A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

A radio frequency antenna system is provided and can include a radio printed circuit board, a first antenna element located proximate an edge of the radio printed circuit board, a second antenna element located proximate the edge of the radio printed circuit board, and a cancelation circuit located on the radio printed circuit board and connected to feeding points of the first antenna and the second antenna, wherein the cancelation circuit can provide a cancelation effect at output ports of the cancelation circuit with respect to signals broadcast by the first antenna element and the second antenna element over air.

A single-layer Wide Angle Impedance Matching (WAIM) and method for using the same are described. In one embodiment, the antenna comprises: an aperture having a plurality of antenna elements operable to radiating radio-frequency (RF) energy; and a single-layer wide angle impedance matching (WAIM) structure coupled to the aperture to provide impedance matching between the antenna aperture and free space.

Aspects of the subject disclosure may include, for example, obtaining data regarding interference detected in a received communication signal, and performing polarization adjusting for one or more orthogonally-polarized element pairs of an antenna system such that an impact of the interference on the antenna system is minimized. Other embodiments are disclosed.

The present disclosure relates to an antenna element comprising a lower conducting plane, an upper conducting plane and an upper dielectric layer structure that is positioned between the conducting planes. The upper dielectric layer structure comprises a plurality of conducting vias that electrically connect the conducting planes to each other and circumvent an upper radiating patch formed in, below or above the upper conducting plane. The conducting vias circumvent at least one intermediate radiating patch that is formed in the upper dielectric layer structure, and a lowest intermediate radiating patch that is closest to the lower conducting plane is connected to a feed arrangement that comprises at least one feeding probe that extends via a corresponding aperture in the lower conducting plane and is electrically connected to the lowest intermediate radiating patch.

An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.

An antenna includes: a first antenna portion and a second antenna portion arranged adjacently. The first antenna portion includes a first antenna branch and a first parasitic branch, and the second antenna portion includes a second antenna branch. The first parasitic branch is positioned between the first antenna branch and the second antenna branch. The first parasitic branch is L-shaped, and includes a first branch segment and a second branch segment. A first end of the first branch segment is in contact to a ground region, a second end of the first branch segment is joined to a first end of the second branch segment, and a second end of the second branch segment points towards the second antenna branch.

An antenna module includes a first antenna layer, including at least one main radiation unit including at least two main radiation patches symmetrically arranged and spaced apart from each other and at least one feeder portion located at or corresponds to a gap between adjacent two of the main radiation patches; a second antenna layer, stacked with the first antenna layer and including a reference ground arranged opposite to the main radiation patches and at least one microstrip insulated from the reference ground; at least one first electrically conductive member, electrically connected to the main radiation patches and the reference ground; and at least one second electrically conductive member, with an end being electrically connected to the feeder portion and another end being electrically connected to another end of the microstrip. An end of the microstrip is electrically connected to a radio frequency transceiver chip.

A multiband antenna, having a reflector, and a first array of first radiating elements having a first operational frequency band, the first radiating elements being a plurality of dipole arms, each dipole arm including a plurality of conductive segments coupled in series by a plurality of inductive elements; and a second array of second radiating elements having a second operational frequency band, wherein the plurality of conductive segments each have a length less than one-half wavelength at the second operational frequency band.

The present disclosure relates to an antenna element (1) comprising a lower conducting plane (2), an upper conducting plane (3) and an upper dielectric layer structure (4) that is positioned between the conducting planes (2, 3). The upper dielectric layer structure (4) comprises a plurality of conducting vias (5) that electrically connect the conducting planes (2, 3) to each other and circumvent an upper radiating patch (6) formed in, below or above the upper conducting plane (3). The conducting vias (5) circumvent at least one intermediate radiating patch (7, 8) that is formed in the upper dielectric layer structure (4), and a lowest intermediate radiating patch (7) that is closest to the lower conducting plane (2) is connected to a feed arrangement (9, 10) that comprises at least one feeding probe (9, 10) that extends via a corresponding aperture (13) in the lower conducting plane (2) and is electrically connected to the lowest intermediate radiating patch (7).