Provided is a balun structure, including: a first dielectric layer, a second dielectric layer, a ground electrode, an unbalance electrode, and a balance electrode. The first dielectric layer, the ground electrode, the second dielectric layer are successively stacked, and the ground electrode has a coupling hole therein. The coupling hole extends from a surface facing the first dielectric layer to a surface facing the second dielectric layer. The unbalance electrode is disposed on a first side of the first dielectric layer, wherein the first side of the first dielectric layer is a side, distal from the ground electrode, of the first dielectric layer. The balance electrode is disposed on a first side of the second dielectric layer, wherein the first side of the second dielectric layer is a side, distal from the ground electrode, of the second dielectric layer.

A dual-band transform circuit structure includes a first transmission line, a second transmission line, and a conductive layer. The first transmission line has a first input terminal, a first output terminal, and a second output terminal. The second transmission line has a second input terminal, a third input terminal, a third output terminal, and a fourth output terminal. The second input terminal is coupled to the first output terminal, and the third input terminal is coupled to the second output terminal. The conductive layer is stacked with the first transmission and the second transmission line. The conductive layer includes a first hollow pattern. The first hollow pattern and the second transmission line are overlapped in a top view.

The present disclosure is directed to a balun circuit adapted to operate at a frequency of between about 5 GHz to about 110 GHz. The balun circuit includes first and second output striplines and an input stripline formed on a first surface of the substrate, and a slotline formed on a second surface of the substrate opposite the first surface. The slotline has first and second ends, the first end overlapping the first output stripline and the second end overlapping the second output stripline, and the input stripline overlapping the slotline midway between the first end and the second end.

The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a first plate and a second plate that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide.

The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.

The present disclosure is directed to a balun circuit adapted to operate at a frequency of between about 5 GHz to about 110 GHz. The balun circuit includes first and second output striplines and an input stripline formed on a first surface of the substrate, and a slotline formed on a second surface of the substrate opposite the first surface. The slotline has first and second ends, the first end overlapping the first output stripline and the second end overlapping the second output stripline, and the input stripline overlapping the slotline midway between the first end and the second end.

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

Provided is a Marchand balun and a frequency multiplier including the same. The Marchand balun may include transmission lines and slot lines extending to be proximate to the transmission lines. The transmission lines may include feeding transmission lines and coupled transmission lines connected to the feeding transmission lines. The slot lines may include near-distance slot lines provided to be adjacent to the feeding transmission lines, and far-distance slot lines extending in a direction away from the near-distance slot lines. The feeding transmission lines may be provided to be adjacent to the near-distance slot lines.

Disclosed is an antenna including a radiating element, a co-planar ground plane element and a transmission line extending across at least a portion of the radiating element and the ground plane element. The transmission line includes a dielectric layer having a portion of a first major surface adjacent to the ground plane and a second major surface opposite and separated from the first surface. A shield is formed on the second major surface. At least one via extends through the dielectric layer to connect the shield to the ground plane. A feed line extends longitudinally through the dielectric layer from a feed point at a proximal end of the transmission line towards a distal end of the transmission line, the feed line being shielded along a portion of its length extending across the ground plane element by the shield.

The present disclosure provides a microstrip antenna device, which may comprise a center-fed antenna array. Further, the present disclosure provides a radar device, which comprises the antenna device, and a method for fabricating the antenna device. The antenna device comprises a substrate with top and bottom surface, two-dimensional first and second conductive structures, which are arranged adjacent to each other on the top surface, and a two-dimensional third conductive structure, arranged on the bottom surface and providing an electric ground plane. The first conductive structure comprises a first array of antennas and a first feed network, and the second conductive structure comprises a second array of antennas and a second feed network. Further, a slot line is formed in the third conductive structure, for feeding a signal to the first feed network and to the second feed network.