Patent classifications
H01P5/18
Electronically tuned RF termination
Systems and methods for a tunable impedance are provided. A tunable impedance includes a transistor assembly having two terminals and a control input. The transistor assembly includes one or more transistors electrically connected between the two terminals to provide a first impedance between the two terminals, based upon a control signal. One or more replica transistors react to the control signal in a similar fashion as the transistor assembly, to provide a replica impedance based upon the control signal. A control circuit is configured to generate the control signal based upon a voltage across the replica transistor(s) and/or a current through the replica transistor(s).
Coupling device and antenna
A coupling device includes a plurality of couplers, a first coupled output port and a second coupled output port, wherein the plurality of couplers comprise a first coupler and a second coupler that are adjacent one another, and each of the first coupler and the second coupler comprises a main line and a subline, and for each of the first coupler and the second coupler: the subline includes a first section, a second section, and a third section, wherein the second section of the subline of the first coupler has a common segment with the first section of the subline of the second coupler.
STRUCTURAL ARRANGEMENTS FOR SPATIAL POWER-COMBINING DEVICES
Power-combining devices, and more particularly spatial power-combining and related structural arrangements are disclosed. Such structural arrangements involve mechanical connections between center waveguide sections and input and/or output coaxial waveguide sections that provide scalable structures for different operating frequency bands, improved mechanical connections, and/or improved assembly. Exemplary structural arrangements include structures that extend through center waveguide sections and into input and/or output coaxial waveguide sections, integrated mechanical structures within the center waveguide section, compression fit arrangements, dielectric inserts arranged within channels of coaxial waveguide sections, and/or various combinations thereof.
Directional coupler
A directional coupler (2) includes a main line (11), a sub-line (12), a variable terminator (13), and a variable filter circuit (15). The variable terminator (13) is a variable impedance circuit that terminates one end portion of the sub-line (12). The variable filter circuit (15) is connected to the other end portion of the sub-line (12). The variable filter circuit (15) may include a filter, a bypass path, and a switch which is connected to at least one of the filter and the bypass path.
Directional coupler
A directional coupler (2) includes a main line (11), a sub-line (12), a variable terminator (13), and a variable filter circuit (15). The variable terminator (13) is a variable impedance circuit that terminates one end portion of the sub-line (12). The variable filter circuit (15) is connected to the other end portion of the sub-line (12). The variable filter circuit (15) may include a filter, a bypass path, and a switch which is connected to at least one of the filter and the bypass path.
Directional coupler
The invention relates to a directional coupler comprising a non-straight main conductor line for receiving a high power signal and at least one coupling element. The main conductor line is arranged to run in a plane P.sub.0. The at least one coupling element is arranged sectionally parallel to the main conductor line. Further, the invention relates to a method for measuring RF voltage and/or RF power using a directional coupler. The method comprises the steps of combining the measured signals of the directional coupler and the measured voltage and current values of the VI sensor unit. In case, one of the measured signals has a low or zero level the sensitivity of the measuring of RF voltage and/or RF power is increased.
DIRECTIONAL COUPLER, HIGH-FREQUENCY MODULE, AND COMMUNICATION DEVICE
A directional coupler includes a main line, sub lines, and a multilayer substrate. The multilayer substrate includes dielectric layers. The multilayer substrate has a first and a second principal surface. The main line, the first, second, and third sub lines are each formed in a looped shape in plan view from a thickness direction of the multilayer substrate, and are provided to different dielectric layers among the dielectric layers. The first, second, and third sub lines have first distances different from each other. Among the first, second sub line, and third sub lines, the longest sub line having the longest first distance and the shortest sub line having the shortest first distance are disposed on the first principal surface of the main line, and the intermediate sub line having the intermediate first distance is disposed on the second principal surface of the main line.
Reconfigurable quadrature coupler
A reconfigurable quadrature coupler is disclosed. The reconfigurable quadrature coupler includes an input port transmission line connected to a first port, a coupled port transmission line and a coupled port transformer connected between the coupled port transmission line and a second port. The coupled port transformer is configured to have a selectable second port reflection coefficient. The reconfigurable quadrature coupler further includes an isolation port transmission line and an isolation port transformer connected between the isolation transmission line and a third port. The isolation port transformer is configured to have a selectable third port reflection coefficient. Also included is a through port transmission line and a through port transformer connected between the through port transmission line and a fourth port. The through port transformer is configured to have a selectable fourth port reflection coefficient.
MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE
Embodiments described herein may be related to apparatuses, processes, and techniques related creating millimeter wave components within a glass core of a substrate within a semiconductor package. These millimeter wave components, which include resonators, isolators, directional couplers, and circulators, may be combined to form other structures such as filters or multiplexers. Other embodiments may be described and/or claimed.
ON-CHIP DIRECTIONAL COUPLER
An on-chip directional coupler includes a first linear conductive trace, a second linear conductive trace, and a conductive loop. The first linear conductive trace including an end and a coupled port. The second linear conductive trace is spaced apart from and parallel to the first linear conductive trace. The second linear conductive trace includes an end and an isolated port. The conductive loop includes a first end conductively coupled to the end of the first linear conductive trace, and a second end conductively coupled to the end of the second linear conductive trace.