A radio frequency (RF) waveguide housing includes a metal-diamond base with a first surface and a second surface opposite the first surface. The metal-diamond base includes an opening through a thickness of the metal-diamond base, and the opening includes a first side on a side of the first surface of the metal-diamond base and a second side on a side of the second surface of the metal-diamond base. The RF waveguide housing also includes an insert to be inserted in the opening and affixed to the metal-diamond base. The insert defines an interior volume within the opening of the metal-diamond base and a shape of the insert at the first side of the opening is configured to match an end of an RF waveguide coupled to the RF waveguide housing.

Embodiments relate to systems, methods, and computer-readable media to enable a wireless communication device. In one embodiment a wireless communication device is configured to radiate a millimeter wave signal through a circular waveguide. A patch antenna is resonated in a Transverse Magnetic 1-0 (TM10) operating mode and electrically couples to an open end of the circular waveguide. The electric field pattern of the patch antenna is such that the millimeter wave signal is launched into the waveguide propagating in a Transverse Electric 1-1 (TE11) mode. In other embodiments, various other configurations may be used as described herein.

A solidstate amplifier includes at least one interconnection, between a microstrip and a linearized impedance matching waveguide ridge, the interconnection being provided with a clamping device.

This document describes techniques, apparatuses, and systems utilizing a high-isolation transition design for differential signal ports. A differential input transition structure includes a first layer and a second layer made of a conductive metal and a substrate positioned between the first and second layers. The second layer includes a first section that electrically connects to a single-ended signal contact point and to a first contact point of a differential signal port. The first section includes a first stub based on an input impedance of the single-ended signal contact point and a second stub based on a differential input impedance associated with the differential signal port. The second layer includes a second section that electrically connects to a second contact point of the differential signal port and to the first layer through a via housed in a pad. The second section includes a third stub associated with the differential input impedance.

An integrated slot waveguide antenna array for a radar system. The antenna array may include substrate integrated waveguide (SIW) elements, transmit, receive and processing electronics in a lightweight, low-cost, highly integrated package. The combination of antenna layout, specific dimensions of SIW features, including vias, terminal edges and slot placement may allow an efficient transmit and receive radar pattern as well as consistent, reliable and low cost manufacturing.

In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

A coaxial waveguide conversion device according to the present invention includes a first member; a second member provided so as to be opposed to the first member; and a conductor plate provided so as to be sandwiched between the first member and the second member. A waveguide is formed in the first member and the second member to a depth that penetrates the first member and does not penetrate the second member. The conductor plate includes an opening having a shape corresponding to a shape of an aperture plane of the waveguide; a conductor surface portion provided around the opening; an antenna portion; a waveguide short-circuit portion connecting the antenna portion with the conductor surface portion; a coaxial wiring portion provided at one end of the antenna portion; and a coaxial line short-circuit portion connecting another end of the antenna portion with the conductor surface portion.

A coaxial waveguide conversion device according to the present invention includes a first member; a second member provided so as to be opposed to the first member; and a conductor plate provided so as to be sandwiched between the first member and the second member. A waveguide is formed in the first member and the second member to a depth that penetrates the first member and does not penetrate the second member. The conductor plate includes an opening having a shape corresponding to a shape of an aperture plane of the waveguide; a conductor surface portion provided around the opening; an antenna portion; a waveguide short-circuit portion connecting the antenna portion with the conductor surface portion; a coaxial wiring portion provided at one end of the antenna portion; and a coaxial line short-circuit portion connecting another end of the antenna portion with the conductor surface portion.

This document describes a twin line fed dipole array antenna that may be coupled to several different types of feed networks in a space-efficient manner. The antenna makes use of a twin line feed to a plurality of dipoles that minimizes cross-polarization. The antenna may be manufactured on a printed circuit board (PCB) and has a centered feed slot that is easily coupled to several different types of waveguides or a microstrip. In some implementations, the dipole elements may have an approximately rectangular shape. In other implementations, the dipole elements may have an approximately bowtie shape, round shape, oval shape, C-shape, or L-shape. The size and placement of the dipole elements may be optimized for certain operating frequencies of the radar system to which the antenna is coupled.