinforcing conductor portions parallel to the signal conductor

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

LOW-LOSS AND FLEXIBLE TRANSMISSION LINE-INTEGRATED MULTI-PORT ANTENNA FOR MMWAVE BAND

Disclosed is a low-loss and flexible transmission line-integrated multi-port antenna for an mmWave band. The multi-port antenna includes a plurality of antennas arranged on different substrate layers to form a multi port and a plurality of transmission lines corresponding to the plurality of antennas, respectively, in which central conductors used as signal lines of the transmission lines are integrated with corresponding electricity feeding portions of the antennas and arranged on different layers. Here, the antennas each include a dielectric substrate formed as a dielectric having a certain thickness on a ground plate, and a signal conversion portion formed on the dielectric substrate and configured to convert an electrical signal of a mobile communication terminal into an electromagnetic wave signal and radiate the electromagnetic wave signal into the air or to receive an electromagnetic wave signal in the air into an electrical signal of a mobile communication terminal.

DISTRIBUTOR AND SYNTHESIZER

A distributor and a synthesizer with low loss are disclosed. In one example, a distributor/synthesizer has a distribution line that distributes a path from an input branch unit connected to an external transmission line on an input side into n-distributed paths. An output branch unit divides the n-distributed paths into an internal side and an external transmission line on an output side. On the internal side, a phase adjustment unit is arranged between the output branch unit and a coupling terminal, and adjusts the phase. A phase rotation amount from the input branch unit to the output branch unit of each of the n-distributed paths is /2 [rad], and a phase rotation amount from the output branch unit to the coupling terminal is [rad] or a real number multiple of [rad]. The present disclosure can, for example, be applied to an FEM of a signal processing device.

HIGH FREQUENCY FLEXIBLE FLAT CABLE
20200161733 · 2020-05-21 ·

A high frequency flexible flat cable includes a first metal isolation layer, a first low-k dielectric adhesive layer attached to one side of the first metal isolation layer, a second low-k dielectric adhesive layer attached another side of the first metal isolation layer and at least two conductor layers respectively attached to the first low-k dielectric adhesive layer and the second low-k dielectric adhesive layer. In addition, the high frequency flexible flat cable further includes a third low-k dielectric adhesive layer, a fourth low-k dielectric adhesive layer, a second metal isolation layer and a third metal isolation layer. The second metal isolation layer and the third metal isolation layer are respectively adhered to outsides of the conductor layers by using the third low-k dielectric adhesive layer and the fourth low-k dielectric adhesive layer to adjust the impedance of the high frequency flexible flat cable according to requirements.

Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs

Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

Dual stripline test fixture apparatuses and methods

A dual stripline assembly includes a first stripline, a second stripline, and an intermediate member. The first stripline includes a first center conductor, first outer ground plane, and first inner ground plane. The first center conductor is spaced apart from and interposed between the first outer ground plane and the first inner ground plane. The first stripline extends along a length of the assembly. The second stripline includes a second center conductor, second outer ground plane, and second inner ground plane. The second center conductor is spaced apart from and interposed between the second outer ground plane and the second inner ground plane. The second stripline extends along the length of the assembly. The intermediate member extends along the length of the assembly, and includes the first inner ground plane and the second inner ground plane.

MULTI-ANTENNA SYSTEM

A multi-antenna system includes an antenna part and a cable part. The antenna part includes comprising antenna lines forming antenna elements. The cable part includes a feeding lines for the antenna elements. Both the antenna part and the cable part are implemented using a flexible printed circuit board. The antenna part includes a single conductor layer area. The cable part includes a three conductor layer area.

CIRCUIT STRUCTURE
20200112076 · 2020-04-09 · ·

Provided is a circuit structural body is formed into a shape including: A circuit structural body, including: a multilayer board, which includes a plurality of layers of a first to N-th tri-plate structural bodies each including a first to N-th (N is an integer of 2 or more) planar conductors; an interlayers connection conductor, which is configured to connect the first to N-th planar conductors to each other; and a side-surface ground conductor, which is formed on a side surface of the multilayer board, and is approximately parallel to and near the interlayers connection conductor.