This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.

This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.

This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.

A transition structure between a transmission line of a multilayer PCB and a waveguide is proposed. The transition structure includes the waveguide comprising an interior space on one side thereof and having an inlet for accommodating a part of a stripline, the transmission line comprising a first ground layer of the multilayer PCB composed of at least two or more dielectric layers, the stripline extending from the transmission line and protruding into the waveguide through the inlet of the waveguide, and a single via hole or a plurality of via holes formed between the first ground layer and a bottommost ground layer, wherein each via hole is positioned at the inlet of the waveguide.

A transition structure between a transmission line of a multilayer PCB and a waveguide is proposed. The transition structure includes the waveguide comprising an interior space on one side thereof and having an inlet for accommodating a part of a stripline, the transmission line comprising a first ground layer of the multilayer PCB composed of at least two or more dielectric layers, the stripline extending from the transmission line and protruding into the waveguide through the inlet of the waveguide, and a single via hole or a plurality of via holes formed between the first ground layer and a bottommost ground layer, wherein each via hole is positioned at the inlet of the waveguide.

The present application discloses embodiments that relate to an electromagnetic apparatus. In one aspect, the present apparatus includes a circuit board configured to propagate an electromagnetic signal. The apparatus also includes a waveguide configured to propagate an electromagnetic signal. The apparatus further includes a coupling port configured to couple a signal between the circuit board and the waveguide, where the coupling port has dimensions based on a desired impedance of the port.

The present application discloses embodiments that relate to an electromagnetic apparatus. In one aspect, the present apparatus includes a circuit board configured to propagate an electromagnetic signal. The apparatus also includes a waveguide configured to propagate an electromagnetic signal. The apparatus further includes a coupling port configured to couple a signal between the circuit board and the waveguide, where the coupling port has dimensions based on a desired impedance of the port.

One example includes an antenna-on-package (AoP) system. The system includes a first transmission line patterned on a first metal layer. The first metal layer can be arranged to be coupled on a printed circuit board (PCB). The system also includes an antenna portion patterned on a second metal layer. The first and second metal layers can be separated by at least one dielectric layer. The system further includes a coaxial transition portion comprising a via configured to communicatively couple the first transmission line on the first metal layer to a second transmission line on the second metal layer. The second transmission line can be coupled to the antenna portion.

A signal transmitting device is configured to transmit a radio frequency signal outputted from a chip. The signal transmitting device includes a substrate and a connecter. The substrate is coupled to the chip. The substrate includes a waveguide, and the waveguide is configured to transmit the radio frequency signal along a first direction. The connecter is coupled to the substrate and configured to extract the radio frequency signal from the substrate to transmit the same along a second direction. The second direction is perpendicular to the substrate.

The present invention relates to a metalized waveguide interface (1) for providing a galvanically isolated waveguide connection for a propagating signal, between a standardized waveguide (2) and a, to the standardized waveguide non-compatible, metalized chip-level waveguide (3). The metalized waveguide interface (1) is configured such that a first open-ended quarter wavelength waveguide (31) and a second open-ended quarter wavelength waveguide (32) is obtained along the directions d1 and d2, respectively, when the metalized chip-level waveguide (3) is mounted on the support surface (5). The interface is further configured such that third open-ended quarter wavelength waveguide (33) is obtained between the third surface portion (9) and the metalized chip-level waveguide (3) when the metalized chip-level waveguide (3) is mounted on the support surface (5). The interface (1) further comprises a trench such that a short-circuit half wavelength waveguide (34) is obtained when the metalized chip-level waveguide (3) is mounted on the support surface (5).