A microwave transmission arrangement, comprising an electrically conductive hollow waveguide having a first waveguide portion, a second waveguide portion between the first waveguide portion and a first end of the hollow waveguide, and a conductive transition surface of the hollow waveguide forming a transition between the first waveguide portion and the second waveguide portion; and a microwave circuit board including a dielectric carrier, and a first conductor pattern on a first side of the dielectric carrier, the first conductor pattern including a patch for radiating or receiving microwave signals in the predefined wavelength range, and a first ground plane surrounding the patch, wherein the first ground plane of the microwave circuit board is in conductive contact with the first end of the hollow waveguide, and extends into the second waveguide portion cross-section area to define at least one conductive pocket together with the second waveguide portion and the transition surface of the hollow waveguide.

A microwave transmission arrangement, comprising an electrically conductive hollow waveguide having a first waveguide portion, a second waveguide portion between the first waveguide portion and a first end of the hollow waveguide, and a conductive transition surface of the hollow waveguide forming a transition between the first waveguide portion and the second waveguide portion; and a microwave circuit board including a dielectric carrier, and a first conductor pattern on a first side of the dielectric carrier, the first conductor pattern including a patch for radiating or receiving microwave signals in the predefined wavelength range, and a first ground plane surrounding the patch, wherein the first ground plane of the microwave circuit board is in conductive contact with the first end of the hollow waveguide, and extends into the second waveguide portion cross-section area to define at least one conductive pocket together with the second waveguide portion and the transition surface of the hollow waveguide.

A microcircuit integrating a waveguide with a rectangular cross-section, the microcircuit including a first chip and a second chip assembled on each other, the waveguide being located in a junction zone between chips and extending in parallel to the chips, the waveguide including a first conductive plate located on the side of the first chip and parallel to the first chip, and a second conductive plate, located on the side of the second chip and parallel to the second chip, the waveguide being laterally delimited on one and the other side of the waveguide by one or more electrical connecting elements electrically connecting the first chip to the second chip.

A microcircuit integrating a waveguide with a rectangular cross-section, the microcircuit including a first chip and a second chip assembled on each other, the waveguide being located in a junction zone between chips and extending in parallel to the chips, the waveguide including a first conductive plate located on the side of the first chip and parallel to the first chip, and a second conductive plate, located on the side of the second chip and parallel to the second chip, the waveguide being laterally delimited on one and the other side of the waveguide by one or more electrical connecting elements electrically connecting the first chip to the second chip.

A waveguide microstrip line converter includes: a waveguide; a dielectric substrate; a ground conductor provided with a slot; a line conductor; and a conductor located at a distance from the line conductor and adjacent to the line conductor. The line conductor includes a microstrip line, a conversion unit, a first impedance transforming unit, a second impedance transforming unit, and a third impedance transforming unit, the microstrip line having a first line width, the conversion unit being located immediately above the slot and having a second line width larger than the first line width, the first impedance transforming unit, the second impedance transforming unit, and the third impedance transforming unit extending in a first direction from the conversion unit and having a role in impedance matching between the microstrip line and the conversion unit. The conductor is adjacent to at least part of the conversion unit of the line conductor.

A waveguide microstrip line converter includes: a waveguide; a dielectric substrate; a ground conductor provided with a slot; a line conductor; and a conductor located at a distance from the line conductor and adjacent to the line conductor. The line conductor includes a microstrip line, a conversion unit, a first impedance transforming unit, a second impedance transforming unit, and a third impedance transforming unit, the microstrip line having a first line width, the conversion unit being located immediately above the slot and having a second line width larger than the first line width, the first impedance transforming unit, the second impedance transforming unit, and the third impedance transforming unit extending in a first direction from the conversion unit and having a role in impedance matching between the microstrip line and the conversion unit. The conductor is adjacent to at least part of the conversion unit of the line conductor.

The present description concerns an electromagnetic wave transmit/receive device comprising a multilayer organic substrate, an integrated circuit chip, flip-chip assembled on the multilayer organic substrate, a package comprising a first cavity, containing the multilayer organic substrate and the integrated circuit chip, and communicating over a channel with a second cavity forming a waveguide for electromagnetic waves.

An electromagnetic device includes: a first electromagnetic, EM, signal feed; a second EM signal feed disposed adjacent to the first EM signal feed; and, an elevated electrically conductive region disposed between and elevated relative to the first and second EM signal feeds.

A probe apparatus of a millimeter or submillimeter radio frequency band comprises transition layers having outermost layers on opposite surfaces of the probe apparatus. An internal transition cavity extends through the transition layers for guiding electromagnetic radiation within the probe apparatus. A probe layer disposed between the transition layers, the probe layer having a lateral transmission line for interacting with the electromagnetic radiation guided by the internal transmission cavity.

A probe apparatus of a millimeter or submillimeter radio frequency band comprises transition layers having outermost layers on opposite surfaces of the probe apparatus. An internal transition cavity extends through the transition layers for guiding electromagnetic radiation within the probe apparatus. A probe layer disposed between the transition layers, the probe layer having a lateral transmission line for interacting with the electromagnetic radiation guided by the internal transmission cavity.