An antenna module includes a multilayer board, a phased array antenna that includes antenna elements arranged on an outer face of a second conductor layer included in the multilayer board and adjusts one or more beam directions of the antenna elements, a radio frequency (RF) chip that is arranged on an outer face of first conductor layers included in the multilayer board and outputs the radio frequency signal, a matching circuit that is arranged on the outer face of the first conductor layers and adjusts matching between impedance of the antenna elements and impedance of the RF chip, a through hole that couples the first conductor layers and the second conductor layer, and one or more vias that are on an outer side in a diameter direction of the through hole and couples the first conductor layers.

The present invention includes a method of making a RF impedance matching device in a photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF Transmission Line in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

This document describes a twin line fed dipole array antenna that may be coupled to several different types of feed networks in a space-efficient manner. The antenna makes use of a twin line feed to a plurality of dipoles that minimizes cross-polarization. The antenna may be manufactured on a printed circuit board (PCB) and has a centered feed slot that is easily coupled to several different types of waveguides or a microstrip. In some implementations, the dipole elements may have an approximately rectangular shape. In other implementations, the dipole elements may have an approximately bowtie shape, round shape, oval shape, C-shape, or L-shape. The size and placement of the dipole elements may be optimized for certain operating frequencies of the radar system to which the antenna is coupled.

A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.

The invention provides a bandpass filter, comprising: a substrate with a plurality of dielectric layers; a plurality of resonators; and a plurality of ground layers each having one slot arranged on; wherein the plurality of resonators are arrayed vertically each on respective one of the plurality of dielectric layers alternately without any of offsets, and each of the plurality of ground layers is between adjacent dielectric layers. Adjacent slots are arranged in opposite sides of the ground layers. The invention also provides a method of fabricating the bandpass filter.

A transmission line transition that couples RF energy between a coaxial cable and an air dielectric microstrip is provided. In some embodiments, the transition can combine a thin printed circuit board substrate and an insulating surface to form an effective capacitive coupling transition that can couple RF energy from the center conductor of a coaxial cable to an air microstrip. In some embodiments, the transition can include an insulating system affixed to a metallic surface, and the insulating system can secure an airstrip conductor in close proximity to an inner conductor of a coaxial cable to capacitively couple the airstrip conductor to the inner conductor of the coaxial cable. In some embodiments, the transition can employ a metallic body coated with an insulating surface to capacitively couple RF energy from the center conductor of the coaxial cable to the air microstrip.

A compact impedance transformer is disclosed having a first dielectric substrate, a first planar conductor disposed on a top surface of the first dielectric substrate in a loop, a second planar conductor disposed on a bottom surface of the first dielectric substrate in a second loop, wherein the first planar conductor and the second planar conductor are substantially identical and in stacked alignment. A second dielectric substrate has a third planar conductor disposed on a top surface of the second dielectric substrate in a third loop, and a fourth planar conductor disposed on a bottom surface of the second dielectric substrate in a fourth loop, wherein the third planar conductor and the fourth planar conductor are substantially identical and in stacked alignment. An interconnect structure between terminals of the first planar conductor, the second planar conductor, the third planar conductor, and the fourth planar conductor provide impedance transformations.

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

An electromagnetic coupler that couples antenna signals for a wideband antenna positioned between glass layers of an automotive windshield. The coupler includes a first co-planar waveguide (CPW) formed on one side of a glass layer and a second CPW formed on the other side of the glass layer, where the first and second CPWs are a mirror, or near-mirror, and 180° rotated images of each other. Both the first and second CPWs include a conductive plane where removed portions of the plane define a wide CPW section and a narrow CPW section that are electrically coupled to each other, and where the remaining portions of the conductive plane are ground planes, and where the electromagnetic signals are coupled through the glass layer between the wide CPW sections.

A flexible substrate (1) is bent at a bending part (2). A dielectric plate (3) has first and second main surfaces opposite to each other. A high-frequency signal line (4) is provided on the first main surface of the dielectric plate (3). A ground conductor (5) is provided on the second main surface of the dielectric plate (3). The high-frequency signal line (4) and the ground conductor (5) form a micro strip line. A local absent part (6) facing the high-frequency signal line (4) is provided on the ground conductor (5) only at the bending part (2).