An apparatus includes a signal splitter configured to receive an input signal for transmission and to split the input signal to form two or more sub-signals. The apparatus further includes a first amplifier configured to generate a first amplified sub-signal, a second amplifier configured to generate a second amplified sub-signal, a first launcher coupled to the first amplifier and to a waveguide, and a second launcher coupled to the second amplifier and to the waveguide. The first and second launchers are coupled to the waveguide such that a first radiative signal generated by the first launcher responsive to the first amplified sub-signal and a second radiative signal generated by the second launcher responsive to the second amplified sub-signal are combined in the waveguide to form a transmission signal corresponding to the input signal.

A mechanism is provided to reduce a distance of a waveguide antenna from transmit and receive circuitry in an integrated circuit device die. This distance reduction is performed by providing vertical access to radio frequency connections on a top surface of the IC device die. A cavity in the encapsulant of the package can be formed to provide access to the connections and plated to perform a shielding function. A continuous connection from the RF pads is used as a vertical interconnect. The region around the vertical interconnect can be filled with encapsulant potting material and back grinded to form a surface of the semiconductor device package. A waveguide antenna feed can be plated or printed on the vertical interconnect on the surface of the package.

A mechanism is provided to reduce a distance of a waveguide antenna from transmit and receive circuitry in an integrated circuit device die. This distance reduction is performed by providing vertical access to radio frequency connections on a top surface of the IC device die. A cavity in the encapsulant of the package can be formed to provide access to the connections and plated to perform a shielding function. A continuous connection from the RF pads is used as a vertical interconnect. The region around the vertical interconnect can be filled with encapsulant potting material and back grinded to form a surface of the semiconductor device package. A waveguide antenna feed can be plated or printed on the vertical interconnect on the surface of the package.

A microwave coupling/combining device for coupling and combining at least two microwave sources includes a waveguide provided with a sleeve extending longitudinally along a main axis and having two opposing ends having a first end provided with an element forming a short-circuit and a second open end. The device further includes at least one transverse bar extending inside the sleeve along a transverse axis orthogonal to the main axis; and at least two coaxial connectors provided for being connected respectively to microwave sources. Each coaxial connector is mounted externally on the sleeve and has a central conductive core connected to and extended by a conductive antenna extending in a direction orthogonal to the transverse axis and to the main axis inside the sleeve and ending by an end attached to a transverse bar.

A microwave coupling/combining device for coupling and combining at least two microwave sources includes a waveguide provided with a sleeve extending longitudinally along a main axis and having two opposing ends having a first end provided with an element forming a short-circuit and a second open end. The device further includes at least one transverse bar extending inside the sleeve along a transverse axis orthogonal to the main axis; and at least two coaxial connectors provided for being connected respectively to microwave sources. Each coaxial connector is mounted externally on the sleeve and has a central conductive core connected to and extended by a conductive antenna extending in a direction orthogonal to the transverse axis and to the main axis inside the sleeve and ending by an end attached to a transverse bar.

Embodiments of the invention include a mm-wave waveguide connector and methods of forming such devices. In an embodiment the mm-wave waveguide connector may include a plurality of mm-wave launcher portions, and a plurality of ridge based mm-wave filter portions each communicatively coupled to one of the mm-wave launcher portions. In an embodiment, the ridge based mm-wave filter portions each include a plurality of protrusions that define one or more resonant cavities. Additional embodiments may include a multiplexer portion communicatively coupled to the plurality of ridge based mm-wave filter portions and communicative coupled to a mm-wave waveguide bundle. In an embodiment the plurality of protrusions define resonant cavities with openings between 0.5 mm and 2.0 mm, the plurality of protrusions are spaced apart from each other by a spacing between 0.5 mm and 2.0 mm, and wherein the plurality of protrusions have a thickness between 200 μm and 1,000 μm.

Aspects of the subject disclosure may include, a system that facilitates receiving a first electromagnetic wave propagating along a transmission medium, detecting, according to the first electromagnetic wave, an obstruction on a first portion of an outer surface of the transmission medium, responsive to the detecting the obstruction, configuring a material to have similar properties to the obstruction, the material being positioned along a second portion of the outer surface of the transmission medium, and generating a second electromagnetic wave that propagates along the transmission medium without relying on an electrical return path to facilitate propagation of the second electromagnetic wave along the transmission medium, the material facilitating propagation of the second electromagnetic wave from the second portion of the outer surface of the transmission medium to the first portion of the transmission medium affected by the obstruction. Other embodiments are disclosed.

Aspects of the subject disclosure may include, a system that facilitates receiving a first electromagnetic wave propagating along a transmission medium, detecting, according to the first electromagnetic wave, an obstruction on a first portion of an outer surface of the transmission medium, responsive to the detecting the obstruction, configuring a material to have similar properties to the obstruction, the material being positioned along a second portion of the outer surface of the transmission medium, and generating a second electromagnetic wave that propagates along the transmission medium without relying on an electrical return path to facilitate propagation of the second electromagnetic wave along the transmission medium, the material facilitating propagation of the second electromagnetic wave from the second portion of the outer surface of the transmission medium to the first portion of the transmission medium affected by the obstruction. Other embodiments are disclosed.

A circuit structure includes a substrate integrated waveguide, a substrate disposed on the substrate integrated waveguide, a waveguide signal feeding element and a ring-shaped conductive element. The substrate integrated waveguide includes another substrate having a waveguide transmitting region, two conductive layers disposed on this substrate and covering the waveguide transmitting region, and at least one waveguide conductive element passing through this substrate and electrically connected to the two conductive layers. The at least one waveguide conductive element surrounds the waveguide transmitting region. One of the conductive layers is located between the two substrates. The waveguide signal feeding element passes through one substrate and one conductive layer between the substrates, and the waveguide signal feeding element extends to the waveguide transmitting region. The waveguide signal feeding element is electrically insulated from one conductive layer. The ring-shaped conductive element is disposed in one substrate and surrounds the waveguide signal feeding element.

A transmission line includes a post-wall waveguide which includes a dielectric substrate on which a pair of post-walls is formed and a first conductor layer and a second conductor layer opposed to each other with the dielectric substrate interposed therebetween, and in which a region surrounded by the pair of post-walls, the first conductor layer, and the second conductor layer is a waveguide region, a waveguide tube having a hollow rectangular shape, being connected with the first conductor layer to cover an opening portion formed in a side wall, and in which an inside communicates with the waveguide region through an opening formed in the first conductor layer, a blind via formed in the dielectric substrate such that one end is disposed inside the opening, and a pole member including a post member connected to the one end of the blind via and a support member supporting the post member.